TW200942648A - Electroplating device and method - Google Patents

Electroplating device and method

Info

Publication number
TW200942648A
TW200942648A TW98101303A TW98101303A TW200942648A TW 200942648 A TW200942648 A TW 200942648A TW 98101303 A TW98101303 A TW 98101303A TW 98101303 A TW98101303 A TW 98101303A TW 200942648 A TW200942648 A TW 200942648A
Authority
TW
Taiwan
Prior art keywords
plates
anode
pair
electroplating
electrolyte
Prior art date
Application number
TW98101303A
Other languages
English (en)
Other versions
TWI381070B (zh
Inventor
Kurosawa Hideki
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200942648A publication Critical patent/TW200942648A/zh
Application granted granted Critical
Publication of TWI381070B publication Critical patent/TWI381070B/zh

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW98101303A 2008-04-02 2009-01-15 Electroplating device and electroplating method TWI381070B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008096534A JP2009249659A (ja) 2008-04-02 2008-04-02 電気めっき装置及び電気めっき方法

Publications (2)

Publication Number Publication Date
TW200942648A true TW200942648A (en) 2009-10-16
TWI381070B TWI381070B (zh) 2013-01-01

Family

ID=41155063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98101303A TWI381070B (zh) 2008-04-02 2009-01-15 Electroplating device and electroplating method

Country Status (4)

Country Link
JP (1) JP2009249659A (zh)
CN (1) CN101550582B (zh)
HK (1) HK1132307A1 (zh)
TW (1) TWI381070B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5366787B2 (ja) * 2009-12-18 2013-12-11 株式会社中央製作所 連続垂直搬送式めっき装置
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
CN102373497B (zh) * 2010-08-16 2014-05-21 富葵精密组件(深圳)有限公司 电镀装置及电镀方法
US10262960B2 (en) * 2015-04-06 2019-04-16 Mitsubishi Electric Corporation Semiconductor element having a warped surface and production method thereof
CN105297121A (zh) * 2015-10-21 2016-02-03 胜宏科技（惠州）股份有限公司 一种电镀铜槽钛篮保养方法
CN105297096B (zh) * 2015-11-30 2017-12-19 中国华能集团公司 一种双面电沉积异种镀层的电镀装置及电镀方法
CN107513741A (zh) * 2017-09-07 2017-12-26 延康汽车零部件如皋有限公司 一种提高长工件铜镀层均匀性的电镀方法
CN112701072B (zh) * 2021-03-25 2021-10-22 西安奕斯伟硅片技术有限公司 晶圆处理装置及晶圆缺陷评价方法
WO2022254579A1 (ja) * 2021-06-01 2022-12-08 株式会社荏原製作所 めっき装置およびめっき方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490230A (en) * 1983-03-10 1984-12-25 At&T Technologies, Inc. Electroplating apparatus
JPS63293193A (ja) * 1987-05-26 1988-11-30 Matsushita Electric Works Ltd 電気メッキ方法
JPH06116799A (ja) * 1992-10-01 1994-04-26 Hitachi Chem Co Ltd 電気めっき法
JP3062911B2 (ja) * 1994-03-14 2000-07-12 富士通株式会社 メッキ装置
JP3352081B2 (ja) * 2001-02-01 2002-12-03 株式会社アスカエンジニアリング プリント基板の銅めっき装置
CN2466167Y (zh) * 2001-02-09 2001-12-19 吴德兴 轮圈用电镀装置
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
CN2732766Y (zh) * 2004-05-12 2005-10-12 重庆渝安创新科技(集团)有限公司 节约电能和设备附件的电镀硬铬设备
JP4711805B2 (ja) * 2005-11-08 2011-06-29 上村工業株式会社 めっき槽
US8177945B2 (en) * 2007-01-26 2012-05-15 International Business Machines Corporation Multi-anode system for uniform plating of alloys

Also Published As

Publication number Publication date
HK1132307A1 (en) 2010-02-19
CN101550582A (zh) 2009-10-07
CN101550582B (zh) 2012-07-18
JP2009249659A (ja) 2009-10-29
TWI381070B (zh) 2013-01-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees