WO2024047751A1 - Structure de support de composant électronique - Google Patents

Structure de support de composant électronique Download PDF

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Publication number
WO2024047751A1
WO2024047751A1 PCT/JP2022/032593 JP2022032593W WO2024047751A1 WO 2024047751 A1 WO2024047751 A1 WO 2024047751A1 JP 2022032593 W JP2022032593 W JP 2022032593W WO 2024047751 A1 WO2024047751 A1 WO 2024047751A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
cover member
support structure
axis direction
covers
Prior art date
Application number
PCT/JP2022/032593
Other languages
English (en)
Japanese (ja)
Inventor
賢一 山口
浩二 金子
Original Assignee
Tdk株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk株式会社 filed Critical Tdk株式会社
Priority to PCT/JP2022/032593 priority Critical patent/WO2024047751A1/fr
Publication of WO2024047751A1 publication Critical patent/WO2024047751A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Definitions

  • the present disclosure relates to a support structure for electronic components.
  • Patent Document 1 As a support structure for an electronic component that supports an electronic component provided on a board, one described in Patent Document 1 is known.
  • This support structure supports electronic components mounted on a board by covering the periphery of the electronic components with a housing. Further, the bottom of the casing supports the base of the electronic component with a convex-concave structure.
  • An object of the present disclosure is to provide a support structure for electronic components that can enhance the vibration isolation effect while suppressing an increase in the number of components.
  • An electronic component support structure is an electronic component support structure that supports an electronic component provided on a board, and includes a cover member that covers the electronic component, and the cover member is arranged with respect to the board. It has an integrated structure with a cover part that covers the interface section that performs external connections.
  • the cover member can support the electronic component and suppress vibration by covering the electronic component.
  • the interface section that connects externally to the board has a strong fixing structure as required by the required specifications. Therefore, by forming the cover member into an integral structure with the cover part that covers the interface part, the strong fixing structure in the interface part can be used without increasing the number of parts. As described above, the vibration isolation effect can be enhanced while suppressing an increase in the number of parts.
  • An elastic member may be placed between the electronic component and the cover member.
  • the elastic member can further improve the vibration isolation effect of the electronic component. Furthermore, heat can be transferred between the electronic component and the cover member via the elastic member.
  • a hole may be formed in the cover member.
  • the presence or absence of the elastic member and the degree of filling can be confirmed from the outside of the cover member through the hole.
  • the elastic member enters into the hole by being pressed by the inner surface of the ceiling wall of the cover member that faces the top surface of the electronic component.
  • the elastic member may reach the outer surface of the ceiling wall and spread along the outer surface of the ceiling wall. In this case, the elastic member can three-dimensionally increase the contact surface with the cover member over a wide range of areas such as the inner surface of the ceiling wall, the inner wall of the hole, and the outer surface of the top plate, thereby improving the vibration isolation effect.
  • the cover member has an electronic component region that covers the electronic component and an interface region that constitutes an interface section, a first fastening section that fixes the cover member is formed in the electronic component region, and a cover member in the interface region.
  • a second fastener may be formed to secure the member.
  • the second fastening part of the interface area can be used as a fixing part for the electronic component area. Therefore, the number of fixing parts can be reduced compared to the case where the cover member and the interface part are provided separately.
  • FIG. 1 is a perspective view showing a support structure for electronic components according to an embodiment of the present disclosure.
  • FIG. 1 is a developed perspective view of a support structure for electronic components according to an embodiment of the present disclosure. It is a perspective view showing the back side of a cover member. 2 is a sectional view taken along line IV-IV in FIG. 1.
  • FIG. FIG. 7 is a perspective view showing a support structure for electronic components according to a comparative example.
  • FIG. 7 is a cross-sectional view showing a support structure for electronic components according to a modification.
  • FIG. 7 is a cross-sectional view showing a support structure for electronic components according to a modified example.
  • FIG. 1 is a perspective view showing a support structure 1 according to this embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional perspective view of the support structure 1 according to the embodiment of the present disclosure.
  • 3 is a perspective view showing the back side of the cover member shown in FIG. 2.
  • the support structure 1 is a structure that supports an electronic component 4 provided on a substrate 3 or the like.
  • the support structure 1 is applied, for example, to an electronic unit 100 configured by accommodating a board, electronic components, etc. in an internal space of a box-shaped accommodating body.
  • Examples of the electronic unit 100 include a DC/DC converter, a charger, and an ECU (engine control unit).
  • FIGS. 1 and 2 a portion of such an electronic unit 100 is shown.
  • the electronic unit 100 includes a support structure 1 at least in part.
  • the support structure 1 includes a base plate 2, a substrate 3, an electronic component 4, an interface section 6, and a cover member 7.
  • the base plate 2 is a structure that supports a substrate 3, an electronic component 4, an interface section 6, and a cover member 7.
  • the base plate 2 is a member that constitutes a container that houses the above-mentioned electronic unit.
  • the base plate 2 has a main surface 2a that supports the components of the electronic unit.
  • the base plate 2 has protrusions and grooves on its main surface 2a that supports the components. Note that the following explanation may be made using XYZ coordinates.
  • the X-axis direction and the Y-axis direction are directions perpendicular to each other, and are plane directions in which the base plate 2 extends.
  • the Z-axis direction is a direction perpendicular to the X-axis direction and the Y-axis, and is the thickness direction of the base plate 2.
  • the main surface 2a side is the positive side.
  • One side in the X-axis direction and the Y-axis direction is defined as a positive side, and the other side is defined as a negative side.
  • the substrate 3 is a plate-shaped member supported by the main surface 2a of the base plate 2.
  • the substrate 3 extends parallel to the XY plane.
  • the substrate 3 is spaced apart from the negative end 2b of the base plate 2 in the X-axis direction toward the positive side in the X-axis direction, and spaced apart from the positive end 2c of the base plate 2 in the Y-axis direction toward the negative side in the Y-axis direction. It is placed in the position where it will be.
  • the electronic component 4 is a component mounted on the board 3.
  • a plurality of electronic components 4 are mounted on the main surface 3a of the substrate 3.
  • a plurality of capacitors 11 (four in this case) arranged in the Y-axis direction are arranged along the edge 3b of the substrate 3 on the negative side of the substrate 3 in the X-axis direction.
  • a coil 12 is arranged as the electronic component 4 on the negative side of the arrangement of the capacitors 11 in the Y-axis direction.
  • a plurality of other types of capacitors 13 are arranged as the electronic component 4.
  • a transformer 15 is arranged on the positive side of the capacitor 14 in the X-axis direction.
  • the interface unit 6 is a part that connects the board 3 with external equipment (external connection).
  • the interface section 6 includes a terminal block 22 provided on the substrate 3, a nut 21 embedded in the cylindrical cover section 52 and isolated and insulated from the base plate, and a terminal fitting 23 for connecting the nut 21 and the terminal block 22. Equipped with The interface section basically has two sets of nuts 21, terminal blocks 22, and terminal fittings 23.
  • the terminal block 22 is provided on the substrate 3 at a position on the negative side of the capacitor 13 in the Y-axis direction.
  • One end of the terminal fitting 23 is fastened to the terminal block 22 provided on the board 3 via a bolt.
  • the terminal fitting 23 has a through hole 23a on the other end side.
  • the through hole 23a is arranged coaxially with the hole of the nut 21.
  • connection with the external device is achieved by tightening the connection terminal on the external device side and the through hole 23a on the other end side of the terminal fitting 23 together with the hole of the nut 21 with a bolt.
  • the interface section 6 includes a cover component 25 that covers the nut 21 and the terminal fitting 23.
  • the cover member 7 is a member that covers the electronic component 4. Further, the cover member 7 has an integral structure with a cover component 25 that covers the interface section 6 that makes an external connection to the board 3. Specifically, the cover member 7 has an electronic component area 30 that covers the electronic component 4 and an interface area 31 that constitutes the interface section 6. The interface area 31 of the cover member 7 constitutes the cover part 25 of the aforementioned interface part 6.
  • the electronic component area 30 includes a first area 32 that covers the capacitor 11, a second area 33 that covers the coil 12, a third area 34 that covers the two capacitors 13, and a fourth area that covers the two capacitors 14.
  • a region 36 and a fifth region 37 covering the transformer 15 are provided.
  • the first region 32 has a substantially U-shaped cross-sectional shape and extends in the Y-axis direction so as to cover the plurality of capacitors 11 (see FIG. 2) arranged in the Y-axis direction.
  • the first region 32 includes an upper wall portion 41 that covers the capacitor 11 from the positive side in the Z-axis direction, a side wall portion 42 that covers the capacitor 11 from the positive side in the X-axis direction, and a side wall portion 42 that covers the capacitor 11 from the positive side in the X-axis direction. It has a side wall part 43 that covers from the negative side.
  • the second region 33 has an upper wall portion 44 that covers the coil 12 (see FIG. 2) from the positive side in the Z-axis direction, and a side wall portion 46 that covers the coil 12 from all sides.
  • the third region 34 includes an upper wall portion 47 that covers the capacitor 13 (see FIG. 2) from the positive side in the Z-axis direction, a side wall portion 48 that covers the capacitor 13 from the positive side in the X-axis direction, and a side wall portion 48 that covers the capacitor 13 from the positive side in the X-axis direction. It has a side wall portion 49 that covers from the negative side of the direction.
  • the fourth region 36 has an upper wall portion 50 that covers the capacitor 14 (see FIG. 2) from the positive side in the Z-axis direction.
  • the fifth region 37 has an upper wall portion 51 that covers the transformer 15 from the positive side in the Z-axis direction.
  • each of the upper wall portions 41, 44, 47, 50, and 51 has a ceiling wall extending along the XY plane and a rib portion rising in the Z-axis direction.
  • Each upper wall portion 41, 44, 47, 50, 51 is divided into a plurality of sections by rib portions.
  • the interface area 31 has a pair of cylindrical cover parts 52 in which the pair of nuts 21 of the interface part 6 are embedded.
  • the other end of the terminal fitting 23 is arranged on the upper surface of the cylindrical cover part 52.
  • FIG. 2 shows one end of the terminal fitting 23 being connected to the terminal block 22 with a bolt. It also shows how the other end of the terminal fitting 23 is connected to the nut 21 (including the external device by being tightened together with the nut 21 by a connecting terminal and bolt on the external device side, not shown). There is.
  • the other ends of the nut 21 and the terminal fitting 23 are integrally molded with the interface area 31. Therefore, when attaching the cover member 7 to the base plate 2, the terminal fittings 23 are fixed to the interface area 31.
  • the interface area 31 has a connecting part 53 that is connected to the electronic component area 30.
  • the connecting portion 53 connects the corner of the third region 34 and the pair of cylindrical cover portions 52 .
  • two first fastening parts 56 and 57 are formed in the electronic component area 30 for fixing the cover member 7, and two second fastening parts 56 and 57 for fixing the cover member 7 are formed in the interface area 31.
  • Fastening portions 58 and 59 are formed.
  • One first fastening portion 56 is provided at the negative end of the first region 32 in the X-axis direction.
  • the other first fastening portion 57 is provided at the positive end of the fourth region 36 in the Y-axis direction.
  • One second fastening portion 58 is provided at the negative end of the interface region 31 in the X-axis direction.
  • the other second fastening section 59 is provided at the connecting section 53 of the interface area 31 .
  • the fastening parts 56, 57, 58, 59 have through holes, and the through holes are arranged coaxially with the holes provided on the boss parts 61, 62, 63, 64 provided on the base plate 2.
  • the fastening parts 56, 57, 58, 59 are fastened to the boss parts 61, 62, 62, 64 by inserting bolts into the through holes and fastening them to the holes of the boss parts 61, 62, 63, 64.
  • An elastic member 60 is arranged between the electronic component 4 and the cover member 7.
  • a resin adhesive is used as the elastic member 60.
  • an elastic member 60 is applied to the upper surface of each electronic component 4. In the figure, the elastic member 60 is shown in gray scale.
  • a hole 71 is formed in the cover member 7, and the hole 71 penetrates the ceiling walls of the upper walls 41, 44, 47, 50, and 51 in the Z-axis direction. They are each formed as follows. Although rectangular holes 71 are formed at each position of the upper wall parts 41, 44, 47, 50, and 51, the shape, position, and number are not particularly limited.
  • the negative end of the capacitor 11 in the Y-axis direction and the side wall 42 of the cover member 7 face each other with a gap in the X-axis direction.
  • the positive end of the capacitor 11 in the Y-axis direction and the side wall 43 of the cover member 7 face each other with a gap in the X-axis direction.
  • the positive end of the capacitor 11 in the Z-axis direction and the inner surface of the ceiling wall 41a of the upper wall portion 41 of the cover member 7 face each other with a gap in the Z-axis direction.
  • the elastic member 60 Before covering the capacitor 11 with the cover member 7, the elastic member 60 was applied to the positive end surface of the capacitor 11 in the Z-axis direction. Therefore, when the capacitor 11 is covered with the cover member 7, the elastic member 60 is sandwiched between the capacitor 11 and the ceiling wall 41a. Thereby, the elastic member 60 is arranged between the capacitor 11 and the cover member 7. The elastic member 60 expands in the gap between the capacitor 11 and the ceiling wall 41a.
  • a hole 71 is formed in the ceiling wall 41a. Therefore, a portion of the elastic member 60 is pushed out from the hole 71 toward the positive side in the Z-axis direction and is disposed on the outer surface of the ceiling wall 41a. Note that the outer surface of the ceiling wall 41a is partitioned by ribs 41b. Therefore, the pushed out elastic member 60 accumulates in the area where the hole 71 is formed among the areas separated by the ribs 41b (see FIG. 1).
  • the support structure 200 according to a comparative example does not have the cover member 7.
  • the interface section 6 has a cover part 25.
  • this support structure 200 when the vibration conditions of the electronic unit in which the board 3 is used become severe, problems such as the electronic components 4 falling off from the board 3 due to the insufficient vibration-proofing effect of the support structure 200 occur. occurs.
  • the cover member 7 can support the electronic component 4 by covering the electronic component 4, and can suppress vibration.
  • the interface unit 6 that connects externally to the board 3 has a strong fixing structure as required by the required specifications. Therefore, by forming the cover member 7 into an integral structure with the cover component 25 that covers the interface section 6, the strong fixing structure of the interface section 6 can be used without increasing the number of parts. As described above, the vibration isolation effect can be enhanced while suppressing an increase in the number of parts. Further, the cover member 7 can improve the vibration isolation performance of both SMT products (transformers, etc.) and discrete products (capacitors, etc.).
  • An elastic member 60 may be arranged between the electronic component 4 and the cover member 7.
  • the elastic member 60 can further improve the vibration isolation effect of the electronic component 4. Furthermore, heat can be transferred between the electronic component 4 and the cover member 7 via the elastic member 60.
  • a hole 71 may be formed in the cover member 7.
  • the presence or absence of the elastic member 60 and the filling condition can be confirmed from the outside of the cover member 7 through the hole 71.
  • the elastic member enters into the hole by being pressed by the inner surface of the ceiling wall of the cover member that faces the top surface of the electronic component.
  • the elastic member may reach the outer surface of the ceiling wall and spread along the outer surface of the ceiling wall.
  • the elastic member 60 can three-dimensionally increase the contact surface with the cover member 7 over a wide range of areas such as the inner surface of the ceiling wall, the inner wall of the hole, and the outer surface of the top plate, thereby improving the vibration isolation effect. can.
  • the cover member 7 has an electronic component region 30 that covers the electronic component 4 and an interface region 31 that constitutes the interface section 6, and a first fastening section 56 that fixes the cover member 7 to the electronic component region 30. , 57 may be formed, and second fastening parts 58 and 59 for fixing the cover member 7 may be formed in the interface area 31.
  • the second fastening parts 58 and 59 of the interface area 31 can be used as fixing parts for the electronic component area. Therefore, the number of fixing parts can be reduced compared to the case where the cover member 7 and the interface part 6 are provided separately.
  • the contents and arrangement of the electronic components 4 can be changed as appropriate, and the configuration of the cover member 7 can also be changed accordingly.
  • a partition wall 70 may be provided as shown in FIG. Note that, in order to prevent the flow of the elastic member 60 from being blocked by the partition wall 70, the partition wall 70 may be provided at both ends in the X-axis direction, and the partition wall 70 may not be provided at the center. Furthermore, although the outer surface of the ceiling wall 41a is divided by ribs 41b, as shown in FIG. good.
  • a structure having a terminal block as an interface section was exemplified.
  • the structure of the interface section is not particularly limited as long as it can be connected to the outside, and for example, a structure such as a connector or a bus bar may be adopted.
  • the elastic member 60 may be omitted.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

La présente invention concerne une structure de support de composant électronique qui est destinée à soutenir un composant électronique disposé sur un substrat et pourvue d'un élément de couvercle qui recouvre le composant électronique. La structure de l'élément de couvercle fait partie intégrante de l'élément de couvercle qui recouvre une partie d'interface pour la connexion externe avec le substrat.
PCT/JP2022/032593 2022-08-30 2022-08-30 Structure de support de composant électronique WO2024047751A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/032593 WO2024047751A1 (fr) 2022-08-30 2022-08-30 Structure de support de composant électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/032593 WO2024047751A1 (fr) 2022-08-30 2022-08-30 Structure de support de composant électronique

Publications (1)

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WO2024047751A1 true WO2024047751A1 (fr) 2024-03-07

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261254A (ja) * 1998-03-13 1999-09-24 Japan Aviation Electronics Ind Ltd プリント基板の取付構造
JP2003037913A (ja) * 2001-07-25 2003-02-07 Sumitomo Wiring Syst Ltd 電気接続箱
JP2003229683A (ja) * 2002-02-06 2003-08-15 Keihin Corp 電子回路基板の収容ケースおよびそれからなる電子回路ユニットの製造方法
JP2004111897A (ja) * 2002-04-05 2004-04-08 Murata Mfg Co Ltd 電子装置
JP2006017250A (ja) * 2004-07-02 2006-01-19 Fujitsu Ten Ltd 固定構造
JP2012227344A (ja) * 2011-04-19 2012-11-15 Toyota Motor Corp 電力変換装置
JP2014075496A (ja) * 2012-10-05 2014-04-24 Hitachi Automotive Systems Ltd 車載電子制御装置
JP2014165186A (ja) * 2013-02-21 2014-09-08 Hitachi Automotive Systems Ltd 電子制御装置および電子制御装置の製造方法
JP2017175735A (ja) * 2016-03-22 2017-09-28 株式会社デンソー 乗員保護装置用ｅｃｕ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261254A (ja) * 1998-03-13 1999-09-24 Japan Aviation Electronics Ind Ltd プリント基板の取付構造
JP2003037913A (ja) * 2001-07-25 2003-02-07 Sumitomo Wiring Syst Ltd 電気接続箱
JP2003229683A (ja) * 2002-02-06 2003-08-15 Keihin Corp 電子回路基板の収容ケースおよびそれからなる電子回路ユニットの製造方法
JP2004111897A (ja) * 2002-04-05 2004-04-08 Murata Mfg Co Ltd 電子装置
JP2006017250A (ja) * 2004-07-02 2006-01-19 Fujitsu Ten Ltd 固定構造
JP2012227344A (ja) * 2011-04-19 2012-11-15 Toyota Motor Corp 電力変換装置
JP2014075496A (ja) * 2012-10-05 2014-04-24 Hitachi Automotive Systems Ltd 車載電子制御装置
JP2014165186A (ja) * 2013-02-21 2014-09-08 Hitachi Automotive Systems Ltd 電子制御装置および電子制御装置の製造方法
JP2017175735A (ja) * 2016-03-22 2017-09-28 株式会社デンソー 乗員保護装置用ｅｃｕ

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