TW200940744A - Plated structure - Google Patents

Plated structure Download PDF

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Publication number
TW200940744A
TW200940744A TW98103437A TW98103437A TW200940744A TW 200940744 A TW200940744 A TW 200940744A TW 98103437 A TW98103437 A TW 98103437A TW 98103437 A TW98103437 A TW 98103437A TW 200940744 A TW200940744 A TW 200940744A
Authority
TW
Taiwan
Prior art keywords
plane
plated structure
crystal orientation
orientation rate
plating layer
Prior art date
Application number
TW98103437A
Other languages
English (en)
Other versions
TWI454590B (zh
Inventor
Takashi Kubota
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200940744A publication Critical patent/TW200940744A/zh
Application granted granted Critical
Publication of TWI454590B publication Critical patent/TWI454590B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
TW098103437A 2008-02-04 2009-02-04 Plating structure TWI454590B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008024560 2008-02-04

Publications (2)

Publication Number Publication Date
TW200940744A true TW200940744A (en) 2009-10-01
TWI454590B TWI454590B (zh) 2014-10-01

Family

ID=40952142

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103437A TWI454590B (zh) 2008-02-04 2009-02-04 Plating structure

Country Status (4)

Country Link
JP (1) JP4351736B2 (zh)
KR (1) KR20100114879A (zh)
TW (1) TWI454590B (zh)
WO (1) WO2009099067A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102222535A (zh) * 2010-01-29 2011-10-19 日本化学工业株式会社 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法
CN114175420A (zh) * 2019-10-30 2022-03-11 古河电气工业株式会社 滑动触点用金属材料及其制造方法、以及马达用刷材及振动马达

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4511623B1 (ja) * 2009-05-08 2010-07-28 小島化学薬品株式会社 無電解パラジウムめっき液
KR101704856B1 (ko) * 2010-03-08 2017-02-08 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 이방성 도전 재료 및 접속 구조체
JP5552934B2 (ja) * 2010-07-20 2014-07-16 Ｔｄｋ株式会社 被覆体及び電子部品
JP5707247B2 (ja) * 2011-06-22 2015-04-22 日本化学工業株式会社 導電性粒子の製造方法
JP5983336B2 (ja) * 2011-11-17 2016-08-31 Tdk株式会社 被覆体及び電子部品
JP6020070B2 (ja) * 2011-11-17 2016-11-02 Tdk株式会社 被覆体及び電子部品
KR20130055956A (ko) * 2011-11-21 2013-05-29 삼성전기주식회사 무전해 팔라듐 도금액
JP6035540B2 (ja) 2012-12-21 2016-11-30 奥野製薬工業株式会社 導電性皮膜形成浴
JP6024044B2 (ja) 2014-01-27 2016-11-09 奥野製薬工業株式会社 導電性皮膜形成浴
JP6551396B2 (ja) * 2014-03-17 2019-07-31 日立金属株式会社 触媒用Ｐｄ粒子および触媒用Ｐｄ粉体、触媒用Ｐｄ粒子の製造方法
JP5846252B2 (ja) * 2014-05-27 2016-01-20 Tdk株式会社 電子部品内蔵基板
EP3234219B1 (en) * 2014-12-17 2019-03-27 ATOTECH Deutschland GmbH Plating bath composition and method for electroless deposition of palladium
JP7282136B2 (ja) * 2021-02-12 2023-05-26 松田産業株式会社 パラジウムめっき液及びパラジウムめっき補充液

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07326701A (ja) * 1994-05-31 1995-12-12 Kobe Steel Ltd 電気電子部品用導電材、リードフレ−ム及びそれを使用した半導体集積回路
JP3051683B2 (ja) * 1996-12-10 2000-06-12 栄電子工業株式会社 無電解金めっき方法
JP3972158B2 (ja) * 1998-03-24 2007-09-05 石原薬品株式会社 無電解パラジウムメッキ液

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102222535A (zh) * 2010-01-29 2011-10-19 日本化学工业株式会社 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法
CN102222535B (zh) * 2010-01-29 2015-08-26 日本化学工业株式会社 导电性粉体、含有该导电性粉体的导电性材料以及导电性颗粒的制造方法
CN114175420A (zh) * 2019-10-30 2022-03-11 古河电气工业株式会社 滑动触点用金属材料及其制造方法、以及马达用刷材及振动马达
CN114175420B (zh) * 2019-10-30 2024-05-28 古河电气工业株式会社 滑动触点用金属材料及其制造方法、以及马达用刷材及振动马达

Also Published As

Publication number Publication date
JPWO2009099067A1 (ja) 2011-05-26
KR20100114879A (ko) 2010-10-26
WO2009099067A1 (ja) 2009-08-13
JP4351736B2 (ja) 2009-10-28
TWI454590B (zh) 2014-10-01

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