JPH08167680A - Electronic circuit module - Google Patents

Abstract

PURPOSE: To enlarge the heat radiation effect of the semiconductor electronic part of an electronic circuit module by injecting rein excellent in heat conductive from a resin injection ports provided at proper places of a metallic case so as to bond a substrate and a metallic case. CONSTITUTION: A hole 9 for resin injection of a metallic case 8 is opened beforehand in a metallic case 8 so that it may be positioned above the center of the mold part 5 covering a semiconductor electronic part 3, when the metallic case 8 is attached to it. Resin 10 in the space between the mold 5 and the hole 9 is one whose injection through the hole 9 is controlled after assembly of a module M, and it is heat-radiative silicon resin excellent in heat conductivity, or the like, and after injection, it hardens. Hereby, the semiconductor electronic part 3 and the metallic case 9 are coupled with each other by the resin 10 excellent in heat conductivity, and the heat radiation and hardening of the semiconductor electronic part 3 in the electronic circuit module can be enlarged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit module such as a high frequency power amplifier.

In other words, the present invention relates to an electronic circuit module in which electronic components such as passive elements and active elements designed to be mounted on the surface of a circuit are wired and combined to be integrated in one package.

The present invention will be more specifically described. The present invention relates to a heat dissipation structure of an electronic circuit module.

[0004]

2. Description of the Related Art To manufacture an electronic circuit module, first, a plurality of wiring circuit patterns are formed by printing and firing on an insulating collective substrate made of alumina, ceramics or the like.

After that, electronic components of a surface mounting device (SMD) designed to be mounted on the surface of the wiring circuit are mounted for each wiring circuit pattern.

Specifically, as shown in the schematic cross-sectional view of FIG. 2, an SMD component 2 which is a passive element such as a resistor or a capacitor is mounted on a substrate 1 and an active element such as a diode or a transistor is mounted. Electronic components that are elements,
For example, a surface mounting type semiconductor electronic component 3 such as a bare chip or a molded transistor is mounted.

The semiconductor electronic component 3 is connected to a wiring circuit by a wire 4 and a resin-molded portion 5 is used.
Are formed.

After these components are mounted, as shown in FIG. 2, each wiring circuit pattern is divided into individual substrates 1.

To the divided substrate 1, leads 6 for terminals are attached, a radiator plate 7 is attached, and a metal case 8 is attached.

[0010]

[Problems to be Solved by the Invention]
Since the mold part 5 covering the semiconductor electronic component 3 such as a chip is made of a fluid resin, the height of the mold part 5 varies and the height of the mold part 5 varies. .

Therefore, a gap 11 is required between the metal case 8 attached to the substrate 1 and the substrate 1, and as a result, heat radiation from the mold portion 5 of the semiconductor electronic component 3 is reduced. There was a drawback that it would end up.

Further, in the case of the molded transistor, although the molded portion 5 is not necessary (not shown), a slight gap is generated between the metal case attached to the substrate and this substrate, As a result, there is a drawback that the heat radiation from the semiconductor electronic component becomes small.

The present invention was developed for the purpose of improving the heat radiation effect in a module of a high-frequency power amplifier, in other words, for the purpose of increasing the heat radiation effect of a semiconductor electronic component in an electronic circuit module. is there.

[0014]

In order to solve the above problems, the present invention provides an insulating substrate, a wiring circuit formed on the upper surface of the substrate, and a semiconductor electronic component mounted on the wiring circuit. And an electronic circuit module having a metal case that substantially covers the substrate, the wiring circuit, and the semiconductor electronic component, and a resin injection hole formed in an appropriate place of the metal case; and the substrate and the metal case. And a resin having a good thermal conductivity, which is disposed in a space between them, respectively. Further, in the electronic circuit module of the present invention, a resin injection hole opened in an appropriate place of the metal case near the position of the semiconductor electronic component, and a heat conduction member disposed in a gap between the hole and the semiconductor electronic component. It is characterized by having a resin with good properties, respectively.

In other words, according to the present invention, in order to improve the heat radiation effect in the module of the high frequency power amplifier, that is, to increase the heat radiation of the semiconductor electronic component, the upper surface of the mold portion of the bare chip and the metal case of the module are provided. Between them, or between the upper surface of the molded transistor and the metal case of the module with a resin having good thermal conductivity.

[0016]

As a result, the metal case and the molded portion of the bare chip, in other words, the metal case and the semiconductor electronic component are connected by the resin having good heat dissipation, so that the bare chip or the like is conventionally used. Only the heat dissipation plate below the semiconductor electronic component was the heat dissipation path, but in addition to this,
According to the present invention, it is possible to radiate heat from the upper metal case with the resin having good heat radiation interposed.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings with reference to its embodiments.

FIG. 1 is a sectional end view showing an embodiment of a module M according to the present invention. A wiring circuit pattern (not shown) is formed on the upper surface of an insulating rectangular substrate 1, and this wiring circuit is shown. The SMD component 2 that is a passive element is mounted on the semiconductor device, and the surface-mounting type semiconductor electronic component 3 that is an active element is mounted on the SMD component 2.

The semiconductor electronic component 3 has wiring 4 in a circuit and a molded portion 5 made of resin.

The leads 6 for terminals are provided on one edge of the substrate 1,
A heat-dissipating plate 7 that is externally fitted and has an L shape as a whole is attached so as to surround the other end edge portion and the bottom surface of the substrate 1, and further a box-cover-shaped metal case 8 is provided.
It is attached so as to cover all of them.

The resin injection hole 9 of the metal case 8 has a diameter of about 1 mm, and is preliminarily made of a metal so that when the metal case 8 is attached, the resin injection hole 9 is located above the center of the mold portion 5 for covering the semiconductor electronic component 3. It is opened in Case 8.

Resin 1 in the gap between the mold part 5 and the hole 9
0 is formed by controlling the injection from the hole 9 after the module M is assembled, and is a silicone resin or the like having heat dissipation and good thermal conductivity, which is cured after injection.

The resin 10 may be filled throughout the space inside the metal case 8 of the module M.
Of course, it may of course be formed at a required location in the space inside the metal case 8.

[0024]

According to the present invention as described above, in order to improve the heat radiation effect in a module of a high frequency power amplifier, in other words, in order to increase the heat radiation of a semiconductor electronic component in an electronic circuit module, a semiconductor electronic component is provided. By connecting the resin and the metal case of the module with a resin having good thermal conductivity, as a result, thermal runaway of the semiconductor electronic components can be suppressed, and the electrical characteristics and quality of the electronic circuit module can be improved. The great effect that it improves is acquired.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an embodiment of an electronic circuit module of the present invention.

FIG. 2 is a schematic cross-sectional view showing an example of a conventional electronic circuit module.

[Explanation of symbols]

 M module 1 substrate 2 SMD component 3 semiconductor electronic component 4 wire 5 mold part 6 lead 7 heat sink 8 case 9 hole 10 resin

Claims (2)

[Claims] 1. An insulating substrate, a wiring circuit formed on the substrate, a semiconductor electronic component mounted on the wiring circuit, and a metal case that covers the substrate, the wiring circuit, and the semiconductor electronic component. An electronic circuit module comprising: a resin injection hole formed in an appropriate place of the metal case; and a resin having good thermal conductivity formed in a space between the substrate and the metal case. An electronic circuit module further comprising: 2. An insulating substrate, a wiring circuit formed on the substrate, a semiconductor electronic component mounted on the wiring circuit, and a metal case that covers the substrate, the wiring circuit, and the semiconductor electronic component. An electronic circuit module comprising: a resin injection hole is formed at a suitable position of the metal case and close to the semiconductor electronic component, and a thermal conductive material is provided in a gap between the hole and the semiconductor electronic component. Electronic circuit module characterized by being filled with good resin.