TW201006014A - Semiconductor device having rough sidewall - Google Patents
Semiconductor device having rough sidewall Download PDFInfo
- Publication number
- TW201006014A TW201006014A TW098116717A TW98116717A TW201006014A TW 201006014 A TW201006014 A TW 201006014A TW 098116717 A TW098116717 A TW 098116717A TW 98116717 A TW98116717 A TW 98116717A TW 201006014 A TW201006014 A TW 201006014A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor
- semiconductor device
- layer
- sidewall
- plane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/024—Group 12/16 materials
- H01L21/02403—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02414—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02581—Transition metal or rare earth elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/012—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group II-IV materials
- H10H20/0125—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group II-IV materials with a substrate not being Group II-VI materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Led Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5484208P | 2008-05-21 | 2008-05-21 | |
| US6075408P | 2008-06-11 | 2008-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201006014A true TW201006014A (en) | 2010-02-01 |
Family
ID=40851998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098116717A TW201006014A (en) | 2008-05-21 | 2009-05-20 | Semiconductor device having rough sidewall |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8772829B2 (enExample) |
| EP (1) | EP2304780A1 (enExample) |
| JP (1) | JP2011521477A (enExample) |
| TW (1) | TW201006014A (enExample) |
| WO (2) | WO2009143226A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366921A (ja) * | 1989-08-04 | 1991-03-22 | Kayseven Co Ltd | 回転力伝達手段 |
| JP5647881B2 (ja) * | 2010-12-17 | 2015-01-07 | スタンレー電気株式会社 | 酸化亜鉛系半導体の成長方法 |
| US9236530B2 (en) * | 2011-04-01 | 2016-01-12 | Soraa, Inc. | Miscut bulk substrates |
| WO2012138414A1 (en) * | 2011-04-06 | 2012-10-11 | Versatilis Llc | Optoelectronic device containing at least one active device layer having a wurtzite crystal structure, and methods of making same |
| JP2014527302A (ja) | 2011-08-17 | 2014-10-09 | ラムゴス インコーポレイテッド | 酸化物半導体基板上の縦型電界効果トランジスタおよびその製造方法 |
| FR2981794B1 (fr) * | 2011-10-21 | 2013-11-01 | Commissariat Energie Atomique | Procede de realisation d'un reseau organise de nanofils semiconducteurs, en particulier en zno |
| JP5644745B2 (ja) * | 2011-12-05 | 2014-12-24 | 豊田合成株式会社 | 半導体発光素子および発光装置 |
| WO2013109628A1 (en) | 2012-01-17 | 2013-07-25 | Ramgoss, Inc. | Rotated channel semiconductor field effect transistor |
| TW201337050A (zh) * | 2012-03-14 | 2013-09-16 | Univ Nat Chiao Tung | 纖鋅礦結構材料之非極性晶面 |
| EP2641996A1 (en) * | 2012-03-23 | 2013-09-25 | Stanley Electric Co., Ltd. | Method for growing magnesium-zinc-oxide-based crystal |
| KR101998339B1 (ko) * | 2012-11-16 | 2019-07-09 | 삼성전자주식회사 | 금속 산화물 반도체의 성장 결정면 제어방법 및 제어된 성장 결정면을 가지는 금속 산화물 반도체 구조물 |
| WO2014092165A1 (ja) * | 2012-12-14 | 2014-06-19 | 日本碍子株式会社 | 酸化亜鉛基板を用いた面発光素子 |
| JPWO2014092167A1 (ja) * | 2012-12-14 | 2017-01-12 | 日本碍子株式会社 | 酸化亜鉛基板を用いた面発光素子 |
| JPWO2014092168A1 (ja) * | 2012-12-14 | 2017-01-12 | 日本碍子株式会社 | 酸化亜鉛基板を用いた面発光素子 |
| WO2014092163A1 (ja) * | 2012-12-14 | 2014-06-19 | 日本碍子株式会社 | 酸化亜鉛基板を用いた面発光素子 |
| TWI514622B (zh) * | 2013-02-19 | 2015-12-21 | Lextar Electronics Corp | 發光二極體晶粒及其製造方法 |
| WO2014185339A1 (ja) * | 2013-05-17 | 2014-11-20 | 日本碍子株式会社 | 光起電力素子 |
| WO2015151902A1 (ja) * | 2014-03-31 | 2015-10-08 | 日本碍子株式会社 | 多結晶窒化ガリウム自立基板及びそれを用いた発光素子 |
| JP2015137189A (ja) * | 2014-01-21 | 2015-07-30 | スタンレー電気株式会社 | Agドープp型ZnO系半導体結晶層 |
| EP3143450B1 (en) | 2014-05-13 | 2018-03-28 | CoeLux S.r.l. | Light source and sunlight imitating lighting system |
| TWI622190B (zh) * | 2014-11-18 | 2018-04-21 | 錼創科技股份有限公司 | 發光元件 |
| US9793248B2 (en) * | 2014-11-18 | 2017-10-17 | PlayNitride Inc. | Light emitting device |
| US10411164B2 (en) * | 2015-09-03 | 2019-09-10 | Seoul Viosys Co., Ltd. | Light-emitting element having ZnO transparent electrode and method for manufacturing same |
| KR102692637B1 (ko) * | 2016-11-24 | 2024-08-06 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 |
| EP3803960B1 (en) | 2018-06-07 | 2023-11-08 | Silanna UV Technologies Pte Ltd | Optoelectronic device |
| CN208489222U (zh) * | 2018-06-28 | 2019-02-12 | 厦门市三安光电科技有限公司 | 一种发光二极管 |
| US11342484B2 (en) | 2020-05-11 | 2022-05-24 | Silanna UV Technologies Pte Ltd | Metal oxide semiconductor-based light emitting device |
| GB2595684A (en) * | 2020-06-03 | 2021-12-08 | Plessey Semiconductors Ltd | Spacer LED architecture for high efficiency micro LED displays |
| KR20240095343A (ko) | 2021-11-10 | 2024-06-25 | 실라나 유브이 테크놀로지스 피티이 리미티드 | 에피택셜 산화물 물질, 구조 및 소자 |
| EP4430674A4 (en) | 2021-11-10 | 2025-10-01 | Silanna UV Technologies Pte Ltd | EPITAXIAL OXIDE MATERIALS, STRUCTURES AND DEVICES |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3813740B2 (ja) * | 1997-07-11 | 2006-08-23 | Tdk株式会社 | 電子デバイス用基板 |
| US6291085B1 (en) | 1998-08-03 | 2001-09-18 | The Curators Of The University Of Missouri | Zinc oxide films containing P-type dopant and process for preparing same |
| JP2001072498A (ja) * | 1999-07-08 | 2001-03-21 | Nippon Telegr & Teleph Corp <Ntt> | 酸化物単結晶薄膜およびその加工方法 |
| US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| TW541723B (en) * | 2001-04-27 | 2003-07-11 | Shinetsu Handotai Kk | Method for manufacturing light-emitting element |
| JP3826755B2 (ja) | 2001-09-28 | 2006-09-27 | 株式会社村田製作所 | ZnO膜及びその製造方法並びに発光素子 |
| DE60334998D1 (de) * | 2002-08-28 | 2010-12-30 | Moxtronics Inc | Hybridstrahl-beschichtungssystem und verfahren zur herstellung von zno-schichten |
| US6876009B2 (en) * | 2002-12-09 | 2005-04-05 | Nichia Corporation | Nitride semiconductor device and a process of manufacturing the same |
| TW200505042A (en) * | 2003-07-17 | 2005-02-01 | South Epitaxy Corp | LED device |
| JP4544898B2 (ja) * | 2004-04-08 | 2010-09-15 | エア・ウォーター株式会社 | ZnO膜の成膜方法 |
| US20060124943A1 (en) * | 2004-12-14 | 2006-06-15 | Elite Optoelectronics Inc. | Large-sized light-emitting diodes with improved light extraction efficiency |
| DE102005021099A1 (de) * | 2005-05-06 | 2006-12-07 | Universität Ulm | GaN-Schichten |
| JP4988179B2 (ja) * | 2005-09-22 | 2012-08-01 | ローム株式会社 | 酸化亜鉛系化合物半導体素子 |
| US20070126021A1 (en) * | 2005-12-06 | 2007-06-07 | Yungryel Ryu | Metal oxide semiconductor film structures and methods |
| JP5896442B2 (ja) * | 2006-01-20 | 2016-03-30 | 国立研究開発法人科学技術振興機構 | Iii族窒化物膜の成長方法 |
| WO2008050479A1 (en) * | 2006-10-25 | 2008-05-02 | Stanley Electric Co., Ltd. | ZnO LAYER AND SEMICONDUCTOR LIGHT-EMITTING DEVICE |
| WO2008073469A1 (en) | 2006-12-11 | 2008-06-19 | Lumenz, Llc | Zinc oxide multi-junction photovoltaic cells and optoelectronic devices |
| JP2007129271A (ja) * | 2007-02-13 | 2007-05-24 | Citizen Tohoku Kk | 半導体発光素子及びその製造方法 |
| TW200949004A (en) | 2008-04-25 | 2009-12-01 | Lumenz Inc | Metalorganic chemical vapor deposition of zinc oxide |
-
2009
- 2009-05-20 TW TW098116717A patent/TW201006014A/zh unknown
- 2009-05-20 WO PCT/US2009/044646 patent/WO2009143226A1/en not_active Ceased
- 2009-05-20 JP JP2011510675A patent/JP2011521477A/ja active Pending
- 2009-05-20 WO PCT/US2009/044650 patent/WO2009143229A1/en not_active Ceased
- 2009-05-20 EP EP09751454A patent/EP2304780A1/en not_active Withdrawn
-
2010
- 2010-11-22 US US12/951,308 patent/US8772829B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20110062440A1 (en) | 2011-03-17 |
| EP2304780A1 (en) | 2011-04-06 |
| US8772829B2 (en) | 2014-07-08 |
| WO2009143226A1 (en) | 2009-11-26 |
| WO2009143229A1 (en) | 2009-11-26 |
| JP2011521477A (ja) | 2011-07-21 |
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