WO2024047751A1

WO2024047751A1 - Electronic component support structure

Info

Publication number: WO2024047751A1
Application number: PCT/JP2022/032593
Authority: WO
Inventors: 賢一山口; 浩二金子
Original assignee: Tdk株式会社
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2024-03-07

Abstract

This electronic component support structure is a support structure for supporting an electronic component provided on a substrate, and is provided with a cover member that covers the electronic component. The cover member is an integral structure with a cover component that covers an interface portion for external connection to the substrate.

Description

Support structure for electronic components

The present disclosure relates to a support structure for electronic components.

Conventionally, as a support structure for an electronic component that supports an electronic component provided on a board, one described in Patent Document 1 is known. This support structure supports electronic components mounted on a board by covering the periphery of the electronic components with a housing. Further, the bottom of the casing supports the base of the electronic component with a convex-concave structure.

Japanese Patent Application Publication No. 2020-155567

However, when the vibration conditions of an electronic unit in which the board is used become severe, problems such as electronic components falling off the board arise due to insufficient vibration-proofing effect of the support structure. On the other hand, if the number of members for vibration isolation is increased, problems arise such as an increase in the number of parts, an increase in the weight of the electronic unit itself due to the increase in the number of parts, and an increase in the number of assembly steps. Therefore, there has been a need for a support structure for electronic components that can prevent electronic components from falling off by increasing the vibration damping effect while suppressing an increase in the number of components.

An object of the present disclosure is to provide a support structure for electronic components that can enhance the vibration isolation effect while suppressing an increase in the number of components.

An electronic component support structure according to one embodiment of the present disclosure is an electronic component support structure that supports an electronic component provided on a board, and includes a cover member that covers the electronic component, and the cover member is arranged with respect to the board. It has an integrated structure with a cover part that covers the interface section that performs external connections.

In the electronic component support structure according to one embodiment of the present disclosure, the cover member can support the electronic component and suppress vibration by covering the electronic component. Here, the interface section that connects externally to the board has a strong fixing structure as required by the required specifications. Therefore, by forming the cover member into an integral structure with the cover part that covers the interface part, the strong fixing structure in the interface part can be used without increasing the number of parts. As described above, the vibration isolation effect can be enhanced while suppressing an increase in the number of parts.

An elastic member may be placed between the electronic component and the cover member. In this case, the elastic member can further improve the vibration isolation effect of the electronic component. Furthermore, heat can be transferred between the electronic component and the cover member via the elastic member.

A hole may be formed in the cover member. In this case, the presence or absence of the elastic member and the degree of filling can be confirmed from the outside of the cover member through the hole. Moreover, the elastic member enters into the hole by being pressed by the inner surface of the ceiling wall of the cover member that faces the top surface of the electronic component. Furthermore, the elastic member may reach the outer surface of the ceiling wall and spread along the outer surface of the ceiling wall. In this case, the elastic member can three-dimensionally increase the contact surface with the cover member over a wide range of areas such as the inner surface of the ceiling wall, the inner wall of the hole, and the outer surface of the top plate, thereby improving the vibration isolation effect.

The cover member has an electronic component region that covers the electronic component and an interface region that constitutes an interface section, a first fastening section that fixes the cover member is formed in the electronic component region, and a cover member in the interface region. A second fastener may be formed to secure the member. In this case, the second fastening part of the interface area can be used as a fixing part for the electronic component area. Therefore, the number of fixing parts can be reduced compared to the case where the cover member and the interface part are provided separately.

According to the present disclosure, it is possible to provide a support structure for electronic components that can enhance the vibration isolation effect.

FIG. 1 is a perspective view showing a support structure for electronic components according to an embodiment of the present disclosure. FIG. 1 is a developed perspective view of a support structure for electronic components according to an embodiment of the present disclosure. It is a perspective view showing the back side of a cover member. 2 is a sectional view taken along line IV-IV in FIG. 1. FIG. FIG. 7 is a perspective view showing a support structure for electronic components according to a comparative example. FIG. 7 is a cross-sectional view showing a support structure for electronic components according to a modification. FIG. 7 is a cross-sectional view showing a support structure for electronic components according to a modified example.

A support structure 1 for an electronic component 4 according to an embodiment of the present disclosure will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view showing a support structure 1 according to this embodiment of the present disclosure. FIG. 2 is a cross-sectional perspective view of the support structure 1 according to the embodiment of the present disclosure. 3 is a perspective view showing the back side of the cover member shown in FIG. 2. FIG.

As shown in FIGS. 1 and 2, the support structure 1 is a structure that supports an electronic component 4 provided on a substrate 3 or the like. The support structure 1 is applied, for example, to an electronic unit 100 configured by accommodating a board, electronic components, etc. in an internal space of a box-shaped accommodating body. Examples of the electronic unit 100 include a DC/DC converter, a charger, and an ECU (engine control unit). In FIGS. 1 and 2, a portion of such an electronic unit 100 is shown. The electronic unit 100 includes a support structure 1 at least in part. The support structure 1 includes a base plate 2, a substrate 3, an electronic component 4, an interface section 6, and a cover member 7.

As shown in FIGS. 1 and 2, the base plate 2 is a structure that supports a substrate 3, an electronic component 4, an interface section 6, and a cover member 7. The base plate 2 is a member that constitutes a container that houses the above-mentioned electronic unit. The base plate 2 has a main surface 2a that supports the components of the electronic unit. The base plate 2 has protrusions and grooves on its main surface 2a that supports the components. Note that the following explanation may be made using XYZ coordinates. The X-axis direction and the Y-axis direction are directions perpendicular to each other, and are plane directions in which the base plate 2 extends. The Z-axis direction is a direction perpendicular to the X-axis direction and the Y-axis, and is the thickness direction of the base plate 2. In the Z-axis direction, the main surface 2a side is the positive side. One side in the X-axis direction and the Y-axis direction is defined as a positive side, and the other side is defined as a negative side.

The substrate 3 is a plate-shaped member supported by the main surface 2a of the base plate 2. The substrate 3 extends parallel to the XY plane. The substrate 3 is spaced apart from the negative end 2b of the base plate 2 in the X-axis direction toward the positive side in the X-axis direction, and spaced apart from the positive end 2c of the base plate 2 in the Y-axis direction toward the negative side in the Y-axis direction. It is placed in the position where it will be.

As shown in FIG. 2, the electronic component 4 is a component mounted on the board 3. A plurality of electronic components 4 are mounted on the main surface 3a of the substrate 3. In this embodiment, as the electronic component 4, a plurality of capacitors 11 (four in this case) arranged in the Y-axis direction are arranged along the edge 3b of the substrate 3 on the negative side of the substrate 3 in the X-axis direction. Ru. A coil 12 is arranged as the electronic component 4 on the negative side of the arrangement of the capacitors 11 in the Y-axis direction. Further, on the negative side of the arrangement of the capacitors 11 in the Y-axis direction, a plurality of other types of capacitors 13 (here, two capacitors 13) are arranged as the electronic component 4. On the positive side of the arrangement of capacitors 11 in the Y-axis direction, a plurality of other types of capacitors 14 (two in this case) are arranged as electronic components 4. A transformer 15 is arranged on the positive side of the capacitor 14 in the X-axis direction.

The interface unit 6 is a part that connects the board 3 with external equipment (external connection). The interface section 6 includes a terminal block 22 provided on the substrate 3, a nut 21 embedded in the cylindrical cover section 52 and isolated and insulated from the base plate, and a terminal fitting 23 for connecting the nut 21 and the terminal block 22. Equipped with The interface section basically has two sets of nuts 21, terminal blocks 22, and terminal fittings 23. The terminal block 22 is provided on the substrate 3 at a position on the negative side of the capacitor 13 in the Y-axis direction. One end of the terminal fitting 23 is fastened to the terminal block 22 provided on the board 3 via a bolt. The terminal fitting 23 has a through hole 23a on the other end side. The through hole 23a is arranged coaxially with the hole of the nut 21. Although not shown, connection with the external device is achieved by tightening the connection terminal on the external device side and the through hole 23a on the other end side of the terminal fitting 23 together with the hole of the nut 21 with a bolt. The interface section 6 includes a cover component 25 that covers the nut 21 and the terminal fitting 23.

The cover member 7 is a member that covers the electronic component 4. Further, the cover member 7 has an integral structure with a cover component 25 that covers the interface section 6 that makes an external connection to the board 3. Specifically, the cover member 7 has an electronic component area 30 that covers the electronic component 4 and an interface area 31 that constitutes the interface section 6. The interface area 31 of the cover member 7 constitutes the cover part 25 of the aforementioned interface part 6.

The electronic component area 30 includes a first area 32 that covers the capacitor 11, a second area 33 that covers the coil 12, a third area 34 that covers the two capacitors 13, and a fourth area that covers the two capacitors 14. A region 36 and a fifth region 37 covering the transformer 15 are provided.

As shown in FIG. 3, the first region 32 has a substantially U-shaped cross-sectional shape and extends in the Y-axis direction so as to cover the plurality of capacitors 11 (see FIG. 2) arranged in the Y-axis direction. . Specifically, the first region 32 includes an upper wall portion 41 that covers the capacitor 11 from the positive side in the Z-axis direction, a side wall portion 42 that covers the capacitor 11 from the positive side in the X-axis direction, and a side wall portion 42 that covers the capacitor 11 from the positive side in the X-axis direction. It has a side wall part 43 that covers from the negative side.

The second region 33 has an upper wall portion 44 that covers the coil 12 (see FIG. 2) from the positive side in the Z-axis direction, and a side wall portion 46 that covers the coil 12 from all sides. The third region 34 includes an upper wall portion 47 that covers the capacitor 13 (see FIG. 2) from the positive side in the Z-axis direction, a side wall portion 48 that covers the capacitor 13 from the positive side in the X-axis direction, and a side wall portion 48 that covers the capacitor 13 from the positive side in the X-axis direction. It has a side wall portion 49 that covers from the negative side of the direction. The fourth region 36 has an upper wall portion 50 that covers the capacitor 14 (see FIG. 2) from the positive side in the Z-axis direction. The fifth region 37 has an upper wall portion 51 that covers the transformer 15 from the positive side in the Z-axis direction.

Note that each of the

upper wall portions

41, 44, 47, 50, and 51 has a ceiling wall extending along the XY plane and a rib portion rising in the Z-axis direction. Each

upper wall portion

41, 44, 47, 50, 51 is divided into a plurality of sections by rib portions.

As shown in FIGS. 1 and 2, the interface area 31 has a pair of cylindrical cover parts 52 in which the pair of nuts 21 of the interface part 6 are embedded. The other end of the terminal fitting 23 is arranged on the upper surface of the cylindrical cover part 52. Note that FIG. 2 shows one end of the terminal fitting 23 being connected to the terminal block 22 with a bolt. It also shows how the other end of the terminal fitting 23 is connected to the nut 21 (including the external device by being tightened together with the nut 21 by a connecting terminal and bolt on the external device side, not shown). There is. The other ends of the nut 21 and the terminal fitting 23 are integrally molded with the interface area 31. Therefore, when attaching the cover member 7 to the base plate 2, the terminal fittings 23 are fixed to the interface area 31. Further, the interface area 31 has a connecting part 53 that is connected to the electronic component area 30. The connecting portion 53 connects the corner of the third region 34 and the pair of cylindrical cover portions 52 .

As shown in FIG. 2, two

first fastening parts

56 and 57 are formed in the electronic component area 30 for fixing the cover member 7, and two

second fastening parts

56 and 57 for fixing the cover member 7 are formed in the interface area 31. Fastening

portions

58 and 59 are formed. One first fastening portion 56 is provided at the negative end of the first region 32 in the X-axis direction. The other first fastening portion 57 is provided at the positive end of the fourth region 36 in the Y-axis direction. One second fastening portion 58 is provided at the negative end of the interface region 31 in the X-axis direction. The other second fastening section 59 is provided at the connecting section 53 of the interface area 31 . The

fastening parts

56, 57, 58, 59 have through holes, and the through holes are arranged coaxially with the holes provided on the boss parts 61, 62, 63, 64 provided on the base plate 2. will be placed in The

fastening parts

56, 57, 58, 59 are fastened to the boss parts 61, 62, 62, 64 by inserting bolts into the through holes and fastening them to the holes of the boss parts 61, 62, 63, 64. Ru.

An elastic member 60 is arranged between the electronic component 4 and the cover member 7. For example, a resin adhesive is used as the elastic member 60. As shown in FIG. 2, before attaching the cover member 7 to the base plate 2, an elastic member 60 is applied to the upper surface of each electronic component 4. In the figure, the elastic member 60 is shown in gray scale.

As shown in FIGS. 2 and 3, a hole 71 is formed in the cover member 7, and the hole 71 penetrates the ceiling walls of the

upper walls

41, 44, 47, 50, and 51 in the Z-axis direction. They are each formed as follows. Although rectangular holes 71 are formed at each position of the

upper wall parts

41, 44, 47, 50, and 51, the shape, position, and number are not particularly limited.

With reference to FIG. 4, an example of a configuration in which the capacitor 11 is covered with the cover member 7 will be described. The negative end of the capacitor 11 in the Y-axis direction and the side wall 42 of the cover member 7 face each other with a gap in the X-axis direction. The positive end of the capacitor 11 in the Y-axis direction and the side wall 43 of the cover member 7 face each other with a gap in the X-axis direction. The positive end of the capacitor 11 in the Z-axis direction and the inner surface of the ceiling wall 41a of the upper wall portion 41 of the cover member 7 face each other with a gap in the Z-axis direction.

Before covering the capacitor 11 with the cover member 7, the elastic member 60 was applied to the positive end surface of the capacitor 11 in the Z-axis direction. Therefore, when the capacitor 11 is covered with the cover member 7, the elastic member 60 is sandwiched between the capacitor 11 and the ceiling wall 41a. Thereby, the elastic member 60 is arranged between the capacitor 11 and the cover member 7. The elastic member 60 expands in the gap between the capacitor 11 and the ceiling wall 41a.

Here, a hole 71 is formed in the ceiling wall 41a. Therefore, a portion of the elastic member 60 is pushed out from the hole 71 toward the positive side in the Z-axis direction and is disposed on the outer surface of the ceiling wall 41a. Note that the outer surface of the ceiling wall 41a is partitioned by ribs 41b. Therefore, the pushed out elastic member 60 accumulates in the area where the hole 71 is formed among the areas separated by the ribs 41b (see FIG. 1).

Next, the functions and effects of the electronic component support structure 1 according to the present embodiment will be explained.

First, a support structure 200 according to a comparative example will be described with reference to FIG. 5. The support structure 200 according to the comparative example does not have the cover member 7. The interface section 6 has a cover part 25. In this support structure 200, when the vibration conditions of the electronic unit in which the board 3 is used become severe, problems such as the electronic components 4 falling off from the board 3 due to the insufficient vibration-proofing effect of the support structure 200 occur. occurs.

In contrast, in the support structure 1 according to the present embodiment, the cover member 7 can support the electronic component 4 by covering the electronic component 4, and can suppress vibration. Here, the interface unit 6 that connects externally to the board 3 has a strong fixing structure as required by the required specifications. Therefore, by forming the cover member 7 into an integral structure with the cover component 25 that covers the interface section 6, the strong fixing structure of the interface section 6 can be used without increasing the number of parts. As described above, the vibration isolation effect can be enhanced while suppressing an increase in the number of parts. Further, the cover member 7 can improve the vibration isolation performance of both SMT products (transformers, etc.) and discrete products (capacitors, etc.).

An elastic member 60 may be arranged between the electronic component 4 and the cover member 7. In this case, the elastic member 60 can further improve the vibration isolation effect of the electronic component 4. Furthermore, heat can be transferred between the electronic component 4 and the cover member 7 via the elastic member 60.

A hole 71 may be formed in the cover member 7. In this case, the presence or absence of the elastic member 60 and the filling condition can be confirmed from the outside of the cover member 7 through the hole 71. Moreover, the elastic member enters into the hole by being pressed by the inner surface of the ceiling wall of the cover member that faces the top surface of the electronic component. Furthermore, the elastic member may reach the outer surface of the ceiling wall and spread along the outer surface of the ceiling wall. In this case, the elastic member 60 can three-dimensionally increase the contact surface with the cover member 7 over a wide range of areas such as the inner surface of the ceiling wall, the inner wall of the hole, and the outer surface of the top plate, thereby improving the vibration isolation effect. can.

The cover member 7 has an electronic component region 30 that covers the electronic component 4 and an interface region 31 that constitutes the interface section 6, and a first fastening section 56 that fixes the cover member 7 to the electronic component region 30. , 57 may be formed, and

second fastening parts

58 and 59 for fixing the cover member 7 may be formed in the interface area 31. In this case, the

second fastening parts

58 and 59 of the interface area 31 can be used as fixing parts for the electronic component area. Therefore, the number of fixing parts can be reduced compared to the case where the cover member 7 and the interface part 6 are provided separately.

The present disclosure is not limited to the embodiments described above.

The arrangement and shape of each member shown in each drawing are merely examples, and can be changed as appropriate without departing from the spirit of the present disclosure.

For example, the contents and arrangement of the electronic components 4 can be changed as appropriate, and the configuration of the cover member 7 can also be changed accordingly.

Although no partition wall was provided between adjacent capacitors 11 in the electronic component area 30 of the cover member 7, a partition wall 70 may be provided as shown in FIG. Note that, in order to prevent the flow of the elastic member 60 from being blocked by the partition wall 70, the partition wall 70 may be provided at both ends in the X-axis direction, and the partition wall 70 may not be provided at the center. Furthermore, although the outer surface of the ceiling wall 41a is divided by ribs 41b, as shown in FIG. good.

In the above-described embodiment, a structure having a terminal block as an interface section was exemplified. However, the structure of the interface section is not particularly limited as long as it can be connected to the outside, and for example, a structure such as a connector or a bus bar may be adopted.

Additionally, the elastic member 60 may be omitted.

DESCRIPTION OF SYMBOLS 1...Support structure, 3...Substrate, 6...Interface part, 7...Cover member, 11...Electronic component, 30...Electronic component area, 31...Interface area, 56, 57...First fastening part, 58, 59...th 2 fastening portion, 60... elastic member, 71... hole.

Claims

An electronic component support structure that supports electronic components provided on a board,
comprising a cover member that covers the electronic component,
The support structure for electronic components is such that the cover member has an integral structure with a cover part that covers an interface section that makes an external connection to the board.
The support structure for an electronic component according to claim 1, wherein an elastic member is disposed between the electronic component and the cover member.
The support structure for an electronic component according to claim 2, wherein a hole is formed in the cover member.
The cover member has an electronic component area that covers the electronic component, and an interface area that configures the interface section,
Any one of claims 1 to 3, wherein a first fastening portion for fixing the cover member is formed in the electronic component region, and a second fastening portion for fixing the cover member is formed in the interface region. A support structure for the electronic component according to item 1.