TW200844020A - Stage device - Google Patents
Stage device Download PDFInfo
- Publication number
- TW200844020A TW200844020A TW097106465A TW97106465A TW200844020A TW 200844020 A TW200844020 A TW 200844020A TW 097106465 A TW097106465 A TW 097106465A TW 97106465 A TW97106465 A TW 97106465A TW 200844020 A TW200844020 A TW 200844020A
- Authority
- TW
- Taiwan
- Prior art keywords
- divided
- stage device
- base
- base frame
- elevated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Machine Tool Units (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007081987A JP4328364B2 (ja) | 2007-03-27 | 2007-03-27 | ステージ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200844020A true TW200844020A (en) | 2008-11-16 |
Family
ID=39114853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097106465A TW200844020A (en) | 2007-03-27 | 2008-02-25 | Stage device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4328364B2 (ko) |
KR (1) | KR20080087724A (ko) |
CN (1) | CN101274407A (ko) |
TW (1) | TW200844020A (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4964853B2 (ja) * | 2008-09-24 | 2012-07-04 | 住友重機械工業株式会社 | ステージ装置 |
JP5550255B2 (ja) * | 2009-04-28 | 2014-07-16 | 株式会社日立製作所 | ペースト塗布装置及び塗布方法 |
JP5380225B2 (ja) * | 2009-09-24 | 2014-01-08 | 株式会社日立ハイテクノロジーズ | ガラス基板の検査装置 |
JP6025516B2 (ja) * | 2012-11-15 | 2016-11-16 | 三菱重工業株式会社 | 取付加工機および加工方法 |
JP2014195805A (ja) * | 2014-05-19 | 2014-10-16 | 芝浦メカトロニクス株式会社 | ペースト塗布装置 |
-
2007
- 2007-03-27 JP JP2007081987A patent/JP4328364B2/ja not_active Expired - Fee Related
-
2008
- 2008-02-25 TW TW097106465A patent/TW200844020A/zh unknown
- 2008-03-26 CN CNA2008100872777A patent/CN101274407A/zh active Pending
- 2008-03-26 KR KR1020080027701A patent/KR20080087724A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CN101274407A (zh) | 2008-10-01 |
JP2008023698A (ja) | 2008-02-07 |
KR20080087724A (ko) | 2008-10-01 |
JP4328364B2 (ja) | 2009-09-09 |
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