TW201028454A - Adhesive film - Google Patents

Adhesive film Download PDF

Info

Publication number
TW201028454A
TW201028454A TW98135878A TW98135878A TW201028454A TW 201028454 A TW201028454 A TW 201028454A TW 98135878 A TW98135878 A TW 98135878A TW 98135878 A TW98135878 A TW 98135878A TW 201028454 A TW201028454 A TW 201028454A
Authority
TW
Taiwan
Prior art keywords
particle diameter
average particle
adhesive film
insulating organic
organic particles
Prior art date
Application number
TW98135878A
Other languages
English (en)
Chinese (zh)
Inventor
Satoru Mori
Akira Nagai
Susumu Kawakami
Shigeki Katogi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201028454A publication Critical patent/TW201028454A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW98135878A 2008-10-22 2009-10-22 Adhesive film TW201028454A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008271982 2008-10-22

Publications (1)

Publication Number Publication Date
TW201028454A true TW201028454A (en) 2010-08-01

Family

ID=42119412

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98135878A TW201028454A (en) 2008-10-22 2009-10-22 Adhesive film

Country Status (5)

Country Link
JP (1) JP5146438B2 (ja)
KR (1) KR20110056555A (ja)
CN (1) CN102177212A (ja)
TW (1) TW201028454A (ja)
WO (1) WO2010047374A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106753205A (zh) * 2017-01-11 2017-05-31 湖南博翔新材料有限公司 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5223946B2 (ja) * 2010-06-14 2013-06-26 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
CN102295893B (zh) * 2010-06-14 2014-12-31 日立化成株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
KR101313972B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP2012021140A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
CN102295892A (zh) * 2010-06-14 2011-12-28 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
JP5206840B2 (ja) * 2010-06-14 2013-06-12 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP5441954B2 (ja) * 2010-06-14 2014-03-12 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2013038168A (ja) * 2011-08-05 2013-02-21 Three M Innovative Properties Co 太陽電池モジュールの製造方法
CN106133894B (zh) * 2014-04-04 2018-11-16 京瓷株式会社 热固化性树脂组合物、半导体装置及电气电子部件
KR102325095B1 (ko) * 2014-10-01 2021-11-11 나믹스 가부시끼가이샤 수지 조성물
CN107109161B (zh) * 2014-11-12 2019-07-02 迪睿合株式会社 热固化性粘合组合物
KR101772484B1 (ko) * 2015-09-17 2017-08-30 (주)이레화학상사 자동차용 에폭시 접착조성물 및 이를 이용한 접착방법
CN106367016A (zh) * 2016-08-29 2017-02-01 无锡万能胶粘剂有限公司 一种粉胶浆
SG11201907768WA (en) * 2017-02-27 2019-09-27 Showa Denko Kk Curable aqueous resin emulsion composition
PL3579302T3 (pl) 2017-12-11 2022-04-19 Lg Energy Solution Ltd. Separator i zawierające go urządzenie elektrochemiczne
KR102545120B1 (ko) * 2018-10-02 2023-06-20 엘지디스플레이 주식회사 실링부재 및 이를 포함하는 평판 디스플레이 패널
JP7184002B2 (ja) * 2019-09-13 2022-12-06 味の素株式会社 樹脂組成物
JP7390236B2 (ja) * 2020-03-31 2023-12-01 京セラ株式会社 異方導電性樹脂組成物、及びマイクロｌｅｄディスプレイ装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3398226B2 (ja) * 1994-08-23 2003-04-21 イビデン株式会社 金属膜被着体
JP3477367B2 (ja) * 1998-05-12 2003-12-10 ソニーケミカル株式会社 異方導電性接着フィルム
JP3365367B2 (ja) * 1999-09-14 2003-01-08 ソニーケミカル株式会社 Ｃｏｇ実装品および接続材料
JP4037619B2 (ja) * 2001-04-27 2008-01-23 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤及び電気装置
WO2008056773A1 (en) * 2006-11-10 2008-05-15 Hitachi Chemical Company, Ltd. Adhesive film, and connection structure and connecting method for circuit member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106753205A (zh) * 2017-01-11 2017-05-31 湖南博翔新材料有限公司 一种低粘度、高导热的环氧改性有机硅灌封胶及其应用

Also Published As

Publication number Publication date
CN102177212A (zh) 2011-09-07
KR20110056555A (ko) 2011-05-30
JP2010121124A (ja) 2010-06-03
JP5146438B2 (ja) 2013-02-20
WO2010047374A1 (ja) 2010-04-29

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