TW200937022A - Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device - Google Patents

Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device Download PDF

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Publication number
TW200937022A
TW200937022A TW097139204A TW97139204A TW200937022A TW 200937022 A TW200937022 A TW 200937022A TW 097139204 A TW097139204 A TW 097139204A TW 97139204 A TW97139204 A TW 97139204A TW 200937022 A TW200937022 A TW 200937022A
Authority
TW
Taiwan
Prior art keywords
probe
wiring
substrate
contact
contact terminals
Prior art date
Application number
TW097139204A
Other languages
English (en)
Chinese (zh)
Inventor
Susumu Kasukabe
Yasunori Narizuka
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200937022A publication Critical patent/TW200937022A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW097139204A 2008-02-27 2008-10-13 Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device TW200937022A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008045809A JP2009204393A (ja) 2008-02-27 2008-02-27 プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW200937022A true TW200937022A (en) 2009-09-01

Family

ID=40997663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097139204A TW200937022A (en) 2008-02-27 2008-10-13 Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device

Country Status (5)

Country Link
US (1) US7724006B2 (https=)
JP (1) JP2009204393A (https=)
KR (1) KR101004922B1 (https=)
CN (1) CN101520470B (https=)
TW (1) TW200937022A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481882B (zh) * 2013-04-12 2015-04-21 Giga Byte Tech Co Ltd 電路板測試系統及其測試方法
TWI601959B (zh) * 2013-06-06 2017-10-11 Elfinote Tech Corporation Proximity patch for probe card, method for manufacturing patch for probe card and probe card
TWI818853B (zh) * 2022-05-24 2023-10-11 南韓商Ｔｓｅ有限公司 半導體封裝的測試裝置

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US8076216B2 (en) 2008-11-11 2011-12-13 Advanced Inquiry Systems, Inc. Methods and apparatus for thinning, testing and singulating a semiconductor wafer
KR101278131B1 (ko) * 2009-04-28 2013-07-05 가부시키가이샤 어드밴티스트 배선 기판 유닛 및 시험 장치
US9176186B2 (en) 2009-08-25 2015-11-03 Translarity, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed
US8362797B2 (en) * 2009-08-25 2013-01-29 Advanced Inquiry Systems, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween
JP5397619B2 (ja) * 2009-11-13 2014-01-22 日本電産リード株式会社 基板検査用の検査治具
JP2013540354A (ja) * 2010-09-28 2013-10-31 アドバンスド インクワイアリー システムズ インコーポレイテッド ウエハテストシステムならびに関連する使用方法および製造方法
KR101149759B1 (ko) * 2011-03-14 2012-06-01 리노공업주식회사 반도체 디바이스의 검사장치
JP6092509B2 (ja) * 2011-10-17 2017-03-08 東京エレクトロン株式会社 接触端子の支持体及びプローブカード
JP5859834B2 (ja) 2011-12-06 2016-02-16 エルフィノート・テクノロジー株式会社 プローブカード用のバンプ付きメンブレンシート、プローブカード及びプローブカード用のバンプ付きメンブレンシートの製造方法
JP5947139B2 (ja) * 2012-07-27 2016-07-06 株式会社日本マイクロニクス プローブ及び電気的接続装置
JP6068925B2 (ja) * 2012-10-23 2017-01-25 株式会社日本マイクロニクス プローブの製造方法
CN104655885B (zh) * 2013-11-15 2018-01-05 本田技研工业株式会社 电流施加装置以及半导体元件的制造方法
US9285394B2 (en) * 2014-01-09 2016-03-15 Taiwan Semiconductor Manufacturing Co., Ltd. Testing apparatus and method
TWI521212B (zh) * 2014-03-10 2016-02-11 A method and a method of assembling a vertical probe device, and a vertical probe device
TWI596344B (zh) * 2016-04-27 2017-08-21 旺矽科技股份有限公司 Replaceable probe module probe card and its assembly method and probe module replacement side law
TWI638176B (zh) * 2017-07-18 2018-10-11 旺矽科技股份有限公司 電測裝置
IT201700017037A1 (it) * 2017-02-15 2018-08-15 Technoprobe Spa Scheda di misura per applicazioni ad alta frequenza
US10114041B2 (en) * 2017-03-28 2018-10-30 Ford Global Technologies, Llc Ground loop reduction apparatus
US10057989B1 (en) * 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics
JP7068578B2 (ja) * 2018-03-30 2022-05-17 山一電機株式会社 検査用ソケット
JP7287250B2 (ja) * 2019-11-18 2023-06-06 三菱電機株式会社 試験装置及び試験方法
TWI750552B (zh) * 2019-12-16 2021-12-21 旺矽科技股份有限公司 可定位之探針卡及其製作方法
TWI718938B (zh) * 2020-04-20 2021-02-11 中華精測科技股份有限公司 分隔式薄膜探針卡及其彈性模組
TWI719895B (zh) * 2020-05-11 2021-02-21 中華精測科技股份有限公司 陣列式薄膜探針卡及其測試模組
CN113347412B (zh) * 2021-06-04 2022-07-12 合肥市华宇半导体有限公司 一种dp转hdmi芯片的多方式检测装置
TWI775566B (zh) * 2021-08-13 2022-08-21 美商第一檢測有限公司 晶片檢測設備
TWI788113B (zh) * 2021-11-23 2022-12-21 創意電子股份有限公司 檢測裝置及其測試插座
CN116654863B (zh) * 2023-06-29 2025-02-14 苏州晶晟微纳半导体科技有限公司 一种3d-mems探针及其制备方法
JP2025186856A (ja) * 2024-06-12 2025-12-24 株式会社豊田中央研究所 電気特性計測に用いる計測治具および計測装置
JP2026014396A (ja) * 2024-07-19 2026-01-29 東京エレクトロン株式会社 検査装置、および検査用治具

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JP4554011B2 (ja) 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
TWI236723B (en) * 2002-10-02 2005-07-21 Renesas Tech Corp Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device
JP4465995B2 (ja) 2003-07-02 2010-05-26 株式会社日立製作所 プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法
JP4145293B2 (ja) * 2004-12-28 2008-09-03 株式会社ルネサステクノロジ 半導体検査装置および半導体装置の製造方法
JP4472593B2 (ja) * 2005-07-12 2010-06-02 東京エレクトロン株式会社 プローブカード
JP2007101373A (ja) * 2005-10-05 2007-04-19 Renesas Technology Corp プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法
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TWI481882B (zh) * 2013-04-12 2015-04-21 Giga Byte Tech Co Ltd 電路板測試系統及其測試方法
TWI601959B (zh) * 2013-06-06 2017-10-11 Elfinote Tech Corporation Proximity patch for probe card, method for manufacturing patch for probe card and probe card
TWI818853B (zh) * 2022-05-24 2023-10-11 南韓商Ｔｓｅ有限公司 半導體封裝的測試裝置
US12169219B2 (en) 2022-05-24 2024-12-17 Tse Co., Ltd. Apparatus for testing a semiconductor package

Also Published As

Publication number Publication date
CN101520470A (zh) 2009-09-02
JP2009204393A (ja) 2009-09-10
CN101520470B (zh) 2012-11-07
KR101004922B1 (ko) 2010-12-28
US7724006B2 (en) 2010-05-25
KR20090092679A (ko) 2009-09-01
US20090212798A1 (en) 2009-08-27

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