TW200952569A - Low-temperature fired ceramic circuit board - Google Patents
Low-temperature fired ceramic circuit board Download PDFInfo
- Publication number
- TW200952569A TW200952569A TW098106804A TW98106804A TW200952569A TW 200952569 A TW200952569 A TW 200952569A TW 098106804 A TW098106804 A TW 098106804A TW 98106804 A TW98106804 A TW 98106804A TW 200952569 A TW200952569 A TW 200952569A
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- Prior art keywords
- weight
- glass
- low
- conductor
- green sheet
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
- C04B35/117—Composites
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/6342—Polyvinylacetals, e.g. polyvinylbutyral [PVB]
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63424—Polyacrylates; Polymethacrylates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/638—Removal thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
- C04B2235/365—Borosilicate glass
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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- C—CHEMISTRY; METALLURGY
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/963—Surface properties, e.g. surface roughness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Composite Materials (AREA)
- Physics & Mathematics (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008091890 | 2008-03-31 |
Publications (2)
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| TW200952569A true TW200952569A (en) | 2009-12-16 |
| TWI380746B TWI380746B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2012-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW098106804A TW200952569A (en) | 2008-03-31 | 2009-03-03 | Low-temperature fired ceramic circuit board |
Country Status (7)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012160921A1 (ja) * | 2011-05-26 | 2012-11-29 | 株式会社 村田製作所 | 導電性ペースト及び太陽電池 |
| CN103188862B (zh) * | 2011-12-30 | 2015-11-04 | 深圳振华富电子有限公司 | 一种pcb板及其制作方法和电子元器件 |
| CN103360036B (zh) * | 2012-04-05 | 2015-11-18 | 深圳光启创新技术有限公司 | 一种超材料基板及其制备方法 |
| CN103803956B (zh) * | 2013-12-28 | 2015-10-28 | 中国科学院上海硅酸盐研究所 | 一种具有高频低介电损耗的低温共烧陶瓷材料及其制备方法和应用 |
| CN105098300A (zh) * | 2015-09-11 | 2015-11-25 | 禾邦电子（中国）有限公司 | 共模滤波器及其制造方法 |
| CN109626974B (zh) * | 2018-12-12 | 2021-08-27 | 苏州研资工业技术有限公司 | 一种低温共烧陶瓷材料及其制备方法 |
| CN109817563A (zh) * | 2019-03-18 | 2019-05-28 | 昆山福烨电子有限公司 | 一种三层陶瓷厚膜电路的生产工艺 |
| KR102783058B1 (ko) * | 2019-05-01 | 2025-03-17 | 데쿠세리아루즈 가부시키가이샤 | 접속 구조체, 접속 구조체의 제조 방법, 접속 재료, 및 피복 도전 입자 |
| TWI881566B (zh) * | 2023-11-29 | 2025-04-21 | 大陸商鵬鼎控股（深圳）股份有限公司 | 電路板及其製作方法 |
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| JP2898121B2 (ja) | 1991-05-01 | 1999-05-31 | ティーディーケイ株式会社 | 導体ぺーストおよび配線基板 |
| US5162062A (en) | 1991-06-17 | 1992-11-10 | E. I. Du Pont De Nemours And Company | Method for making multilayer electronic circuits |
| JPH0811696B2 (ja) | 1993-04-22 | 1996-02-07 | 日本電気株式会社 | 多層ガラスセラミック基板とその製造方法 |
| JPH09161539A (ja) | 1995-12-04 | 1997-06-20 | Murata Mfg Co Ltd | 導電性組成物およびそれを用いたセラミック電子部品 |
| TW342578B (en) | 1996-09-26 | 1998-10-11 | Toray Industries | Photosensitive ceramic blank sheet, ceramic package and process for producing the same |
| JP3941201B2 (ja) | 1998-01-20 | 2007-07-04 | 株式会社デンソー | 導体ペースト組成物及び回路基板 |
| TW524786B (en) | 1998-01-23 | 2003-03-21 | Du Pont | Glass composition, castable dielectric composition and tape composition made therewith |
| JP4269194B2 (ja) | 1998-04-14 | 2009-05-27 | 日東紡績株式会社 | 低誘電率ガラス繊維 |
| JP2000203878A (ja) * | 1999-01-13 | 2000-07-25 | Asahi Glass Co Ltd | ガラスセラミックス組成物 |
| JP2003128431A (ja) | 2001-10-22 | 2003-05-08 | Asahi Glass Co Ltd | 無鉛ガラスおよびガラスセラミックス組成物 |
| JP4050097B2 (ja) * | 2001-10-30 | 2008-02-20 | 松下電器産業株式会社 | 固体電解コンデンサおよびその製造方法 |
| CN100478301C (zh) * | 2001-11-05 | 2009-04-15 | 旭硝子株式会社 | 玻璃陶瓷组合物 |
| KR20060003861A (ko) * | 2003-04-21 | 2006-01-11 | 아사히 가라스 가부시키가이샤 | 유전체 형성용 무연 유리, 유전체 형성용 유리 세라믹스조성물, 유전체 및 적층 유전체 제조 방법 |
| JP2005126250A (ja) | 2003-10-21 | 2005-05-19 | Asahi Glass Co Ltd | ガラスセラミックス組成物および電子回路基板 |
| JP4229045B2 (ja) | 2004-10-22 | 2009-02-25 | 旭硝子株式会社 | 電子回路基板および電子回路基板作製用無鉛ガラス |
| JP4329691B2 (ja) | 2004-12-28 | 2009-09-09 | ブラザー工業株式会社 | 用紙搬送装置、並びにそれを用いた画像形成装置 |
| JP4462433B2 (ja) | 2005-10-12 | 2010-05-12 | Ｔｄｋ株式会社 | 誘電体材料 |
| JP2007095704A (ja) | 2006-11-20 | 2007-04-12 | Denso Corp | 導体ペースト組成物及び回路基板 |
| JP4545733B2 (ja) | 2006-11-20 | 2010-09-15 | 株式会社デンソー | 導体ペースト組成物及び回路基板 |
| DE102008007338B4 (de) | 2007-02-06 | 2011-08-25 | Mitsubishi Electric Corp. | Keramikpulver für einen Rohling, mehrschichtiges Keramiksubstrat und Verfahren zur Herstellung eines mehrschichtigen Keramiksubstrats |
-
2009
- 2009-02-19 JP JP2010505454A patent/JP4932035B2/ja not_active Expired - Fee Related
- 2009-02-19 EP EP09726936A patent/EP2265100A1/en not_active Withdrawn
- 2009-02-19 US US12/866,958 patent/US8298448B2/en not_active Expired - Fee Related
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- 2009-02-19 KR KR1020107023058A patent/KR101086804B1/ko not_active Expired - Fee Related
- 2009-02-19 CN CN200980111924.6A patent/CN101983543B/zh not_active Expired - Fee Related
- 2009-03-03 TW TW098106804A patent/TW200952569A/zh not_active IP Right Cessation
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| WO2009122806A1 (ja) | 2009-10-08 |
| JP4932035B2 (ja) | 2012-05-16 |
| TWI380746B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2012-12-21 |
| US20100320425A1 (en) | 2010-12-23 |
| EP2265100A1 (en) | 2010-12-22 |
| CN101983543B (zh) | 2012-08-01 |
| KR101086804B1 (ko) | 2011-11-25 |
| US8298448B2 (en) | 2012-10-30 |
| JPWO2009122806A1 (ja) | 2011-07-28 |
| CN101983543A (zh) | 2011-03-02 |
| KR20100122957A (ko) | 2010-11-23 |
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