TW200841975A - Method of soldering electronic components - Google Patents

Method of soldering electronic components Download PDF

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Publication number
TW200841975A
TW200841975A TW96148139A TW96148139A TW200841975A TW 200841975 A TW200841975 A TW 200841975A TW 96148139 A TW96148139 A TW 96148139A TW 96148139 A TW96148139 A TW 96148139A TW 200841975 A TW200841975 A TW 200841975A
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TW
Taiwan
Prior art keywords
soldering
solder
electronic components
glass
metal
Prior art date
Application number
TW96148139A
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English (en)
Inventor
Hugues Lefevre
Antoine Luijkx
Original Assignee
Agc Flat Glass Europe Sa
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Application filed by Agc Flat Glass Europe Sa filed Critical Agc Flat Glass Europe Sa
Publication of TW200841975A publication Critical patent/TW200841975A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
    • C03C17/3673—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in heating devices for rear window of vehicles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/90—Other aspects of coatings
    • C03C2217/94—Transparent conductive oxide layers [TCO] being part of a multilayer coating
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)

Description

200841975 九、發明說明： 【發明所屬之技術領域】 • 本發明係關於一種涉.及使用超聲波將電子元件銲接至一 無機剛性基板之方法。 【先前技術】 *人們知曉含有錫、鋅及少量鈦之適合銲接諸如玻璃及陶 ▲ 兗等氧化物材料之無鉛銲料（EP 1 080 824 A1)。 然而，彼文件並未揭示電子元件至氧化物基板之銲接。 ^ 【發明内容】 本發明藉由提供一種涉及使用超聲波將電子元件銲接至 一剛性無機氧化物基板之方法來糾正此缺陷。 出於此目的，本發明係關於一種如請求項丨定義之銲接 方法。 因此，與存在於將電子元件膠合至剛性氧化物基板中之 方法相比，該將電子元件銲接至該剛性氧化物基板係有利 的，乃因其不涉及隨著時間而不穩定之有機膠。 — 该附屬請求項界定本發明之其他可能實施例，其中之某 些實施例較佳。 ' 【實施方式】 根據本發明之銲接方法係關於產生光輻射之電子元件。 術:光輻射應理解為意指落入可見光譜内之輻射及處於 名光碏外之輻射兩者。該等輻射可係完全單色，或相反 地，可分佈於一個或多個鄰接或不鄰接之頻帶上。該等元 件可达自具有光電子性質之元件及能夠發射處於該可見光 127357.doc 200841975 譜之外之輻射，可能並具有落入此光譜内之輻射的元件。 此等元件係例如在可見光譜及uv内發射之發光二極體 (LED)及/或可見光及/或IR二極體。 秦
藉由根據本發明之方法實施之該等電子元件的銲接係發 生於一無機剛性基板上。此處術語”剛性基板”應理解為意 才曰一扁平狀固態本體，亦即具有一較其之其他尺寸為小之 厚度且具有足夠之撓性及抗扭強度以在外部應力作用下不 鉍形之固態本體。尤其，所使用之剛性基板通常對風，及 一般惡劣天氣包含冰及雪表現出良好抵抗性。該基板可呈 一由一單一無機材料組成之剛性板之形式，或相反地，可 係將若干具有相同無機材料或不同材料之片或板組裝結合 (經膠合或經銲接）在一起之結果。實例為經覆蓋一氧化膜 之金屬板、陶瓷、石英或玻璃板、以及由該等材料中之一 者或多者製成之薄板及膠合板，且其中該等材料中之至少 一者佔據欲進行銲接之表面。 根據本發明之銲接方法係透過超聲波之同步作用發生。 此等波係需要-實體支援以進行傳播之彈性波，亦:聲波 之情形。其頻率通常在自3()至7() KHz之範圍内，且較佳地 自40至6G KHz。超聲輻射之強度係視產生超聲之振盈器之 標稱功率而定。此功率必須適合該欲進行銲接之物體1大 小。當該等電子元件係發光二極體（LED)時，經證實每個 LED 10至20 w左右之功率值相當適合。 絲據本發明之銲接方法中，必須在標準大氣μ力條件 下在一含按體積計大於2%之氧之氣體氣氛中進行操作。 127357.doc 200841975 該基板之化學結構亦必須包括氧原子，例如在固體 體或無定形晶袼中。 結 曰曰 秦
根據本發明，該方法要求使用-可炼銲料，其係-包括 至少金屬錫及鋅之無鉛合金。此方法亦具有無需同時存在 助熔劑或一蝕刻劑之優點，且因此避免此等化合物所致 之腐蝕及污染問題。 在根據本發明之方法之—實施例中，詩銲接之合金亦 包含選自銀、鐵、銅、錦及欽中之至少一金屬。在該鲜接 合金中可存在該等金屬中之若干種或甚至其全部。如上所 表月°亥等金屬會影響該合金之固-液相變溫度及其後之 銲接方法之溫度。應注意選擇在該銲接作t持續之幾十秒 鐘期間其㈣與該等電子元件之良好抵抗性相容之特定合 金0 在了月b /、说Μ &例相容之根據本發明之銲接方法之另 一實施例中，該銲料之合金亦包含選自鈽、銦、矽、鍺、 鎵、銻及砷中之至少一金屬。 根據本發明之銲接方法之一特定較佳實施例係其中該無 機剛性基板係一玻璃或一陶瓷。該方法尤其適合將電子元 件銲接至玻璃。可使用所有類型之玻璃，諸如（例如）鈉鈣 玻璃、硼玻璃、光學玻璃等。鈉鈣玻璃已給出極佳結果。 根據本發明之方法亦極適合將電子元件銲接至經覆蓋金 屬氧化物之玻璃板，尤其係彼等覆蓋有一導電氧化物層之 玻璃板。經常遇到之一實例係塗佈有導電金屬氧化物層之 玻璃。在該等導電層中，亦可使用摻雜氟及/或摻雜銻之 127357.doc 200841975 S η Ο 2 層或由 _ a _ . 义由包含至少一銀層之多個個別金屬氧化物層之 堆疊形成之其他層。 所有杯接方法，根據本發明之銲接方法亦要求銲料 在、旱接零件期間藉由施加熱而溶化。於此情形下，在一超 聲波之輻射場影響下，使該電子元件及該無機基板與該銲 料接觸□為杯料通常係共晶合金或混合物，因而該等鲜 料之每一成份皆具有一熔點或處於一發生熔化之至少極窄 之溫度範圍。施加熱能之目的係提供銲料熔化所需之潛在 熱量以保持處於其已自固相變至液相之狀態。通常，該等 1度逛低於用於製造無機支撐件之材料的溶點。可遇到介 於自約1〇〇。〇至約500。(：之銲料溫度，此相依於共晶之特定 性質。 使用此技術，可藉由一金屬棒同時施加超聲波及熱，該 金屬棒以一尖端或斜面形狀之端件終結，其經受超聲波頻 率之振動，藉由圍繞該棒之周邊纏繞一電阻加熱組件來加 熱該棒。 127357.doc

Claims (1)

  1. 200841975 十、申請專利範圍： 1· -種涉及使用超聲波將電子元件銲接至—無機剛性基板 之方法，其特徵在於該工作係在一按體積計含大於心氧 之氣體氣氛中執行，該基板之化學結構包含氧原子及該 銲料係一含有至少該等金屬錫及辞之無鉛合全。'' 人 2·如請求項！之銲接方法，其特徵在於該㈣之該合金亦 包含選自銀、鐵、銅、鎳及鈦之至少一金屬。 亦包含選自鈽、銦、矽、鍺、鎵、銻及砷之至少 3·如請求項!或2之銲接方法’其特徵在於該銲料之 允 士I 人，ee 上…. 口、’ 金 屬 4. 如請求項_之銲接方法，其特徵在於該無機剛性基核 為一玻璃或一陶莞。 5. 如=求項4之銲接方法，其特徵在於該無機剛性基板為 一復盍有導電金屬氧化物之玻璃。 6·如明求項5之銲接方法，其特徵在於該等導電金屬氧化 物係一掺雜氟及/或摻雜銻之Sn02層。 月长員5之#接方法，其特徵在於該等導 物為一由一包含至 鸯乳化 銀層之五屬虱化物之多個個別芦 之堆疊構成之層。 曰 8·:請求項_之銲接方法，其特徵在於同時施加該等超 耳波及熱，以使該銲料熔化且藉由化學鍵結將其一方面 :接至該破璃或該導電層及另一方面附接至該等電子元 9·如明求項8之銲接方法，其特徵在於藉由一金屬棒執行 127357.doc 200841975 超聲波及熱之同時施加，該金屬棒以一尖端或斜面形狀 之端件終結，其經受超聲波頻率之振動，該棒係藉由圍 繞其周邊纏繞一電阻加熱元件而經加熱。
    10.如請求項1或2之銲接方法 發光二極體。 其特徵在於該等 電子元件為 127357.doc 200841975 七、指定代表圖： (一)本案指定代表圖為：（無） 參 (二)本代表圖之元件符號簡單說明： 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式： * (無） 127357.doc
TW96148139A 2006-12-14 2007-12-14 Method of soldering electronic components TW200841975A (en)

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EP06126174A EP1932615A1 (fr) 2006-12-14 2006-12-14 Procédé de soudage de composants éléctroniques

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TW200841975A true TW200841975A (en) 2008-11-01

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EP (2) EP1932615A1 (zh)
EA (1) EA014889B1 (zh)
TW (1) TW200841975A (zh)
WO (1) WO2008071764A1 (zh)

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EP2099579A1 (fr) 2009-09-16
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EP2099579B1 (fr) 2015-10-07
EP1932615A1 (fr) 2008-06-18
EA200900823A1 (ru) 2009-12-30

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