CN1494149A - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
- Publication number
- CN1494149A CN1494149A CNA031077765A CN03107776A CN1494149A CN 1494149 A CN1494149 A CN 1494149A CN A031077765 A CNA031077765 A CN A031077765A CN 03107776 A CN03107776 A CN 03107776A CN 1494149 A CN1494149 A CN 1494149A
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- China
- Prior art keywords
- electronic device
- resin
- wiring substrate
- electronic
- outer cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10537—Attached components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention discloses an electronic devices including a wiring substrate and an electronic component which is mounted on the wiring substrate via soldering, and a case fixed to the wiring substrate to cover the electronic component, so as to improve the strength for fixing the case to the wiring substrate. In addition to fixing the case 12 onto the wiring substrate 2 by the soldering material 18, the adhesive resin 20 is introduced into the hole 21 on the top wall 13 of the case 12. The electronic device 6 mounted on the wiring substrate 2 is adhered to the case 12 mutually by the adhesive resin 20. The adhesive resin 20 does not contact the wiring substrate 2. Therefore, even if the soldering material 10 to mount the electronic device 6 expands due to melting in the soldering process, the adhesive resin 20 and wiring substrate 2 won't peel off at the interface. Therefore, the short-circuit between the terminal electrode of the electronic device 6 due the flowing of soldering material 10 along the peeled portion of interface is not prone to occur.
Description
Technical field
The present invention relates to comprise at least 2 electronic installations that are installed in the device of wiring substrate, relate in particular to and seek to improve the improvement that constant intensity that metal housing and surface installing type electronic device or a plurality of surface installing type electronic device be installed in wiring substrate is used.
Background technology
As the such high-frequency electronic device of using such as portable telephone and wireless communication machine of RF device, have and comprise wiring substrate and the form that is loaded in the surface installing type electronic device of wiring substrate by welding.
Fig. 8 is a cutaway view of roughly representing in the past the electronic installation 101 relevant with the present invention.
On wiring substrate 102, loading 2 surface installing type electronic devices 103 and 104 by welding at least.One side's electronic device 103 for example is the IC chip device, connects face through the conduction of some scolding tin plush coppers 105 on be formed at wiring substrate 102 and welds.The opposing party's electronic device 104, for example, capacitor, the chip device of inductance element or quartz vibrator etc. connects face by the conduction of scolding tin fillet 106 on be formed at wiring substrate 102 that forms with welding and welds.
At the electronic installation 101 with aforementioned such form, outer cover (not shown) is fixed on wiring substrate 102, electronic device 103 and 104 is covered.
But, in the electronic installation 108 of earlier figures 8, have following problem.
At first, be loaded at least 1 in the electronic device 103 and 104 of wiring substrate 102, because falling or the crooked impact that causes when being added to wiring substrate 102 comes off, damages from wiring substrate 102 sometimes.
In addition, be loaded in the electronic device of wiring substrate 102, for example the electronic device 103 of IC chip device, if the electronic device quantity of loading on large-scale or the wiring substrate 102 is many, so, as wiring substrate 102, just must adopt the big substrate of planar dimension.In addition, on the other hand,, require the thickness of wiring substrate 102 thinner owing to pursue the low back of the bodyization of electronic installation 101.Like this, falling or the crooked impact that causes when being added to wiring substrate 102 more is easy to generate the damage of the fracture etc. of wiring substrate 102.
In addition, the scolding tin plush copper 105 that has in the electronic device 103 is when constituting such as SnPb63, when adopting electronic installation 101 the wave-soldering operation to install on mainboard (not shown) as assembly, employed temperature is often greater than the temperature that makes the SnPb63 fusion during installation.At this moment, during 105 fusions of scolding tin plush copper, undesirable moving can take place in 103 pairs of wiring substrates of electronic device 102 sometimes, when the most serious, meet place, face next door in this conduction that is connected with scolding tin plush copper 105 short circuit that scolding tin causes can take place, make electronic installation 101 become defective products.
In addition, have the electronic installation of outer cover, when outer cover was made of metal, for outer cover is fixed on wiring substrate, the normal employing welded, but often because weld strength is not enough, occurs the problem that outer cover comes off from wiring substrate sometimes.
Though be not to be direct purpose to solve foregoing problems, but as correlation technique of the present invention, in special permission communique 1993-47968 number and special permission communique 1996-17853 number, disclosed can run into wiring substrate, resin be imported in the outer cover, with the structure of this resin with the covering of the electronic device on the wiring substrate.At this moment, because resin is imported into, contacts outer cover, the result, resin becomes the solid that outer cover and wiring substrate are bonded with each other and works, and therefore, can utilize resin to improve the constant intensity of outer cover to wiring substrate.
But in the structure of expression, resin covers the electronic device on the wiring substrate in special permission communique 1993-47968 number and special permission communique 1996-17853 number, electronic device is installed on the scolding tin that wiring substrate uses is also covered by resin.Following problem can appear in such structure.
Promptly also, comprise the electronic installation of previous constructions, be installed on the such installation base plate of mainboard by wiring substrate.At this moment, if employing wave-soldering, sometimes, the temperature of wave-soldering is higher than the fusing point that is used in the scolding tin of installation electronic device on the wiring substrate, at this moment, electronic device is installed the scolding tin of usefulness owing to fusion is expanded, the volatile ingredient of scolding tin expands, and for this reason, stress occurs on the resin of overlay electronic device, adherence strength between resin and wiring substrate is descended, produce interface peel each other.In addition, when producing interface peel, partly have the scolding tin of fusion to flow at interface peel, the result is installed between the different terminal electrodes of electronic device of wiring substrate by the scolding tin short circuit, causes short trouble.
Aforesaid short trouble at the overlay electronic device, take place easily when resin is imported outer cover, prevents that measure from also having when importing resin certainly in outer cover, but, if import like this resin in outer cover, as previously mentioned, it also is problem that outer cover can not improve the constant intensity of wiring substrate.
Summary of the invention
Therefore, purpose of the present invention just provides the electronic installation that can solve foregoing problems.
The more specific purpose of the present invention is to provide and can be difficult to produce the electronic installation that moves that damages and be difficult for taking place undesirable electronic device in the wave-soldering operation at wiring substrate when improving the constant intensity of electronic device to wiring substrate.
Another more specific purpose of the present invention is to provide and can improve the non-incident electronic installation of problems such as short trouble that outer cover causes the resin in the importing outer cover to the constant intensity of wiring substrate, again.
The present invention is characterized as, and comprises wiring substrate, and is installed in the 1st device and the 2nd device on the wiring substrate, and for solving the aforementioned techniques problem, the 1st device and the 2nd device use and do not run into then being bonded with each other with resin of wiring substrate.Then use resin, make mutual like this 1st and the 2nd device of following becoming one mechanically.
The 1st specific example in the present invention, the 1st device, at least comprise by welding and be loaded in 1 surface installing type electronic device on the wiring substrate, the 2nd device, comprise can overlay electronic device, be fixed on the outer cover of wiring substrate, at this moment, then use resin, be between upper wall following of top and outer cover of electronic device.
Then use resin, can improve the intensity that outer cover is fixed on wiring substrate by electronic device.In addition, that does not run into wiring substrate then uses resin, even electronic device is installed on scolding tin generation fusion and the expansion that wiring substrate is used, also can not cause and wiring substrate between the problem of interface peel, can not cause that scolding tin flows into the interface peel part, causes the problem of short trouble.Promptly also, among the present invention, then with the setting of resin had better not be connected surface installing type electronic device and outer cover and contact with the scolding tin that wiring substrate is used.
After the electronic device assembling, in order will then to import between electronic device and outer cover easily, be preferably in the upper wall of outer cover with resin, the hole of then using with resin from the outside importing is set.
For prevent foreign matter pass through this hole invade in outer cover and in installation procedure the sorption position of the suction nozzle of fitting machine unrestricted, aforementioned apertures is the most handyly then stopped up with resin.
In addition, in order not hinder bidding will on the upper wall of covering outside, Kongzui is arranged on the central authorities of the upper wall of leaving outer cover, the position of departing from perimeter sides well.
When electronic installation of the present invention comprises a plurality of surface installing type electronic devices, then use resin, bridging is on a plurality of aforesaid electronic devices at least.
Electronic device, the face that has at least resin to form is above then used resin, engages as the face that resin is formed, and can utilize then and further improve bond strength with resin.
In the present invention, outer cover constitutes with metal usually.At this moment, outer cover is fixed by welding in wiring substrate usually.
Electronic installation of the present invention, also can comprise the side walls that is disposed at outer cover and the 3rd device between wiring substrate, at this moment, even depart from the installation site of the relative wiring substrate of outer cover, be damage influence to the 3 devices (particularly surface installing type electronic device) that prevent outer cover, between the side walls and the 3rd device of outer cover, be preferably formed as the gap.
Electronic installation of the present invention comprises a plurality of electronic devices, these a plurality of electronic devices, when having mutual different area top, the aforementioned resin of then using, preferably be added at least the area maximum electronic device above.Can increase the bonding area of then using resin to electronic device, because not conference takes place then to run into the such contingency of wiring substrate with resin.
In addition, the 1st device comprises a plurality of surface installing type electronic devices, when a plurality of electronic devices have mutually different height, then uses resin, preferably be added at least the highest electronic device above.Can further reduce electronic device and outer cover be bonded with each other usefulness then with the amount of resin take place then to run into the such contingency of wiring substrate because be difficult for resin.
Electronic installation in the present invention, electronic device comprises the 1st and the 2nd electronic device, and then with resin comprise make that the 1st electronic device engages with outer cover the 1st then use resin, and make that the 1st electronic device engages with aforementioned the 2nd electronic device the 2nd when then using resin, these the 1st then then can have nothing in common with each other with resin composition separately with resin and the 2nd.At this moment, best, then use resin as the 1st, can adopt with the 2nd then with resin relatively, under unhardened state, viscosity is low and the thixotropism index is little resin.Then use resin for the 1st, easy expansion above the 1st electronic device in addition, is then used resin for the 2nd, should be difficult for running into wiring substrate.
From comprising the 1st surface installing type electronic device and the 2nd surface installing type electronic device that is loaded in wiring substrate by welding, electronic installation of the present invention constitutes composite electronic device respectively for the 2nd specific example in the present invention, the 1st and the 2nd device.Then use resin, make that mutual like this 1st and the 2nd electronic device of following mechanically forms integrated.
As previously mentioned, the side with following the 1st and the 2nd electronic device of following mutually with resin preferably is loaded in the electronic device midplane size the maximum on the wiring substrate.As the electronic device of this planar dimension maximum, the IC chip device is for example arranged.
As previously mentioned, on the electronic device of planar dimension maximum, use when then using resin,, preferably be loaded in electronic device midplane size the 2nd big person of wiring substrate with this electronic device of following the opposing party who follows with resin.
Electronic installation of the present invention, also comprise the 3rd electronic device that is loaded in wiring substrate by welding, relative with the 1st electronic device to each side when disposing the aforementioned the 2nd and the 3rd electronic device respectively, the 1st electronic device and the 2nd and the 3rd electronic device each other preferably each with then following each other with resin.
At the 2nd example, also can have can overlay electronic device, be fixed on the outer cover of wiring substrate.At this moment, preferably then also be added on the outer cover with resin.In addition, in the upper wall of outer cover, the hole of then using with resin from the outside importing is set preferably.
Description of drawings
Fig. 1 represents the stereoscopic figure of the electronic installation 1 of the 1st example of the present invention.
Fig. 2 is the cutaway view along the II-II line.
Fig. 3 is the electronic installation 1a of expression the present invention the 2nd example, the cutaway view suitable with Fig. 2.
Fig. 4 is the electronic installation 1b of expression the present invention the 3rd example, the cutaway view suitable with Fig. 2.
Fig. 5 is the electronic installation 1c of expression the present invention the 4th example, the cutaway view suitable with Fig. 2.
Fig. 6 is the figure that the electronic installation 41 of the present invention's the 5th example represented in summary, and (1) is cutaway view, and (2) are plane graphs.
Fig. 7 is the figure that the electronic installation 51 of the present invention's the 6th example represented in summary, and (1) is cutaway view, and (2) are plane graphs.
Fig. 8 represents the general profile chart of electronic installation in the past 101 related to the present invention.
Label declaration
1,1a, 1b, 1c electronic installation
2,42,52 wiring substrates
4,5 conductions connect face
6～9,26,27,30,31,35,36,43,44,53～55 electronic devices
10,32,37,45,56 scolding tin plush coppers
11,28,33,38,46,57,58 scolding tin fillets
12 outer covers
13 upper wall
14 side walls
15 foots
18 scolding tin
19 gaps
20,39,47,59,60 then use resin
21 holes
Concrete example
Fig. 1 represents the stereogram of outward appearance of the electronic installation 1 of the 1st example of the present invention, and Fig. 2 is the cutaway view along the line II-II of Fig. 1.
The structure of illustrated electronic installation 1 for example, can adopt in the RF of the portable telephone portion high-frequency electronic device such with device and radio communications set.
On on wiring substrate 2, load some surface installing type electronic devices 6,7,8 and 9 by welding.In addition, be loaded in the electronic device of wiring substrate 2, only representational picture some.
Electronic device 6 among Fig. 2, for example the IC chip device of RFIC, BB (fundamental frequency) IC, memory etc. is soldered to the conduction that is formed on the wiring substrate 2 by some scolding tin plush coppers 10 and connects face.In addition, the electronic device 7 among Fig. 1 and 8 and Fig. 2 in electronic device 9, for example be the chip device of mounted on surface such as capacitor, inductance element or quartz vibrator.On Fig. 1 and Fig. 2, illustrate the scolding tin fillet 11 of the welding usefulness of these electronic devices 7～9.
In addition, side below wiring substrate 2 is also loaded electronic device sometimes as required.At this moment, side below wiring substrate 2 is provided with recess, and electronic device just is loaded in the recess.
The foot 15 of outer cover 12 is used for outer cover 12 is fixed on wiring substrate 2.Promptly also, foot 15 connects face 4, welds with scolding tin 18 facing to the aforementioned conduction that is arranged on the wiring substrate 2, like this, outer cover 12 is fixed on wiring substrate 2.
The side walls 14 of outer cover 12, its short transverse size can not be run into above the wiring substrate 2 when setting.Especially as shown in Figure 2, when existence is disposed at the electronic device 9 of 2 of side walls 14 and wiring substrates, can form gap 19 between side walls 14 and the electronic device 9.The reasons are as follows.
When foot's 15 usefulness scolding tin 18 of outer cover 12 are welded to conduction and connect on the face 4, as being suitable for wave-soldering tin-soldering, fusion scolding tin 18 during wave-soldering, outer cover 12 can move on wiring substrate 2.At this moment, as not forming gap 19, side walls 14 contacts with electronic device 9, and in this state, scolding tin 18 solidifies, and outer cover 12 will be fixed on the wiring substrate 2, and like this, harmful effect such as can sustain damage on the electronic device 9.In addition, because outer cover 12 is stated from the electronic device 9, the weld strength that outer cover 12 and wiring substrate are 2 can reduce.Gap 19 is used to address these problems.
In addition, about the size and the shape of side walls 14, the size of gap 19 grades especially when electronic installation 1 during as high-frequency element, should be guaranteed sufficient shielding in the design, in case the electromagnetic leakage in associated frequency band territory.
In addition, at electronic installation 1, as shown in Figure 2, electronic device 6 then is bonded with each other with resin 20 with outer cover 12 usefulness.Should be then with resin 20, as shown in Figure 2, use on for example only on electronic device 6, can not contact like this with wiring substrate 2.In addition, then with resin 20, only otherwise run into wiring substrate 2, can extend on the side of electronic device 6 in the use.
Aforesaid then with resin 20, can be loaded in electronic device 6～9 on the wiring substrate 2, use after the stationary housings 12 again.For this reason, the hole 21 of being convenient to then use from the outside importing resin 20 usefulness is set on the upper wall 13 of outer cover 12.Therefore, then with resin 20, can use such as dispenser in the unhardened stage 21 to import outer covers 12 from the hole., can adopt with resin 20 as then such as the such thermosetting resin of epoxy resin, by heat hardening.Then should set suitable viscosity, make in the unhardened stage with resin 20, easily from smaller hole 21 along electronic device 6 above expansion, be difficult for again dropping down along the side of electronic device 6.
With resin 20, it is applicable to have following composition and performance (viscosity and thixotropism index) person as then.
(composition)
Bisphenol epoxy 10～20 weight %
Acid anhydrous class curing agent 10～15 weight %
Hardening catalyst (phenol resin system) 3～5 weight %
Filler (silicon dioxide) 60～65 weight %
Adjusting material (silicones) 3～7 weight %
(performance)
Viscosity (25 ℃) 40～70Pas
Thixotropism index (B8H type viscosimeter) 1.0～1.4
As shown in Figure 2, hole 21, the most handy then with resin 20 obstructions.Like this, can prevent that foreign matter from 21 invading outer covers 12 from the hole.
In addition, hole 21 is preferably disposed on the central authorities of the upper wall 13 of leaving outer cover 12, the position of departing from perimeter sides.Like this, for example can on the upper wall 13 of outer cover 12, guarantee with producer's position marks such as laser enough fields of clocking.
In addition, because hole 21 is arranged on upper wall 13 central authorities fields in addition, this hole 21 also just has the effect of the directivity of indication electronic installation 1.At this moment, when then with pigment such as resin 20 carbon containings, hole 21 can with then with coloring resin, become carbon black look etc., make with the hue difference of outer cover 12 more clearly, the effect of aforementioned mark also more takes effect.
In addition, below hole 21, need to place electronic device 6, needn't make hole 21 be positioned at the top central authorities of electronic device 6, electronic device 6 is even central authorities different with shown position, that be loaded in wiring substrate 2 also can make the central authorities of the position deviation upper wall 13 in hole 21.
In addition, when electronic device 6 is the IC chip, usually adopt resin to adorn outward.Like this, electronic device 6 when having the face that is formed by resin in the above at least, can use then with resin the face that is formed by resin to be engaged, and therefore, can further improve then with the bond strength of resin 20 with electronic device 6.
In addition, as shown in the figure, when load on the wiring substrate 2 a plurality of electronic devices 6～9, these electronic devices 6～9 have different mutually areas above the time, then with resin 20, preferably be used to have maximum area electronic device 6 above.Like this, then just be not easy to drop down the side of electronic device 6 with resin 20.
In addition, as shown in the figure, when a plurality of electronic devices 6～9 have mutually different height, then with resin 20 preferably be used in the highest electronic device 6 above.Like this, use a spot of following that electronic device 6 and outer cover 12 are bonded with each other with resin 20.In addition, then few with resin 20, with regard to the more difficult side of dropping down electronic device 6.
As previously mentioned,, use then electronic device 6 and outer cover 12 to be bonded with each other, can improve the constant intensity of 12 pairs of wiring substrates 2 of outer cover with resin 20 according to the 1st example of reference Fig. 1 and Fig. 2 explanation.The impact that produces when therefore, the goods of avoiding comprising this electronic installation 1 easily fall causes outer cover 12 from wiring substrate 2 such accident that comes off.
In addition, can utilize then with resin 20 guarantee between outer cover 12 and the electronic device 6 etc. the gap and and the gap of 2 of wiring substrates be necessarily, for example, the characteristic measurement of electronic installation 1 and sort operation and the welding sequence that on the such installation base plate of the member of electronic installation 1 and mainboard, carries out in all be not easy to produce the change in gap, as a result, can prevent the change of the characteristic of electronic installation 1.
In addition, owing to then do not run into wiring substrate 2 in use with resin 20, but when being installed to suitable mainboard on by wave-soldering operation etc. this electronic installation 1, moving of the fusion scolding tin that scolding tin plush copper 10 produces during fusion again can not be with then limiting with resin 20, therefore, such, can produce restriction fusion scolding tin and move the electric short circuit phenomenon that causes because of scolding tin between result's the different terminals of electronic device 6 etc. and can be prevented.
In addition, outer cover 12 is fixed on the means of wiring substrate 2, by then sharing that electronic device 6 is engaged with outer cover 12 with resin 20 with the scolding tin 18 that foot 15 engages with wiring substrate 2.Therefore, for example, even do not carry the bond strength of 2 of foot 15 and wiring substrates very highly, owing to can guarantee to surpass the constant intensity of regulation, so still can reduce the area that foot 15 and conduction connect the bonding part of face 4 to outer cover 12.As a result, can enlarge the area that the configuration conduction connects face 4 circuit devcie in addition on wiring substrate 2, this helps the miniaturization of electronic installation 1.
In addition, because hole 21 is set, can on wiring substrate 2, load electronic device 6～9, stationary housings 12 back uses on outer cover 12 then with resin 20.Therefore, using then with the stage before the resin 20, be judged as defective products as electronic installation 1, also the IC chip of high price that can electronic device 6 is such takes off for utilization again from wiring substrate 2.
Fig. 3 represents the electronic installation 1a of the present invention's the 2nd example, the figure suitable with Fig. 2.At Fig. 3, same label on all parts bands suitable with Fig. 2, the explanation of repetition is omitted.
Feature as this example: then with resin 20, but bridging is in a plurality of, 2 electronic devices 26 and 27 for example.Other component parts, basic identical during with aforesaid the 1st example.
As shown in Figure 3, but then with resin 20 in use bridging therefore can make the position of electronic device 26 and 27 s' planar dimension concern not change in a plurality of electronic devices 26 and 27.For this reason, even occasions such as wave-soldering operation when being installed to this electronic installation 1a on the such installation base plate of mainboard when forming the scolding tin generation fusion of scolding tin fillet 28, also can suppress electronic device 26 and 27 and move separately, as a result, avoid the flutter of electronic installation 1a easily.
In addition, because 2 electronic devices 26 and 27 usefulness are then mechanical integrated with resin 20 formation, therefore, even at least one side of electronic device 26 and 27 weakens the pull-out capacity of wiring substrate 2, also can prevent from from the outside impact of wiring substrate 2 to be caused coming off of electronic device 26 and 27 or damage because of fall or bending etc.
Fig. 4 is electronic installation 1b, the figure suitable with Fig. 2 of expression the present invention the 3rd example.At Fig. 4, same label on all parts bands suitable with Fig. 2, the explanation of repetition is omitted.
Feature as this example: then with resin 20, but bridging is in a plurality of, 2 electronic devices 30 and 31 for example.Its other formations, basic identical during with aforesaid the 2nd example, in addition, can produce and the same effect of the 2nd example essence.
In addition,, form mechanical integrated electronic device 30 and 31,, help forming the competent structure that adds of the rupture strength that can improve wiring substrate 2 because separately planar dimension is bigger at this example.Therefore, can prevent because of falling or bending etc. causes producing on the wiring substrate 2 damage of fracture etc. to the impact of wiring substrate 2.
According to this example, can also produce following effect.
The scolding tin plush copper 32 that has in the electronic device 30 is when constituting such as SnPb63, when on mainboard, adopting the wave-soldering operation to install electronic installation 1b, fusion takes place in scolding tin plush copper 32, sometimes undesirable moving can take place in 30 pairs of wiring substrates of electronic device 2, when the most serious, the short circuit that scolding tin causes can take place meeting place, face next door with conduction that scolding tin plush copper 32 is connected respectively.
But the scolding tin fillet 33 that the opposing party's electronic device 31 is welded to wiring substrate 2 usefulness is as the scolding tin that uses, when for example using high temperature scolding tin, can this scolding tin fillet 33 of not fusion, and make the position of positively keeping 31 pairs of wiring substrates 2 of electronic device.As a result, with the electronic device of then fixing with respect to electronic device 31 30, also can positively keep position for wiring substrate 2 with resin 20.
Fig. 5 expresses the electronic installation 1c of the 4th example of the present invention, the figure suitable with Fig. 2.At Fig. 5, same label on all parts bands suitable with Fig. 2, the explanation of repetition is omitted.
At this example, then with resin 20, the hole 21 of the upper wall 13 by being arranged on outer cover 12 imports, and electronic device 35 and outer cover 12 are bonded with each other.In addition, before adorning outer cover 12, following of use uses resin 39 energy bridgings on 2 electronic devices 35 and 36.These then with resin 20 and 39, all do not contact with wiring substrate 2.
At this example, with resin 20 and 39, composition separately has nothing in common with each other as then.More particularly, then with resin 20, can be compared to most and then use resin 39, at unhardened state, viscosity is low and the thixotropism index is little.Therefore, to then with resin 20, should easy expansion above electronic device 35, in addition, with resin 39, should be not easy to drop down on the wiring substrate 2 better then.For example, then with the viscosity of resin 39 and thixotropism index respectively greater than then with the viscosity of resin 20 and 2 times of thixotropism index.
Aforesaid concrete composition and performance (viscosity and thixotropism index) person is applicable such as having then with resin 20 as aforementioned, and in addition, with resin 39, more specifically, it is applicable to have following composition and performance (viscosity and thixotropism index) person as then.
(composition)
Bisphenol epoxy 12～18 weight %
Acid anhydrous class curing agent 10～15 weight %
Filler (silicon dioxide) 70～80 weight %
(performance)
Viscosity (25 ℃) 94～170Pas
Thixotropism index (B8H type viscosimeter) 2.8～3.3
According to this 4th example, the identical effect of essence in the time of can not only rising with the 2nd and the 3rd example, and, because the composition of following with resin 20 and 39 differs from one another, can adopt good the following of performance respectively with resin 20 and 39.Therefore, with resin 20, the drawback that above electronic device 35, is difficult to expand should be helped avoiding, in addition, with resin 39, the drawback on the wiring substrate 2 should be helped avoiding dropping down then to then.
Fig. 6 is the figure that the electronic installation 41 of the 5th example of the present invention represented in summary, and (1) is cutaway view, and (2) are plane graphs.In addition, the electronic installation 41 that Fig. 6 represents, for easily and the electronic installation in the past 101 of Fig. 8 compare, the electronic installation 101 that its basic comprising and Fig. 8 are represented is identical.
With reference to Fig. 6, electronic installation 41 has wiring substrate 42.Wiring substrate 42, detailed icon not for example, in the laminate inside that constitutes with ceramic layer, can be formed by device such as capacitor, inductance element, resistance, filter, delay line and the multilayer ceramic substrate that forms the distribution conductor.In addition, omit diagram, when on not shown mainboard, installing, be electrically connected several terminal electrodes that mainboard uses be formed on wiring substrate 42 around end face or below, on wiring substrate 42, form several conductions and connect face.
By welding, at least 2 electronic devices 43 and 44 be loaded in wiring substrate 42 above.In addition, to being loaded in the electronic device of wiring substrate 42, only illustrate typically.
One side's electronic device 43, for example IC chip devices such as RFIC, BB (fundamental frequency) IC, memory, be soldered to the conduction that is formed on the wiring substrate 42 by some scolding tin plush coppers 45 and connect face.The opposing party's electronic device 44, for example, capacitor, the chip device of mounted on surface such as inductance element or quartz vibrator utilizes scolding tin fillet 46 that welding forms, is welded on the conduction that is formed at wiring substrate 42 and connects on the face.
At such electronic installation 41, be loaded in a plurality of electronic devices of wiring substrate 42, the planar dimension maximum of illustrated electronic device 43, the planar dimension of electronic device 44 is time big.
Constitute as the feature of this example, 2 electronic devices 43 and 44 utilize then to be followed mutually with resin 47.Should be then with resin 47, shown in Fig. 6 (1), mainly be used on separately top of electronic device 43 and 44, like this, do not contact with wiring substrate 42.
In addition, then with 47 of resins otherwise run into wiring substrate 42, can extend to the side of at least one side in electronic device 43 and 44 during use.Like this, when then extending to the side of at least one side in electronic device 43 and 44, also had better not run into the scolding tin fillet 46 that for example is formed at electronic device 44 sides with resin 47.Like this, mobile being subjected to then that can prevent fusion scolding tin that the fusion again of scolding tin fillet 46 produces, the electric short circuit that causes by scolding tin that makes that the restriction of moving of avoiding this fusion scolding tin easily causes with the restriction of resin 47.
Then, can use dispenser, allow to bridging on electronic device 43 and 44, make it sclerosis by heating in the unhardened stage with resin 47.
As then using resin 47, for example can adopt epoxy is the such thermosetting resin of resin, but run into wiring substrate 42 in order not drop down, way is more specifically, employing and the aforementioned resin of then using resin 39 same compositions and performance (viscosity and thixotropism index).
As previously mentioned, according to the 5th example, because 2 electronic devices 43 and 44 usefulness are then mechanical integrated with resin 47 formation, even at least one side of electronic device 43 and 44 to wiring substrate 42 weakening of pull-out capacities is taken place, also can prevent from from the outside impact of wiring substrate 42 to be caused coming off of electronic device 43 and 44 or damage because of fall or bending etc.
In addition, mechanical integrated electronic device 43 and 44 helps forming the competent structure that adds of the rupture strength that can improve wiring substrate 42.Therefore, can prevent because of falling or bending etc. causes producing on the wiring substrate 42 damage of fracture etc. to the impact of wiring substrate 42.
Foregoing effect is more remarkable when electronic device 43 and 44 planar dimension separately is big.Therefore, as this example, then preferably be used between the electronic device 43 and the inferior big electronic device 44 of planar dimension of planar dimension maximum with resin 47.
In addition, according to this example, same with the 3rd example occasion in the earlier figures 4, the scolding tin plush copper 45 that electronic device 43 has for example adopts SnPb63, in electronic installation 41 being installed to the wave-soldering operation that mainboard uses, even scolding tin plush copper 45 fusion again, the scolding tin fillet 46 that the opposing party's electronic device 44 is welded to wiring substrate 42 usefulness is as using scolding tin, when using, can make this scolding tin fillet 46 not produce fusion such as high temperature scolding tin.Therefore, can positively keep the position of 44 pairs of wiring substrates 42 of electronic device, even the electronic device 43 by then fixing with resin 47 relative electronic devices 44 also can positively be kept the position to wiring substrate 42.Therefore, can positively prevent because 43 pairs of wiring substrates 42 of electronic device are moved, connecing the short circuit that face next door place's generation scolding tin causes with conduction that scolding tin plush copper 45 is connected respectively.
In addition, owing in use then do not run into wiring substrate 42 with resin 47, when being installed to this electronic installation 41 on the suitable mainboard by wave-soldering operation etc., moving of the fusion scolding tin that scolding tin plush copper 45 and scolding tin fillet 46 produce during fusion more is not subjected to then with resin 47 restrictions, therefore, can prevent because of such fusion scolding tin mobile confined resultant, between the different terminals of electronic device 43 and 44 by the phenomenon of scolding tin electric short circuit.
Fig. 7 is the figure that the electronic installation 51 of the present invention's the 6th example represented in summary, and wherein (1) is cutaway view, and (2) are plane graphs.
With reference to Fig. 7, electronic installation 51 comprises wiring substrate 52, on wiring substrate 52 on, by welding loading the 1st electronic device 53 at least and be configured in respectively relative with the 1st electronic device 53 to the 2nd and the 3rd electronic device 54 and 55 of each side.
The 1st electronic device 53, for example the IC chip device is welded on the conduction that is formed on the wiring substrate 52 by some scolding tin plush coppers 56 and connects face.The the 2nd and the 3rd electronic device 54 and 55, for example, the chip device of capacitor, inductance element or quartz vibrator and so on is welded on the conduction that is formed on the wiring substrate 52 respectively by the scolding tin fillet 57 and 58 that welds formation and is connect face.
At the 6th example, the 1st electronic device 53 and the 2nd electronic device 54 utilize then to be followed mutually with resin 59, and simultaneously, the 1st electronic device 53 and the 3rd electronic device 55 utilize then to be followed mutually with resin 60.
As following with resin 59 and 60, more specifically say, can adopt to have and the aforementioned resin of then using resin 39 same compositions and performance (viscosity and thixotropism index).
Its formation on the other hand, same with aforementioned the 5th example, explanation is omitted.
According to the 6th example, same effect in the time of rising with the 5th example, 3 electronic devices 53～55 are by then following with resin 59 and 60, planar dimension as the integral body of electronic device 53～55, can do greatlyyer than the integral planar size of aforesaid electronic device 43 and 44, therefore, especially aspect the mechanical strength that improves electronic installation 51, effect is more remarkable during than the 5th example.
More than, illustrated several examples are illustrated, in the scope in the present invention, all variation can be arranged.
For example, the outer cover 12 in Fig. 1～5 is made of metal, still, and for the electronic installation that comprises the outer cover that constitutes with resin, also applicable the present invention.
In addition, outer cover 12 is fixed on wiring substrate 2 by the welding with scolding tin, with the welding beyond method, for example with claw hitch be fixed on the wiring substrate good.
In addition, be arranged at size, shape and the quantity etc. in the hole 21 of outer cover 12, can change arbitrarily.
In addition, the hole is not set on outer cover, the stage before outer cover is installed to wiring substrate, use and then use resin, then, outer cover is fixed on wiring substrate, with then making electronic device and outer cover then also passable mutually with resin.
In addition, then the main component with resin can be a resin, and it is all right to contain pigment such as foregoing carbon and curing agent.
In addition, electronic device 6～9,26,27,30,31,35,36,43,44 and 53～55, can be have the scolding tin plush copper the plush copper format permutation electronic device or form the surface-mountable electronic device of electrode in the end, even but connect the electronic device of face format permutation, also can comprise input and output terminal in the side.
In addition, be loaded in the electronic device of wiring substrate, use the number of electric parts of then following, in illustrated example, be 2 or 3, but also can more than 4 with resin.
As previously mentioned, according to the present invention, because it is mechanical integrated with then forming with resin to be installed in the 1st and the 2nd device of wiring substrate, therefore, even at least one side of the 1st and the 2nd device weakens wiring substrate generation pull-out capacity, also can prevent because of falling or bending etc. causes coming off of these devices to the impact of wiring substrate or damages.
In addition, form the 1st and the 2nd mechanical integrated device like this, help forming the competent structure that adds of the rupture strength that can improve wiring substrate.Therefore, can prevent because of falling or bending etc. causes producing on the wiring substrate damage of fracture etc. to the impact of wiring substrate.In addition, like this, when strengthening wiring substrate, wiring substrate is not flexible, therefore, can prevent and to come off or damage with the device of then following with resin.
In the present invention, the 1st device, it is the electronic device that is loaded in wiring substrate by welding, the 2nd device, be the overlay electronic device, be fixed on the outer cover of wiring substrate, then be used in above the electronic device with resin and the upper wall of outer cover below between the time, electronic device and outer cover adopt and then are bonded with each other with resin, and outer cover is improved the constant intensity of wiring substrate.Therefore, the impact of avoiding easily falling etc. causes coming off of outer cover.
In addition, utilize use between electronic device and outer cover then use resin, outer cover and electronic device and the wiring substrate gap between is separately kept certain, can avoid the flutter that causes by such gap variation easily.
In addition, according to the present invention, owing to then do not contact with wiring substrate with resin, in the wave-soldering operation, even heat is sent on the scolding tin that used for electronic device is installed on the wiring substrate, makes this scolding tin fusion, also can prevent the careless short circuit between the terminal that causes electronic device of flowing of scolding tin.Promptly also, if then run into wiring substrate and overlay electronic device in use with resin, in the wave-soldering operation, the scolding tin that used for electronic device is installed expands because of fusion, for this reason, on the resin of overlay electronic device, produce stress, between resin and wiring substrate, produce interface peel sometimes.In addition, if produce interface peel, partly have the scolding tin of fusion to flow at interface peel, the result is loaded between the different terminal electrodes of the electronic device on the wiring substrate sometimes by the scolding tin short circuit.To this, the present invention does not make then and runs into wiring substrate with resin, thereby can avoid foregoing problems.
In addition, owing to then in outer cover, use, can not damage the top flatness of outer cover with resin.For this reason, can not only realize the raising of mechanical strength, be exactly in the present invention electronic installation when installing on mainboard, also can keep this electronic installation by vacuum attraction anchor clamps etc. really.And then the reliability in the raising installation procedure.
In the present invention, on the upper wall of outer cover, be provided with from the outside and import the hole of then using, after outer cover is fixed on wiring substrate, can easily will then import between electronic device and outer cover with resin with resin.Therefore, for importing the electronic installation that then is judged to defective products with the stage before the resin, electronic device wherein can be taken off from wiring substrate, for utilization again, special is favourable for the electronic device that resembles the high price the IC chip.
When utilizing, can prevent that foreign matter is in hole intrusion outer cover then with resin obstruction aforementioned apertures.Especially, when in outer cover, forming the high space of sealing, utilize and then use the resin plugging hole, help guaranteeing sealing.In addition, when the hole was then stopped up with resin, the sorption position of the sorption mouth of fitting machine can be unrestricted in the installation procedure.When the hole is set at the central authorities of the upper wall of leaving outer cover, when departing from the position of perimeter sides, can items such as mark be set in the wider field of the upper wall central authorities of outer cover, simultaneously, also can make the hole play the expression direction.At this moment, as then comprising pigment such as carbon with resin, the hole can also be by then becoming the black etc. of carbon with coloring resin.Make with the aberration of outer cover distinctly more, the aforementioned function that serves as a mark is more obvious.
When then using the resin bridging in a plurality of electronic device, can make the plan position approach between these electronic devices concern not change, for example, in the wave-soldering operation, even electronic device is installed the scolding tin generation fusion of usefulness, also can suppress electronic device separately between move, the result avoids the flutter of electronic installation easily.
Electronic device has the face that resin forms at least above it, follow with resin when the face that this resin is constituted engages, and can improve the bond strength of following with resin and electronic device.
When outer cover is made of metal, can utilize outer cover to realize the effect of shielding.Therefore, the present invention is specially adapted to the high-frequency electronic device.In addition, the outer cover that metal constitutes can utilize welding that wiring substrate is fixed, and on outer cover and wiring substrate, the part of tractive connections such as pawl and the assembling procedure of being correlated with need not be set, and can realize the attenuating of device cost and technology cost.
Between the side walls of outer cover and wiring substrate during configuration the 3rd device, as between this side walls and the 3rd device, forming the gap, even undesirable departing from appears in the fixed position of outer cover, can prevent that outer cover and the 3rd device from directly colliding, prevent the damage of the 3rd device, simultaneously, also avoid the problem of outer cover easily to the reduction of the constant intensity of wiring substrate.
If then with resin be used in the area maximum electronic device above, can avoid taking place then the situation of dropping down the side of electronic device when the unhardened state with resin then do not run into wiring substrate owing to do not allow with resin, this is realization easily also.
If then with resin be used in highly the highest electronic device above, then electronic device and outer cover are bonded with each other with a spot of with resin, for this reason, the unhardened side that just more is difficult for dropping down electronic device with resin of following.
In addition, electronic installation in the present invention, comprise the 1st and the 2nd electronic device, when then the 1st electronic device being engaged with outer cover with resin with the 1st, and, when then the 1st electronic device being engaged with the 2nd electronic device with resin with the 2nd, then use resin as the 1st, then compare with resin with the 2nd, under unhardened state, viscosity is low and the thixotropism index is little, then use resin for the 1st, above the 1st electronic device, do slick and sly broadness, then use resin for the 2nd, can positively not drop down on the wiring substrate.
In the present invention, the the 1st and the 2nd device, be respectively when being loaded in the 1st and the 2nd electronic device of wiring substrate by welding, when being installed to electronic installation of the present invention on the mainboard through the wave-soldering operation, even connect the scolding tin fusion of electronic device and wiring substrate, can prevent that also this electronic device from undesirable moving being taken place by electronic device through following the opposing party who follows with it with resin.In addition, can prevent to cause the electric short circuit that causes by scolding tin because of aforesaid electronic device takes place by undesirable moving.
In the present invention, with a side who follows the 1st and the 2nd electronic device of following mutually with resin, for example the IC chip device, be when being loaded in electronic device midplane size the maximum of wiring substrate, effect is bigger aspect the mechanical strength that improves aforesaid electronic installation, in addition, on the electronic device of such planar dimension maximum, use the electronic device of following the opposing party who follows with resin, be when being loaded in the big person of electronic device midplane size time on the wiring substrate, more to help improving aforementioned effect.
In addition, as electronic device, comprise the 1st electronic device and be disposed at relative with the 1st electronic device to the 2nd and the 3rd electronic device of each side the time, the 1st electronic device and the 2nd and the 3rd electronic device are separately respectively with then following mutually with resin, because the planar dimension of these electronic device integral body of the 1st～the 3rd can be done greatlyyer, aspect the mechanical strength that improves electronic installation, has bigger effect.
Among the present invention, following the 1st and the 2nd electronic device that is bonded with each other with resin except using, also comprise cover these electronic devices, when being fixed on the outer cover of wiring substrate, as then being attached to this outer cover with resin, not only with then making electronic device mechanical integrated with resin, and outer cover like this, can be further enhanced the mechanical strength of electronic installation also by integrated.
Claims (21)
1. an electronic installation is characterized in that, comprises
Wiring substrate, and
Be installed in the 1st device and the 2nd device on the described wiring substrate;
Described the 1st device and the 2nd device use and do not run into then being bonded with each other with resin of described wiring substrate.
2. electronic installation as claimed in claim 1 is characterized in that,
Described the 1st device comprises at least by welding and is loaded in 1 surface installing type electronic device on the described wiring substrate,
Described the 2nd device comprises the outer cover that is fixed on described wiring substrate so that cover described electronic device,
Describedly then be between upper wall following of top and described outer cover of described electronic device with resin.
3. electronic installation as claimed in claim 2 is characterized in that,
Upper wall setting at described outer cover imports the described hole of then using with resin from the outside.
4. electronic installation as claimed in claim 3 is characterized in that,
Described hole is then stopped up with resin with described.
5. electronic installation as claimed in claim 3 is characterized in that,
Described hole is set at the central authorities of the upper wall of leaving described outer cover and the position of departing from perimeter sides.
6. electronic installation as claimed in claim 2 is characterized in that,
Described the 1st device comprises a plurality of described electronic devices,
The described resin of then using, bridging is on a plurality of described electronic devices at least.
7. electronic installation as claimed in claim 2 is characterized in that,
Described electronic device has the face that resin forms at least in the above,
The described face that then with resin described resin is formed engages.
8. electronic installation as claimed in claim 2 is characterized in that,
Described outer cover constitutes with metal.
9. electronic installation as claimed in claim 8 is characterized in that,
Described outer cover is fixed by welding in described wiring substrate.
10. electronic installation as claimed in claim 2 is characterized in that, also comprises
Be disposed at the side walls of described outer cover and the 3rd device between described wiring substrate,
Between the side walls of described outer cover and described the 3rd device, form the gap.
11. electronic installation as claimed in claim 2 is characterized in that,
Described the 1st device comprises a plurality of described electronic devices,
A plurality of described electronic devices have mutual different area above,
Described then with resin be added at least the area maximum described electronic device above.
12. electronic installation as claimed in claim 2 is characterized in that,
Described the 1st device comprises a plurality of described electronic devices,
A plurality of described electronic devices have different height mutually,
Described then with resin be added at least the highest described electronic device above.
13. electronic installation as claimed in claim 2 is characterized in that,
Described electronic device comprises the 1st and the 2nd electronic device,
Describedly then use resin, comprise make that described the 1st electronic device engages with described outer cover the 1st then use resin, and make that described the 1st electronic device engages with described the 2nd electronic device the 2nd then use resin,
The described the 1st then then has nothing in common with each other with resin composition separately with resin and the described the 2nd.
14. electronic installation as claimed in claim 13 is characterized in that,
The described the 1st then with resin and the described the 2nd then with resin relatively, and under unhardened state, viscosity is low and the thixotropism index is little.
15. electronic installation as claimed in claim 1 is characterized in that,
Described the 1st device and described the 2nd device comprise the 1st surface installing type electronic device and the 2nd surface installing type electronic device that is loaded in described wiring substrate by welding respectively.
16. electronic installation as claimed in claim 15 is characterized in that,
With a described side who follows the described the 1st and the 2nd electronic device of following mutually with resin, be the electronic device midplane size the maximum that is loaded on the described wiring substrate.
17. electronic installation as claimed in claim 16 is characterized in that,
The electronic device of described planar dimension maximum is the IC chip device.
18. electronic installation as claimed in claim 16 is characterized in that,
With described then with resin then the opposing party of the described the 1st and the 2nd electronic device of the electronic device of described planar dimension maximum, be electronic device midplane size the 2nd big person who is loaded in described wiring substrate.
19. electronic installation as claimed in claim 15 is characterized in that, also comprises
Be loaded in the 3rd surface installing type electronic device of described wiring substrate by welding,
With described the 1st electronic device relative to each side dispose the described the 2nd and the 3rd electronic device respectively,
Described the 1st electronic device and the described the 2nd and the 3rd electronic device are then followed with resin with described respectively each other each other.
20. electronic installation as claimed in claim 15 is characterized in that, also comprises
Energy covers the described the 1st and the 2nd electronic device, is fixed on the outer cover of described wiring substrate,
Described following with resin also attached on the described outer cover.
21. electronic installation as claimed in claim 20 is characterized in that,
Upper wall setting at described outer cover imports the described hole of then using with resin from the outside.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002103470 | 2002-04-05 | ||
| JP2002103470 | 2002-04-05 | ||
| JP2002218350 | 2002-07-26 | ||
| JP2002218350 | 2002-07-26 | ||
| JP2003011869A JP4254248B2 (en) | 2002-04-05 | 2003-01-21 | Electronic equipment |
| JP2003011869 | 2003-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1494149A true CN1494149A (en) | 2004-05-05 |
| CN100456471C CN100456471C (en) | 2009-01-28 |
Family
ID=28678743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031077765A Expired - Fee Related CN100456471C (en) | 2002-04-05 | 2003-04-04 | Electronic apparatus |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6826053B2 (en) |
| JP (1) | JP4254248B2 (en) |
| CN (1) | CN100456471C (en) |
| TW (1) | TWI229423B (en) |
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| CN102934221A (en) * | 2010-07-08 | 2013-02-13 | 株式会社村田制作所 | Surface-mounted electronic component |
| CN106233552A (en) * | 2014-05-09 | 2016-12-14 | 株式会社自动网络技术研究所 | circuit structure and electric connection box |
| CN106463928A (en) * | 2014-05-09 | 2017-02-22 | 株式会社自动网络技术研究所 | Circuit structure, connecting busbar, and electrical junction box |
| CN107182198A (en) * | 2016-03-10 | 2017-09-19 | 欧姆龙株式会社 | Electronic component mounting method, substrate, electronic circuit and planar light source device |
| CN108029214A (en) * | 2015-09-18 | 2018-05-11 | 东丽株式会社 | Housing |
| CN108029222A (en) * | 2015-09-18 | 2018-05-11 | 东丽株式会社 | Casting of electronic device |
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| TW565009U (en) * | 2003-01-20 | 2003-12-01 | Benq Corp | Electronic module having ball grid array |
| US7186945B2 (en) * | 2003-10-15 | 2007-03-06 | National Starch And Chemical Investment Holding Corporation | Sprayable adhesive material for laser marking semiconductor wafers and dies |
| TWM261003U (en) * | 2004-02-10 | 2005-04-01 | Uniwill Comp Corp | Improved structure for obstructing spill of heat-conducting material |
| JP4553627B2 (en) * | 2004-04-30 | 2010-09-29 | 太陽誘電株式会社 | High frequency circuit module and wireless communication device |
| KR20070016383A (en) * | 2005-08-03 | 2007-02-08 | 삼성전자주식회사 | Chip type electric device and liquid crystal display module including the same |
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| JP2008288523A (en) * | 2007-05-21 | 2008-11-27 | Fujitsu Media Device Kk | Electronic part, and manufacturing method therefor |
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| JPH0547968A (en) | 1991-08-20 | 1993-02-26 | Fujitsu Ltd | Cooling structure of electronic device |
| JPH0722768A (en) | 1993-07-02 | 1995-01-24 | Sony Corp | Bonding method for conductive case |
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| JPH10209649A (en) | 1997-01-27 | 1998-08-07 | Tdk Corp | Metal case and method of manufacturing the metal case |
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| TW411037U (en) * | 1999-06-11 | 2000-11-01 | Ind Tech Res Inst | Integrated circuit packaging structure with dual directions of thermal conduction path |
-
2003
- 2003-01-21 JP JP2003011869A patent/JP4254248B2/en not_active Expired - Fee Related
- 2003-03-06 TW TW092104784A patent/TWI229423B/en not_active IP Right Cessation
- 2003-04-04 CN CNB031077765A patent/CN100456471C/en not_active Expired - Fee Related
- 2003-04-05 US US10/408,064 patent/US6826053B2/en not_active Expired - Lifetime
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| CN102934221B (en) * | 2010-07-08 | 2015-06-24 | 株式会社村田制作所 | Surface-mounted electronic component |
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| CN106233552A (en) * | 2014-05-09 | 2016-12-14 | 株式会社自动网络技术研究所 | circuit structure and electric connection box |
| CN106463928A (en) * | 2014-05-09 | 2017-02-22 | 株式会社自动网络技术研究所 | Circuit structure, connecting busbar, and electrical junction box |
| CN106463928B (en) * | 2014-05-09 | 2019-03-15 | 株式会社自动网络技术研究所 | Circuit structure, connection bus and electric connection box |
| CN108029214A (en) * | 2015-09-18 | 2018-05-11 | 东丽株式会社 | Housing |
| CN108029222A (en) * | 2015-09-18 | 2018-05-11 | 东丽株式会社 | Casting of electronic device |
| US10509443B2 (en) | 2015-09-18 | 2019-12-17 | Toray Industries, Inc. | Housing |
| CN108029214B (en) * | 2015-09-18 | 2020-07-24 | 东丽株式会社 | Shell body |
| US10908651B2 (en) | 2015-09-18 | 2021-02-02 | Toray Industries, Inc. | Electronic device housing |
| CN107182198A (en) * | 2016-03-10 | 2017-09-19 | 欧姆龙株式会社 | Electronic component mounting method, substrate, electronic circuit and planar light source device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030189814A1 (en) | 2003-10-09 |
| JP2004111897A (en) | 2004-04-08 |
| TW200305259A (en) | 2003-10-16 |
| US6826053B2 (en) | 2004-11-30 |
| TWI229423B (en) | 2005-03-11 |
| JP4254248B2 (en) | 2009-04-15 |
| CN100456471C (en) | 2009-01-28 |
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