TW200943520A - Tape wiring substrate and semiconductor chip package - Google Patents

Tape wiring substrate and semiconductor chip package

Info

Publication number
TW200943520A
TW200943520A TW097148056A TW97148056A TW200943520A TW 200943520 A TW200943520 A TW 200943520A TW 097148056 A TW097148056 A TW 097148056A TW 97148056 A TW97148056 A TW 97148056A TW 200943520 A TW200943520 A TW 200943520A
Authority
TW
Taiwan
Prior art keywords
mounting portion
semiconductor chip
chip mounting
wiring substrate
wiring
Prior art date
Application number
TW097148056A
Other languages
English (en)
Inventor
Daisuke Kunimatsu
Takehiro Takayanagi
Original Assignee
Oki Semiconductor Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Semiconductor Company Ltd filed Critical Oki Semiconductor Company Ltd
Publication of TW200943520A publication Critical patent/TW200943520A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
TW097148056A 2008-03-14 2008-12-10 Tape wiring substrate and semiconductor chip package TW200943520A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008066040A JP4980960B2 (ja) 2008-03-14 2008-03-14 テープ配線基板及び半導体チップパッケージ

Publications (1)

Publication Number Publication Date
TW200943520A true TW200943520A (en) 2009-10-16

Family

ID=41062827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148056A TW200943520A (en) 2008-03-14 2008-12-10 Tape wiring substrate and semiconductor chip package

Country Status (4)

Country Link
US (1) US8228677B2 (zh)
JP (1) JP4980960B2 (zh)
KR (1) KR101548741B1 (zh)
TW (1) TW200943520A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105684069A (zh) * 2013-10-24 2016-06-15 Lg电子株式会社 使用半导体发光器件的显示装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102113421B (zh) * 2008-08-11 2013-12-25 夏普株式会社 柔性基板和电路构造体
JP5452290B2 (ja) * 2010-03-05 2014-03-26 ラピスセミコンダクタ株式会社 表示パネル
TWI571989B (zh) * 2014-01-28 2017-02-21 友達光電股份有限公司 顯示基板結構
KR102252380B1 (ko) * 2014-04-24 2021-05-14 삼성전자주식회사 테이프 배선 기판, 반도체 패키지 및 상기 반도체 패키지를 포함한 디스플레이 장치
KR102569967B1 (ko) * 2016-08-30 2023-08-23 삼성디스플레이 주식회사 인쇄회로기판 및 이를 포함하는 표시 장치
KR20180093191A (ko) * 2017-02-10 2018-08-21 삼성디스플레이 주식회사 칩 온 필름 패키지, 표시 패널 및 표시 장치
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
TWI646877B (zh) 2018-03-12 2019-01-01 Chipbond Technology Corporation 軟性電路基板之佈線結構
CN108807717B (zh) * 2018-08-14 2019-11-15 武汉华星光电半导体显示技术有限公司 一种显示面板及绑定方法
TWI736096B (zh) * 2019-12-31 2021-08-11 頎邦科技股份有限公司 電路板
KR20220055759A (ko) * 2020-10-27 2022-05-04 엘지이노텍 주식회사 연성 인쇄회로기판, cof 모듈 및 이를 포함하는 전자디바이스

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592199A (en) * 1993-01-27 1997-01-07 Sharp Kabushiki Kaisha Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
JP3186925B2 (ja) * 1994-08-04 2001-07-11 シャープ株式会社 パネルの実装構造並びに集積回路搭載テープおよびその製造方法
JP3405657B2 (ja) * 1996-11-29 2003-05-12 シャープ株式会社 テープキャリアパッケージ及びそれを使った表示装置
JP3613098B2 (ja) * 1998-12-21 2005-01-26 セイコーエプソン株式会社 回路基板ならびにそれを用いた表示装置および電子機器
US6433414B2 (en) * 2000-01-26 2002-08-13 Casio Computer Co., Ltd. Method of manufacturing flexible wiring board
JP2005062582A (ja) * 2003-08-18 2005-03-10 Hitachi Displays Ltd 表示装置
JP4233967B2 (ja) * 2003-09-30 2009-03-04 シャープ株式会社 表示パネル駆動装置および表示装置
KR100598032B1 (ko) * 2003-12-03 2006-07-07 삼성전자주식회사 테이프 배선 기판, 그를 이용한 반도체 칩 패키지 및 그를이용한 디스플레이패널 어셈블리
JP4071782B2 (ja) * 2005-05-30 2008-04-02 松下電器産業株式会社 半導体装置
KR100788415B1 (ko) * 2006-03-31 2007-12-24 삼성전자주식회사 이엠아이 노이즈 특성을 개선한 테이프 배선기판 및 그를이용한 테이프 패키지
KR20080020858A (ko) * 2006-09-01 2008-03-06 삼성전자주식회사 칩 필름 패키지 및 이를 포함하는 디스플레이 패널어셈블리

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105684069A (zh) * 2013-10-24 2016-06-15 Lg电子株式会社 使用半导体发光器件的显示装置

Also Published As

Publication number Publication date
US20090231823A1 (en) 2009-09-17
JP4980960B2 (ja) 2012-07-18
US8228677B2 (en) 2012-07-24
JP2009224478A (ja) 2009-10-01
KR20090098657A (ko) 2009-09-17
KR101548741B1 (ko) 2015-08-31

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