TW200848483A - Polyurethane imide resin and adhesive composition using this - Google Patents

Polyurethane imide resin and adhesive composition using this Download PDF

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Publication number
TW200848483A
TW200848483A TW097124567A TW97124567A TW200848483A TW 200848483 A TW200848483 A TW 200848483A TW 097124567 A TW097124567 A TW 097124567A TW 97124567 A TW97124567 A TW 97124567A TW 200848483 A TW200848483 A TW 200848483A
Authority
TW
Taiwan
Prior art keywords
resin
adhesive composition
bis
adhesive
polyurethane
Prior art date
Application number
TW097124567A
Other languages
English (en)
Chinese (zh)
Inventor
Minoru Sugiura
Masami Yusa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200848483A publication Critical patent/TW200848483A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW097124567A 2004-01-08 2004-12-31 Polyurethane imide resin and adhesive composition using this TW200848483A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004002922 2004-01-08
JP2004002923 2004-01-08

Publications (1)

Publication Number Publication Date
TW200848483A true TW200848483A (en) 2008-12-16

Family

ID=34889283

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097124567A TW200848483A (en) 2004-01-08 2004-12-31 Polyurethane imide resin and adhesive composition using this
TW093141783A TW200526710A (en) 2004-01-08 2004-12-31 Polyurethane imide resin and adhesive composition using the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW093141783A TW200526710A (en) 2004-01-08 2004-12-31 Polyurethane imide resin and adhesive composition using the same

Country Status (3)

Country Link
KR (2) KR100792056B1 (https=)
CN (2) CN101445714B (https=)
TW (2) TW200848483A (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008015759A1 (ja) * 2006-08-04 2009-12-17 日立化成工業株式会社 フィルム状接着剤、接着シート及びこれを使用した半導体装置
KR101063602B1 (ko) * 2006-08-22 2011-09-07 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
WO2008041646A1 (fr) 2006-10-04 2008-04-10 Hitachi Chemical Company, Ltd. Pâte résineuse pour fixation de puce, procédé de fabrication d'un dispositif semi-conducteur et dispositif semi-conducteur
KR101472941B1 (ko) * 2007-04-19 2014-12-16 가부시키가이샤 가네카 신규한 폴리이미드 전구체 조성물 및 그 이용
CN101121101B (zh) * 2007-07-06 2010-06-02 清华大学 聚氨酯酰亚胺渗透汽化芳烃/烷烃分离膜的制备方法
CN103724984B (zh) * 2009-10-07 2016-05-25 日立化成株式会社 热固性树脂组合物、形成柔性配线板的保护膜的方法以及柔性配线板
TWI510521B (zh) * 2013-01-21 2015-12-01 Daxin Materials Corp 聚亞醯胺結構以及聚亞醯胺樹脂組成物
CN104031241A (zh) * 2013-03-09 2014-09-10 东莞市长安东阳光铝业研发有限公司 一种有机硅改性聚氨酯-酰亚胺材料的制备方法及其应用
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6578100B2 (ja) * 2014-12-25 2019-09-18 日東シンコー株式会社 絶縁紙
CN105097068B (zh) * 2015-06-25 2017-03-08 英利能源(中国)有限公司 导电胶、太阳能电池串及其制备方法
JP7202690B2 (ja) * 2018-10-02 2023-01-12 ナミックス株式会社 樹脂組成物、基材付フィルム、金属/樹脂積層体および半導体装置
CN110041212B (zh) * 2019-05-21 2020-10-02 吉林大学 一种含氟多胺单体及其制备方法、一种聚酰亚胺及其制备方法和一种聚酰亚胺膜
CN110373026B (zh) * 2019-09-02 2021-06-29 无锡创彩光学材料有限公司 聚酰亚胺树脂组合物及其制备方法和薄膜
KR102800340B1 (ko) * 2023-10-19 2025-04-23 김형승 내열성과 저온 접착성이 우수한 (메타)아크릴레이트 말단의 폴리우레탄이미드(아미드) 공중합체를 포함하는 회로접속용 접착수지

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929358A (en) * 1989-08-09 1990-05-29 Exxon Research And Engineering Company Polyurethane-imide membranes and their use for the separation of aromatics from non-aromatics
US5098982A (en) * 1989-10-10 1992-03-24 The B. F. Goodrich Company Radiation curable thermoplastic polyurethanes
US4962271A (en) * 1989-12-19 1990-10-09 Exxon Research And Engineering Company Selective separation of multi-ring aromatic hydrocarbons from distillates by perstraction
JPH0523558A (ja) * 1989-12-19 1993-02-02 Exxon Res & Eng Co 支持薄層膜の製造
US5254659A (en) * 1990-03-27 1993-10-19 Hitachi, Ltd. Insulating coating composition, solderable insulated wires, production process of the insulated wires and flyback transformers using the insulated wires
KR970006896B1 (ko) * 1993-11-10 1997-04-30 생산기술연구원 내열성 폴리(우레탄-이미드)수지 및 그 제조방법
SG76530A1 (en) * 1997-03-03 2000-11-21 Hitachi Chemical Co Ltd Circuit boards using heat resistant resin for adhesive layers
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6403753B1 (en) * 2000-01-18 2002-06-11 Sandia Corporation Method of making thermally removable polyurethanes
KR100545255B1 (ko) * 2003-04-29 2006-01-24 (주)애드뷰 전도성 고분자를 포함하는 액정 배향제 조성물, 이를이용한 액정 배향막, 그 제조방법 및 상기 액정 배향막을포함하는 액정 소자
JP2006241174A (ja) * 2005-02-07 2006-09-14 Hitachi Chem Co Ltd ダイボンディング用フィルム状接着剤及びこれを用いた接着シート、並びに半導体装置。

Also Published As

Publication number Publication date
CN1637034B (zh) 2010-04-28
CN101445714B (zh) 2013-03-20
KR20050073528A (ko) 2005-07-14
TWI314567B (https=) 2009-09-11
CN1637034A (zh) 2005-07-13
TW200526710A (en) 2005-08-16
KR100860892B1 (ko) 2008-09-29
KR20070077201A (ko) 2007-07-25
KR100792056B1 (ko) 2008-01-04
CN101445714A (zh) 2009-06-03

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