TW201003896A - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- TW201003896A TW201003896A TW098121446A TW98121446A TW201003896A TW 201003896 A TW201003896 A TW 201003896A TW 098121446 A TW098121446 A TW 098121446A TW 98121446 A TW98121446 A TW 98121446A TW 201003896 A TW201003896 A TW 201003896A
- Authority
- TW
- Taiwan
- Prior art keywords
- region
- diffusion region
- semiconductor device
- diffusion
- impurity concentration
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
- H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6736—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes characterised by the shape of gate insulators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/109—Reduced surface field [RESURF] PN junction structures
- H10D62/111—Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008174731A JP2010016180A (ja) | 2008-07-03 | 2008-07-03 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201003896A true TW201003896A (en) | 2010-01-16 |
Family
ID=41463690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098121446A TW201003896A (en) | 2008-07-03 | 2009-06-25 | Semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100001315A1 (enExample) |
| JP (1) | JP2010016180A (enExample) |
| TW (1) | TW201003896A (enExample) |
| WO (1) | WO2010001513A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI750417B (zh) * | 2017-10-11 | 2021-12-21 | 日商村田製作所股份有限公司 | 功率放大器模組 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6277785B2 (ja) * | 2014-03-07 | 2018-02-14 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE453622B (sv) * | 1983-12-08 | 1988-02-15 | Asea Ab | Halvledarkomponent for generering av optisk stralning |
| US4811075A (en) * | 1987-04-24 | 1989-03-07 | Power Integrations, Inc. | High voltage MOS transistors |
| JP3395473B2 (ja) * | 1994-10-25 | 2003-04-14 | 富士電機株式会社 | 横型トレンチmisfetおよびその製造方法 |
| JPH08236754A (ja) * | 1995-02-22 | 1996-09-13 | Fuji Electric Co Ltd | pチャネル型高耐圧MOSFET |
| US6168983B1 (en) * | 1996-11-05 | 2001-01-02 | Power Integrations, Inc. | Method of making a high-voltage transistor with multiple lateral conduction layers |
| JP4815740B2 (ja) * | 2003-12-09 | 2011-11-16 | トヨタ自動車株式会社 | 半導体装置とそれを利用したレベルシフト回路 |
| JP3888997B2 (ja) * | 2003-12-12 | 2007-03-07 | 松下電器産業株式会社 | 半導体装置 |
| JP4972855B2 (ja) * | 2004-08-04 | 2012-07-11 | 富士電機株式会社 | 半導体装置およびその製造方法 |
| US7262476B2 (en) * | 2004-11-30 | 2007-08-28 | Agere Systems Inc. | Semiconductor device having improved power density |
| JP2006210563A (ja) * | 2005-01-27 | 2006-08-10 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| US7759696B2 (en) * | 2005-10-20 | 2010-07-20 | Panasonic Corporation | High-breakdown voltage semiconductor switching device and switched mode power supply apparatus using the same |
| JP2007318062A (ja) * | 2006-04-27 | 2007-12-06 | Matsushita Electric Ind Co Ltd | 高耐圧半導体スイッチング素子 |
| JP5148852B2 (ja) * | 2006-09-07 | 2013-02-20 | 新日本無線株式会社 | 半導体装置 |
| JP2008124421A (ja) * | 2006-10-17 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2008153495A (ja) * | 2006-12-19 | 2008-07-03 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
-
2008
- 2008-07-03 JP JP2008174731A patent/JP2010016180A/ja not_active Withdrawn
-
2009
- 2009-04-16 WO PCT/JP2009/001759 patent/WO2010001513A1/ja not_active Ceased
- 2009-05-28 US US12/473,604 patent/US20100001315A1/en not_active Abandoned
- 2009-06-25 TW TW098121446A patent/TW201003896A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI750417B (zh) * | 2017-10-11 | 2021-12-21 | 日商村田製作所股份有限公司 | 功率放大器模組 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100001315A1 (en) | 2010-01-07 |
| JP2010016180A (ja) | 2010-01-21 |
| WO2010001513A1 (ja) | 2010-01-07 |
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