JP2008030072A - Alip type flow soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that an ALIP type electromagnetic pump of a flow passage inversion type has large flow loss in an area in which the flowing direction of a molten solder is inverted from a thrust generating flow passage to an inversion flow passage, and very small fluctuation in the discharging force is generated to vary the soldering quality. <P>SOLUTION: An area where any external core or any coil 31 for generating the moving magnetic field is not provided and any internal core 33 is not provided is formed at the position at which the feed flow passage is inverted and shifted from a thrust generating flow passage 35 to an inversion flow passage 37 in an electromagnetic pump 30, and a pressure chamber 36 is formed in which the feed flow rate therein is lower than that in the thrust generating flow passage and the inversion flow passage. A chamber body 9 having a diffusion chamber 10 for rapidly reducing the discharging flow rate is connected to a discharge port 38 of the internal core 33 having the inversion flow passage 37 formed therein, and a blower body 16 is provided on the chamber body 9. A high-pass fluctuation removing filter for absorbing fluctuation of short cycle period out of very small fluctuation in the flow rate of a molten solder is formed of the thrust generating flow passage 35, the pressure chamber 36, the inversion flow passage 37, and the diffusion chamber 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flow soldering apparatus that performs soldering by supplying molten solder to a soldered portion of a printed wiring board, and particularly relates to a flow soldering apparatus that uses an induction electromagnetic pump.

  The flow soldering equipment using an induction type electromagnetic pump has extremely good reproducibility and stability of the parameters for feeding molten solder while being able to stably maintain the molten solder jet state. It has the feature that mounting is possible and stable soldering quality can be obtained.

  Electromagnetic pumps (LEPs) that generate thrust by directly applying electromagnetic force to the medium to be delivered, which are used as pump discharge force and suction force, are roughly classified into induction types. And conduction type. In general, there are many examples in which an induction type that does not require energization of a medium to be fed is used.

  Furthermore, the induction type electromagnetic pump is roughly classified into a flat linear type (FLIP type), an annular linear type (ALIP type) and an helical type (HIP type: helical induction pump). Each has a unique configuration.

  As a technique of a flow soldering apparatus using an ALIP type electromagnetic pump, there is a technique of Patent Document 1. This technology is configured by sealing one end of an ALIP type electromagnetic pump and providing an inversion channel in the inner core, and the direction of the molten solder supplied by thrust in the thrust generation channel is sealed. Inverted at the toe and fed to the reversing flow path, the molten solder feeding direction in the thrust generating flow path is opposite to the molten solder feeding direction flowing in the reversing flow path provided in the inner core. Become a direction. And the suction port of a thrust generation flow path and the discharge port of a reverse flow path can be provided in the same side.

The technique disclosed in Patent Document 1 has a feature that maintenance work of the electromagnetic pump can be particularly easily performed because the ALIP type electromagnetic pump is located outside the solder tank. In addition, the volume of the solder bath can be reduced. As an example of a standard ALIP type electromagnetic pump, Patent Document 2 is a reference.
JP 2005-205479 A JP-A-5-260719

  In the technique of Patent Document 1, the flow loss in the region where the flow direction of the molten solder is reversed from the sealed end of the ALIP type electromagnetic pump, that is, the thrust generation flow path to the reversal flow path of the inner core is large. A minute fluctuation appears as a minute fluctuation in the discharge force of the electromagnetic pump, that is, the discharge force from the reversing flow path provided in the inner core.

  The minute fluctuation of the discharge force is much smaller than the fluctuation of the discharge force by the conventional rotary pump, but it becomes an obstacle to fully draw out the advantages of the electromagnetic pump with constant thrust. . That is, the fine fluctuation of the discharge force fluctuates the shape of the jet wave of the molten solder, and this fluctuation fluctuates the supply pressure of the molten solder to the printed wiring board, which causes the soldering quality to fluctuate.

  In recent years, it has been found that short-period fluctuations among the fine fluctuations in the ejection force cause a partial deterioration in soldering quality in one printed wiring board. Was demanded.

  The present invention realizes an ALIP-type flow soldering device that reduces flow loss in an electromagnetic pump and absorbs minute fluctuations in discharge force, thereby forming a jet wave that is more stable than conventional methods and high soldering. The purpose is to maintain stable quality.

  In the present invention, an annular linear induction pump (ALIP type) electromagnetic pump is provided with a pressure chamber at a position where the feeding direction of molten solder is reversed and a large volume diffusion chamber is provided at the discharge port of the electromagnetic pump. It is characterized in that it is configured to reduce flow loss when feeding molten solder and absorb minute fluctuations in discharge force.

(1) In a flow soldering apparatus in which an annular linear type (ALIP type) electromagnetic pump is provided on the tank wall of the solder tank, the annular linear type (ALIP type) electromagnetic pump seals one end of the thrust pipe and caps it. A thrust generating flow path is formed between the thrust pipe and the inner core by providing a reversal flow path along the axis of the inner core inserted inside the thrust pipe together with the shape, and this thrust It is configured as a reverse flow type annular linear induction pump (R-ALIP type) electromagnetic pump in which a supply flow path is formed by the generation flow path and the reversal flow path, and the thrust pipe is soldered In addition to being provided on the side wall of the tank, an outer core and a coil for generating a moving magnetic field are provided around the thrust pipe.

  The thrust pipe has a region where the external core and the moving magnetic field generating coil are not provided at a position where the feed flow path from the thrust generation flow path to the reversal flow path is reversed, and in the thrust pipe. A region in which the inner core is not provided is provided to form a pressure chamber in which the feed flow rate is lower than the feed flow rate in the thrust generation flow channel and the feed flow rate in the reverse flow channel.

  Further, a chamber body provided with a diffusion chamber for rapidly decreasing the discharge flow rate is connected to the discharge port of the inner core in which the reverse flow path is formed, and a jet wave of molten solder is formed in the chamber body. A blower body is provided.

  That is, an ALIP in which a high-frequency fluctuation removal filter that absorbs a short cycle fluctuation among fine fluctuations in the flow rate of molten solder is formed by the thrust generation flow path, the pressure chamber, the reversal flow path, and the diffusion chamber. This is a mold flow soldering apparatus.

  Thereby, the flow loss generated when molten solder is fed from the thrust generation flow path to the reversal flow path is reduced. Therefore, the efficiency of the whole electromagnetic pump is also improved. In addition, the thrust generation flow path and the reversal flow path each act as a flow inductance, and the pressure chamber of the thrust pipe and the diffusion chamber of the chamber body each act as a flow capacitance. Is formed, and high-frequency fluctuations among the fine fluctuations in the ejection force are removed, and a jet wave having a stable shape can be formed.

(2) In the ALIP type flow soldering apparatus according to (1), the length of the pressure chamber in the longitudinal section of the thrust pipe with reference to the feeding direction in the electromagnetic pump is longer than the inner diameter of the thrust pipe, and the chamber body The flow rate of the molten solder in the diffusion chamber is configured to be provided in a cross-sectional area where the flow rate is reduced to 1/10 or less of the flow rate in the reverse flow path.

  Thus, by configuring the length of the pressure chamber to be longer than the inner diameter of the thrust pipe, it is possible to reduce the flow loss when the flow of the melt reversal flow path is reversed from the thrust generation flow path to the reversal flow path. . That is, the reversal of the flow direction from the thrust generation flow path to the reversal flow path is performed using the molten solder pressure in the pressure chamber as a medium, and flow loss can be reduced.

  Further, in the ALIP type electromagnetic pump, the thrust generation flow path and the reverse flow path whose longitudinal section is longer than the length in the transverse section with respect to the thrust direction act as inductance when viewed from the molten solder to be fed. In addition, the pressure chamber of the thrust pipe and the diffusion chamber of the chamber body, where the feeding flow rate is rapidly reduced, act as capacitance.

  Therefore, the molten solder fed with the thrust generation flow path → pressure chamber → reversal flow path → diffusion chamber is a high-frequency attenuation that filters and absorbs short-cycle components of fluctuations in flow velocity and pressure, that is, high-frequency components. Acts as a filter. Therefore, the high-frequency fluctuation among the fine fluctuations of the discharge force can be reliably removed, and a jet wave having a stable shape can be formed.

  According to the present invention, by realizing an ALIP type flow soldering apparatus that reduces flow loss in an electromagnetic pump and absorbs minute fluctuations in discharge force, the efficiency of the electromagnetic pump is good and more stable than before. A jet wave can be formed.

  As a result, the soldering quality of each part of the printed wiring board becomes uniform and stable, and high soldering quality can be maintained.

  A configuration example of an ALIP type flow soldering apparatus according to the present invention will be described with reference to FIGS. FIG. 1 is a diagram for explaining the overall configuration of an ALIP type flow soldering apparatus, in which a solder bath portion is shown in a longitudinal section, and a configuration of a control system is shown in a block diagram. FIG. 2 is a perspective view for explaining the entire contents of the ALIP type flow soldering apparatus. FIG. 2A shows an example in which an ALIP type electromagnetic pump is provided on the side of the blower body, and FIG. ) Shows an example in which an ALIP type electromagnetic pump is provided on the front (or rear) side of the blower body. Further, FIG. 3 is an exploded perspective view of the ALIP type electromagnetic pump used in the present invention, a thrust pipe provided in the solder bath, an internal core inserted into the thrust pipe, and an external provided detachably in the thrust pipe. The insertion / extraction relationship of the core and the coil for moving magnetic field generation is shown.

(1) Configuration Example First, before describing the configuration of the ALIP type flow soldering apparatus of the present invention, a method for heating solder in a solder bath will be described.

  That is, the solder tank is provided with a heater along the tank bottom and the tank wall, and is configured to heat and melt the solder accommodated in the solder tank and maintain it at a target temperature. The temperature of the solder is controlled by a temperature control device, and the temperature control device refers to the temperature detection result of the temperature sensor, and controls the power supplied to the heater so that the temperature of the solder becomes a predesignated temperature. It is a mechanism to do.

  A specific configuration will be described. The method for heating the solder (including molten solder) 5 illustrated in FIG. 1 is called a direct heating method because the solder directly touches the sheathed heater 6. In this method, a heater 6 is provided along the bottom of the solder tank 1, the solder is heated and melted by the heater 6, the temperature of the heated solder is detected by the temperature sensor 7, and the detection result is obtained. With reference to the temperature control device 8, the power supplied to the heater 6 is controlled to keep the solder temperature at a predesignated temperature. On the other hand, as illustrated in FIG. 6, the method in which the solder does not touch the sheathed heater 22 and the solder is heated through the solder bath is called an indirect heating method. Of course, this indirect heating method may be used in the configuration example of the present invention shown in FIG.

  6 (a) and 6 (b) are diagrams illustrating a pump, a chamber body, a blower body, and the like, which will be described later, provided in the solder bath, and corresponding to the cross section of FIG. The normally used sheathed heater has a circular cross section, but the sheathed heater used for indirect heating has a polygonal cross section (triangular in the example of FIG. 6). The triangular sheathed heater is manufactured by molding in a caging process (a process of compressing and extending) in the manufacturing process.

  When the surface of the triangular sheathed heater is brought into surface contact with the outer wall surface of the solder bath during installation, the heat energy generated by the sheathed heater can be effectively conducted to the solder bath, and the solder is heated. The power efficiency of can be greatly improved. In the example shown in FIG. 6A, the sheathed heater 22 is brought into surface contact with the flat wall surface of the solder tank 1 and fixed by the pressing plate 23 and the screw 24. However, as shown in FIG. Alternatively, a groove portion 25 may be provided in the solder bath, and the groove portion 25 may be brought into surface contact with the groove portion 25 so that the triangular sheathed heater 22 is fitted and fixed by the pressing plate 22 and the screw 23.

  An ALIP type flow soldering apparatus according to the present invention will be described with reference to FIG. 1 in the case of a solder bath using the direct heating method.

  In this apparatus, the thrust pipe 32 of the ALIP type electromagnetic pump 30 is provided in the thrust pipe mounting hole 3 on the side wall 2 of the solder tank 1 by welding, screwing or other means, and the thrust pipe 32 is inverted to its central axis. A pipe-shaped inner core 33 provided with a flow path 37 is inserted so as to be insertable / removable, and the reversal flow path 37 of the internal core 33 and the chamber body 9 are connected to each other. The position where the thrust pipe 32 is provided in the solder bath 1 may be on the side of the blower body as shown in FIG. 2 (a), or the front part of the blower body as shown in FIG. 2 (b). It may be the side or the rear side.

  Next, the configuration of the ALIP type electromagnetic pump used in the present invention will be described with reference to FIGS.

  On the outside of the thrust pipe 32, a driving body 31 in which an outer core for generating a moving magnetic field and a moving magnetic field generating coil are formed integrally with the inner core 33 is rotatably and insertable. As a result, a thrust generation flow path 35 is formed between the thrust pipe 32 and the inner core 33, and the molten solder fed from this flow path is supplied to the chamber body 9 through the reverse flow path 37 of the inner core 33. Is done. The ALIP type electromagnetic pump having this configuration is referred to as a flow inversion type annular linear induction pump (R-ALIP type) electromagnetic pump.

  A pressure chamber 36 is provided in the thrust pipe at a position where the flowing direction of the molten solder is reversed from the thrust generation flow path 35 to the reversal flow path 37. There is no internal core in the pressure chamber 36 and the pressure chamber 36 is outside the pressure chamber. There is no external core or coil for generating a moving magnetic field. The length in the longitudinal section of the pressure chamber 36, that is, the length in the thrust direction of the electromagnetic pump is configured to be longer than the inner diameter of the thrust pipe 32. As a result, the average value of the flow rate of the molten solder in the pressure chamber 36 is more than twice slower than the flow rate of the molten solder flowing through the thrust generation flow path 35 and the reversal flow path 37, and the flow loss of the molten solder is reduced. Is done. If the length in the longitudinal section of the pressure chamber 36 is configured to be shorter than the inner diameter of the thrust pipe 32, the average value of the flow velocity in the pressure chamber 36 does not become so slow, so the effect of reducing the flow loss cannot be expected.

  Further, a diffusion chamber 10 in which a cross-sectional area based on the flowing direction of the molten solder is rapidly expanded is provided at a position connected to the electromagnetic pump 30 of the chamber body 9, and the flow rate of the molten solder in the diffusion chamber 10 is The size is determined so that it becomes 1/10 or less of the flow rate of the molten solder in the reversing flow path 37 of the electromagnetic pump. That is, by setting the cross-sectional area of the diffusion chamber 10 to 10 times or more the cross-sectional area of the reversing channel 37, the flow rate of the diffusion chamber 10 can be 1/10 or less of the flow rate of the reversing channel 37. As will be described later, the pressure chamber 36 and the diffusion chamber 10 of the chamber body 9 act as flow capacitances, and the decrease in the flow rate of the molten solder in the diffusion chamber 10 can be reduced to a fraction or less. However, by determining this to be 1/10 or less, the stability of the shape of the jet wave 19, particularly the stability of the wave height is remarkably good, and there is no high-frequency fluctuation that can be confirmed with the naked eye. Become.

  The chamber body 9 is fixed to the upper end edge of the solder tank 1 by a suspending portion 12 with a screw 14 and is configured to be easily attached and detached by a handle 13. That is, the handle 13 is held and the chamber body 9 is fitted to the discharge port 38 of the electromagnetic pump 30 and fixed to the solder tank 1 in the fitted state. The chamber body 9 is provided with a blower body 16 for forming a jet wave 19 and is configured so that fixing and releasing operations can be performed on the surface of the molten solder by a screw 21 through the sleeve 20. It is. That is, the type of the jet wave used for soldering is changed depending on the type of the printed wiring board, that is, the blower body 16 is replaced, but consideration is given so that this replacement work can be easily performed. It is. A rectifying plate 15 for aligning the flow vector of the molten solder is provided in the chamber body 9 so as to align the jet vector according to the position of the blowing port 17.

  In addition, since the shape of the outer core 31 can form the column shape of the ALIP type | mold electromagnetic pump 30, normally the external appearance is also a column shape. Further, the inner core 33 is also cylindrical, and a moving magnetic field is generated in an annular space between the outer core 31 and the inner core 33, that is, a flow path. And generate suction force.

  Next, the drive system of the ALIP type electromagnetic pump will be described.

  This flow channel inversion annular linear type (R-ALIP type) electromagnetic pump (hereinafter referred to as an inversion type ALIP type electromagnetic pump) is connected to a multiphase AC power supply device 40 (for example, a VVVF type three phase inverter power supply device). Then, the multiphase AC power is supplied to the magnetic field generating coil 31 of the electromagnetic pump.

  In addition, this polyphase alternating current power supply device 40 is the structure by which the output voltage, frequency, electric power, etc. are arbitrarily adjusted and controlled by communication with the control apparatus 41. The control device 41 is configured by a computer system, and includes an instruction operation unit 42 such as a keyboard and a display unit 43 such as an LCD. The operation of the multiphase AC power supply device 40 is operated according to an instruction from the instruction operation unit 42. Control.

  Further, the temperature control device 8 is also configured to be controlled by arbitrarily adjusting control characteristics such as power supplied to the heater 6, temperature, and PID through communication with the control device 41.

  Here, the melting point of the solder varies depending on the type of solder. Conventionally used tin-lead solder (for example, 37% lead and the remainder is tin) is about 183 ° C., and lead-free solder tin-zinc solder (for example, zinc) 9% with the balance being tin, about 199 ° C., tin-silver-copper solder (eg about 3.5% silver, about 0.7% copper, the balance being tin), about 220 ° C., and so on.

  For this reason, the soldering temperature of the printed wiring board, which is the work to be soldered, varies depending on the type of solder used, but the heat resistance temperature of the electronic components mounted on the printed wiring board is considered. The most frequently used examples are in the range of about 220 ° C to 260 ° C.

  Other features of the ALIP type flow soldering apparatus of the present invention will be described.

  For the solder tank 1, cast iron such as FCD-400 or FCD-500 (JIS) is used. Thereby, most of the leakage magnetic field from the electromagnetic pump can be prevented from being captured in the solder tank 1 in the thrust pipe mounting hole 3 and leaking into the solder tank, that is, the solder. Most of the moving magnetic field from the external core 31 of the electromagnetic pump to the internal core 33 through the thrust generation flow path 35 returns to the external core 31 through the reverse route. However, a leakage magnetic field is apt to be generated at the end of the electromagnetic pump that becomes the suction port 34 and the discharge port 38, but the leakage magnetic field can be prevented from leaking into the solder.

  Stainless steel conventionally used as a member of a solder bath is a non-magnetic member, and solder is also a non-magnetic member (the magnetic permeability is about several tens or less at the maximum). On the other hand, the magnetic permeability of an iron member such as cast iron is about several thousand to 10,000. Due to the difference of 100 times or more, the leakage magnetic field is trapped in a solder bath having a small magnetic resistance. And since a solder tank is comprised by the iron member which has a magnetic permeability equivalent to or more than the magnetic permeability of the inner core of the electromagnetic pump, the leakage magnetic field can be reliably captured.

  In addition, since the thermal expansion coefficient of the solder bath 1, that is, cast iron, and the thermal expansion coefficient of the solder are greatly different, the size of the solidified solder, that is, the outer shape is more than that of the solder bath in the process of cooling to room temperature after the molten solder solidifies. Shrink. Therefore, a very large force in the direction of arrow A as illustrated in FIG. 1 acts on the suspending portion 12 of the chamber body 9 provided in the solder bath 1, and conversely in the direction of arrow B when melting the solder. The extremely large power of acts.

  The force in the direction of the arrow A and the force in the direction of the arrow B are applied to the chamber body 9 and its hanging part 12 and the blower body 16 every time the flow soldering apparatus starts (power ON) and ends (power OFF). Will be a stress factor. Therefore, in order to release this stress factor, it is preferable to provide the suspending portion 12 slidably with respect to the solder bath 1 as illustrated in FIG.

  7A and 7B are diagrams for explaining an example of a fixed configuration of the hanging portion 12. FIG. 7A is a view of the upper end edge of the solder tank 1 as viewed from above, and FIG. It is the figure seen in the cross section. In other words, a long hole 27 is provided in the contraction / expansion direction (arrow A / B direction) and is slidably fixed by the screw 14 via a resin collar 26 or the like. The long hole 27 may be provided in either the hanging part 12 or the solder tank 1, but in the example of FIG. A spiral spring may be interposed between the collar 26 and the screw 14 or between the collar 26 and the hanging portion 12, or a spiral spring may be interposed instead of the collar. Incidentally, in the example of FIG. 1, the configuration of FIG. 7 may be applied to the hanging portion 12 on the left side of the drawing, but may be applied to the hanging portions on the left and right sides.

(2) Operation When electric power is supplied from the multiphase AC power supply device 40 to the inverting ALIP type electromagnetic pump 30, a moving magnetic field is generated in the thrust generating flow path 35, and thrust is applied to the molten solder in the moving direction of the moving magnetic field. It is done. Therefore, the molten solder is sucked from the suction port 34 and fed to the pressure chamber 36 of the thrust pipe 32 through the thrust generation flow path 35. The molten solder whose flow velocity is reduced in the pressure chamber 36 is fed to the reversing flow path 37 after converting the kinetic energy obtained in the thrust generation flow path 35 into pressure energy. Subsequently, molten solder is fed from the outlet of the reversing flow path 37, that is, the discharge port 38 to the chamber body 9, and in the molten solder whose flow velocity is rapidly reduced in the diffusion chamber 10 of the chamber body 9, the flow straightening plate 15 sets the flow velocity vector. After the alignment, the jet wave 19 is jetted from the blower port 17 of the blower body 16 to form a jet wave 19, and then flows down the guide plate 18 to return to the solder bath 1.

  In a reversing ALIP type electromagnetic pump, the thrust generating flow path and the reversing flow path whose longitudinal section is longer than the length in the transverse section with respect to the thrust direction act as a flow inductance when viewed from the molten solder to be fed. Then, the pressure chamber of the thrust pipe and the diffusion chamber of the chamber body in which the feed flow rate rapidly decreases acts as a flow capacitance. Therefore, when this is drawn with an equivalent electric circuit, it can be drawn as shown in FIG.

  That is, the thrust generation flow path 35 and the reverse flow path 37 are expressed as inductance, and the pressure chamber 36 of the thrust pipe and the diffusion chamber 10 of the chamber body are expressed as capacitance. The thrust is a power source and the blower body 16 can be expressed as a load. The thrust should be expressed as a distributed constant that is uniformly distributed in the thrust generation flow path, but in FIG. 4, this is expressed as an equivalent concentrated constant.

  The circuit shown in FIG. 4 is a low-pass filter circuit, which is a high-pass filter. A component having a short flow rate and pressure fluctuation cycle is absorbed by the pressure chamber 36 and the diffusion chamber 10 while being blocked by the thrust generation flow path 35 and the reversal flow path 37, and the jet wave from which the high frequency fluctuation has been removed in the blower body 16. 19 is formed. And especially the high region fluctuation of a wave height is removed.

  When molten solder is supplied to a printed wiring board with a jet wave from which high-frequency fluctuations have been removed, the molten solder will be supplied to each soldered part existing on the printed wiring board in a short time with uniform parameters. Thus, uniform soldering quality can be obtained at any position (region) of the printed wiring board. That is, the same fillet-shaped soldering can be performed with the same wettability in a plurality of adjacent soldered portions.

  As a result, the portion where the soldering quality is lowered depending on the position (region) on the printed wiring board does not change for each printed wiring board, and high soldering quality can be stably maintained. .

  By the way, in order to perform the cleaning operation in the solder bath, the molten solder is removed from the solder bath. This operation is usually performed from a drain valve provided at the bottom of the solder bath. On the other hand, in patent document 1, it is comprised so that a drain valve may be provided in the thrust pipe lower end part of an electromagnetic pump, and the molten solder in a solder tank may be extracted. This is because the molten solder remains in the thrust pipe of the electromagnetic pump even if the molten solder is removed from the solder bath.

  However, when a drain valve is provided at a portion where the flow direction of the molten solder is reversed as in Patent Document 1, that is, when a drain valve is provided at the lower end portion of the thrust pipe of the electromagnetic pump, the shape of the lower end portion is a step by the drain valve. Because of the discontinuous shape having the portion, there is a problem that the discharge force of the molten solder is attenuated or the discharge force is minutely changed.

  In the configuration of the flow soldering apparatus of the present invention, when the drain valve 4 provided in the solder tank 1 is opened, the molten solder in the thrust pipe 32 of the reversing ALIP type electromagnetic pump flows out from the suction port 34 and the discharge port 38. Therefore, it is not necessary to provide a drain valve on the thrust pipe 32. Therefore, from this point as well, the discharge force is not attenuated or the discharge force is not changed minutely as in the technique of Patent Document 1.

  Note that the molten solder in the blower body 16 and the chamber body 9 also flows out through the reverse ALIP electromagnetic pump 30. Moreover, it can also be made to flow out by uniting them and removing from a solder tank. Further, if the chamber body 9 is provided with fine holes 11, the chamber body 9 can be made to flow out of the holes.

(3) Configuration Example of Soldering System FIG. 5 is a diagram illustrating an example in which the soldering system is configured using the ALIP type flow soldering apparatus illustrated in FIG. FIG. In addition, in order to make a figure legible, the conveyance conveyor is represented with the dashed-dotted line which parallels.

  That is, the printed wiring board 56 transported by the transport conveyor 52 is preheated by infrared rays radiated from the panel heater 53 of the preheating device 50 and hot air blown from the hot air blowing port 54, and then the flow soldering device 51. Then, the molten solder is supplied to the soldered portion from the jet wave of the molten solder to perform soldering, and then cooled by the cold air supply device 55 to increase the soldering strength and the like.

  In this example, the reversing ALIP electromagnetic pump 30 provided on the front end side of the solder bath with respect to the conveyance direction of the printed wiring board 56 is positioned in the gap between the preheating device 50 and the flow soldering device 51. Is provided. This is an example in which the thermal convection generated by the electromagnetic pump is supplied to the printed wiring board so that the temperature of the preheated printed wiring board does not decrease before contacting the jet wave. . Since the temperature of the electromagnetic pump is higher than the temperature of the molten solder and is generally about 100 to 150 ° C., the exhaust heat is used for preheating.

  The ALIP type flow soldering apparatus according to the present invention is used when electronic components are soldered and mounted on a printed wiring board. According to the present invention, when flow soldering a large printed wiring board that is remarkably adopted in a large-sized flat-screen television or the like, it becomes possible to manufacture a printed wiring board having high and uniform soldering quality at each part, and high reliability. The contribution to the electrical industry will be significant by enabling the supply of electronic devices.

The figure explaining the structure of the whole ALIP type | mold flow soldering apparatus of this invention The perspective view of the ALIP type flow soldering apparatus of this invention Exploded perspective view of a reversing ALIP type electromagnetic pump used in the present invention Equivalent circuit diagram depicting solder flow in electrical circuit The figure explaining the structure of the soldering system using the ALIP type | mold flow soldering apparatus of this invention Diagram explaining how to heat solder The figure explaining the fixed structure of a hanging part

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder tank 2 Side wall 3 Thrust pipe attachment hole 4 Drain valve 5 Solder 6 Heater 7 Temperature sensor 8 Temperature control device 9 Chamber body 10 Diffusion chamber 11 Hole 12 Suspension part 13 Handle 14 Screw 15 Current plate 16 Blow hole body 17 Blow hole 18 Guide plate 19 Jet wave 20 Sleeve 21 Screw 22 Sheath heater 23 Presser plate 24 Screw 25 Groove 26 Kara 27 Long hole 30 Reversing type ALIP electromagnetic pump 31 Coil for generating external core and moving magnetic field 32 Thrust pipe 33 Internal core 34 Suction port 35 Thrust generation flow path 36 Pressure chamber 37 Reverse flow path 38 Discharge port 40 Multiphase AC power supply device 41 Control device 42 Instruction operation unit 43 Display unit 50 Preheating device 51 Flow soldering device 52 Conveyor conveyor 53 Panel heater 54 Hot air outlet 55 Cold air supply device 56 Printed wiring board

Claims (2)

In a flow soldering device in which an annular linear type (ALIP type) electromagnetic pump is provided on the tank wall of the solder tank,
When the annular linear type (ALIP type) electromagnetic pump seals one end of the thrust pipe into a cap shape, an inversion flow path is provided along the axis of the inner core inserted inside the thrust pipe. Thus, a thrust generating flow path is formed between the thrust pipe and the inner core, and a reverse flow type annular linear type (R) in which a feed flow path is formed by the thrust generating flow path and the reversing flow path (R -ALIP type) It is configured as an electromagnetic pump, and when the thrust pipe is provided on the side wall of the solder tank, an outer core and a coil for generating a moving magnetic field are provided around the thrust pipe.
The thrust pipe has a region where the outer core and the moving magnetic field generating coil are not provided at a position where the feed flow path from the thrust generation flow path to the reversal flow path is reversed. Forming a pressure chamber in which a feed flow velocity is lower than a feed flow velocity in the thrust generation flow path and a feed flow speed in the reverse flow path by providing a region not provided with a core;
A chamber body provided with a diffusion chamber for rapidly decreasing the discharge flow rate is connected to the discharge port of the inner core in which the reversal flow path is formed, and the chamber body is further blown to form a jet wave of molten solder. A mouth is provided,
The thrust generation flow path, the pressure chamber, the reversal flow path, and the diffusion chamber form a high-frequency fluctuation removal filter that absorbs fluctuations with a short repetition period among minute fluctuations in the flow rate of molten solder. ,
ALIP type flow soldering equipment. The length of the pressure chamber in the longitudinal section of the thrust pipe relative to the feed direction in the electromagnetic pump is longer than the inner diameter of the thrust pipe, and the flow rate of the molten solder in the diffusion chamber of the chamber body is 1 / Being provided in a cross-sectional area decelerating to 10 or less,
The ALIP type flow soldering apparatus according to claim 1.

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