TW201028246A - Grinding stone for surface plate correction, polishing device for surface plate correction, and correction method for polishing surface plate - Google Patents

Grinding stone for surface plate correction, polishing device for surface plate correction, and correction method for polishing surface plate Download PDF

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Publication number
TW201028246A
TW201028246A TW099102132A TW99102132A TW201028246A TW 201028246 A TW201028246 A TW 201028246A TW 099102132 A TW099102132 A TW 099102132A TW 99102132 A TW99102132 A TW 99102132A TW 201028246 A TW201028246 A TW 201028246A
Authority
TW
Taiwan
Prior art keywords
polishing
platform
grindstone
correction
surface plate
Prior art date
Application number
TW099102132A
Other languages
English (en)
Chinese (zh)
Inventor
Kai Yasuoka
Tsuyoshi Shimizu
Kenichi Kazama
Original Assignee
Shinano Electric Refining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinano Electric Refining Co Ltd filed Critical Shinano Electric Refining Co Ltd
Publication of TW201028246A publication Critical patent/TW201028246A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW099102132A 2009-01-27 2010-01-26 Grinding stone for surface plate correction, polishing device for surface plate correction, and correction method for polishing surface plate TW201028246A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009015517 2009-01-27
JP2009170336A JP2010194704A (ja) 2009-01-27 2009-07-21 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法

Publications (1)

Publication Number Publication Date
TW201028246A true TW201028246A (en) 2010-08-01

Family

ID=42154521

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099102132A TW201028246A (en) 2009-01-27 2010-01-26 Grinding stone for surface plate correction, polishing device for surface plate correction, and correction method for polishing surface plate

Country Status (6)

Country Link
US (1) US20100190418A1 (https=)
EP (1) EP2210707A3 (https=)
JP (1) JP2010194704A (https=)
KR (1) KR20100087621A (https=)
CN (1) CN101817170A (https=)
TW (1) TW201028246A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732924B (zh) * 2017-07-18 2021-07-11 台灣積體電路製造股份有限公司 研磨元件、研磨輪及使用所述研磨輪製造半導體封裝的方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2439768B1 (en) * 2009-06-04 2022-02-09 SUMCO Corporation Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method
US20110097979A1 (en) * 2009-10-26 2011-04-28 Illinois Tool Works Inc. Fusion Bonded Epoxy Removal Tool
DE102010032501B4 (de) 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
CN102837077A (zh) * 2012-07-18 2012-12-26 中国人民解放军军事交通学院 齿条滚抛精整加工方法及加工设备
DE102012214998B4 (de) * 2012-08-23 2014-07-24 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
JP1597807S (https=) * 2017-08-21 2018-02-19
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD858469S1 (en) 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
CN113496870B (zh) * 2020-04-03 2022-07-26 重庆超硅半导体有限公司 一种集成电路用硅片边缘形貌控制方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
JPH1110522A (ja) 1997-06-20 1999-01-19 Asahi Glass Co Ltd 研磨機用修正キャリヤー
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
JP2000135666A (ja) 1998-10-29 2000-05-16 Kyocera Corp 定盤修正用治具
US6338672B1 (en) * 1998-12-21 2002-01-15 White Hydraulics, Inc. Dressing wheel system
JP2000218521A (ja) 1999-01-28 2000-08-08 Toshiba Ceramics Co Ltd 両面研磨用定盤修正キャリア
US6254461B1 (en) * 2000-03-15 2001-07-03 International Business Machines Corporation Process of dressing glass disk polishing pads using diamond-coated dressing disks
JP2006297488A (ja) 2005-04-15 2006-11-02 Tsc:Kk 修正キャリア構造
US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
JP2007069323A (ja) * 2005-09-08 2007-03-22 Shinano Denki Seiren Kk 定盤表面調整用砥石及び表面調整方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732924B (zh) * 2017-07-18 2021-07-11 台灣積體電路製造股份有限公司 研磨元件、研磨輪及使用所述研磨輪製造半導體封裝的方法

Also Published As

Publication number Publication date
JP2010194704A (ja) 2010-09-09
US20100190418A1 (en) 2010-07-29
KR20100087621A (ko) 2010-08-05
EP2210707A3 (en) 2010-12-29
EP2210707A2 (en) 2010-07-28
CN101817170A (zh) 2010-09-01

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