CN101817170A - 平台修正用磨石 - Google Patents

平台修正用磨石 Download PDF

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Publication number
CN101817170A
CN101817170A CN201010100490A CN201010100490A CN101817170A CN 101817170 A CN101817170 A CN 101817170A CN 201010100490 A CN201010100490 A CN 201010100490A CN 201010100490 A CN201010100490 A CN 201010100490A CN 101817170 A CN101817170 A CN 101817170A
Authority
CN
China
Prior art keywords
platform
polishing
correction
grinding stone
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201010100490A
Other languages
English (en)
Chinese (zh)
Inventor
安冈快
清水强
风间贤一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinano Electric Refining Co Ltd
Original Assignee
Shinano Electric Refining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinano Electric Refining Co Ltd filed Critical Shinano Electric Refining Co Ltd
Publication of CN101817170A publication Critical patent/CN101817170A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CN201010100490A 2009-01-27 2010-01-25 平台修正用磨石 Pending CN101817170A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009015517 2009-01-27
JP015517/09 2009-01-27
JP170336/09 2009-07-21
JP2009170336A JP2010194704A (ja) 2009-01-27 2009-07-21 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法

Publications (1)

Publication Number Publication Date
CN101817170A true CN101817170A (zh) 2010-09-01

Family

ID=42154521

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010100490A Pending CN101817170A (zh) 2009-01-27 2010-01-25 平台修正用磨石

Country Status (6)

Country Link
US (1) US20100190418A1 (https=)
EP (1) EP2210707A3 (https=)
JP (1) JP2010194704A (https=)
KR (1) KR20100087621A (https=)
CN (1) CN101817170A (https=)
TW (1) TW201028246A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102837077A (zh) * 2012-07-18 2012-12-26 中国人民解放军军事交通学院 齿条滚抛精整加工方法及加工设备

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2439768B1 (en) * 2009-06-04 2022-02-09 SUMCO Corporation Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method
US20110097979A1 (en) * 2009-10-26 2011-04-28 Illinois Tool Works Inc. Fusion Bonded Epoxy Removal Tool
DE102010032501B4 (de) 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102012214998B4 (de) * 2012-08-23 2014-07-24 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
US10518387B2 (en) * 2017-07-18 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd. Grinding element, grinding wheel and manufacturing method of semiconductor package using the same
JP1597807S (https=) * 2017-08-21 2018-02-19
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD858469S1 (en) 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
CN113496870B (zh) * 2020-04-03 2022-07-26 重庆超硅半导体有限公司 一种集成电路用硅片边缘形貌控制方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
JPH1110522A (ja) 1997-06-20 1999-01-19 Asahi Glass Co Ltd 研磨機用修正キャリヤー
US6004196A (en) * 1998-02-27 1999-12-21 Micron Technology, Inc. Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates
JP2000135666A (ja) 1998-10-29 2000-05-16 Kyocera Corp 定盤修正用治具
US6338672B1 (en) * 1998-12-21 2002-01-15 White Hydraulics, Inc. Dressing wheel system
JP2000218521A (ja) 1999-01-28 2000-08-08 Toshiba Ceramics Co Ltd 両面研磨用定盤修正キャリア
US6254461B1 (en) * 2000-03-15 2001-07-03 International Business Machines Corporation Process of dressing glass disk polishing pads using diamond-coated dressing disks
JP2006297488A (ja) 2005-04-15 2006-11-02 Tsc:Kk 修正キャリア構造
US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
JP2007069323A (ja) * 2005-09-08 2007-03-22 Shinano Denki Seiren Kk 定盤表面調整用砥石及び表面調整方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102837077A (zh) * 2012-07-18 2012-12-26 中国人民解放军军事交通学院 齿条滚抛精整加工方法及加工设备

Also Published As

Publication number Publication date
JP2010194704A (ja) 2010-09-09
US20100190418A1 (en) 2010-07-29
KR20100087621A (ko) 2010-08-05
EP2210707A3 (en) 2010-12-29
EP2210707A2 (en) 2010-07-28
TW201028246A (en) 2010-08-01

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Open date: 20100901