TW200841975A - Method of soldering electronic components - Google Patents
Method of soldering electronic components Download PDFInfo
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- TW200841975A TW200841975A TW96148139A TW96148139A TW200841975A TW 200841975 A TW200841975 A TW 200841975A TW 96148139 A TW96148139 A TW 96148139A TW 96148139 A TW96148139 A TW 96148139A TW 200841975 A TW200841975 A TW 200841975A
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- soldering
- solder
- electronic components
- glass
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3673—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in heating devices for rear window of vehicles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/90—Other aspects of coatings
- C03C2217/94—Transparent conductive oxide layers [TCO] being part of a multilayer coating
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structural Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Description
200841975 九、發明說明: 【發明所屬之技術領域】 • 本發明係關於一種涉.及使用超聲波將電子元件銲接至一 無機剛性基板之方法。 【先前技術】 *人們知曉含有錫、鋅及少量鈦之適合銲接諸如玻璃及陶 ▲ 兗等氧化物材料之無鉛銲料(EP 1 080 824 A1)。 然而,彼文件並未揭示電子元件至氧化物基板之銲接。 ^ 【發明内容】 本發明藉由提供一種涉及使用超聲波將電子元件銲接至 一剛性無機氧化物基板之方法來糾正此缺陷。 出於此目的,本發明係關於一種如請求項丨定義之銲接 方法。 因此,與存在於將電子元件膠合至剛性氧化物基板中之 方法相比,該將電子元件銲接至該剛性氧化物基板係有利 的,乃因其不涉及隨著時間而不穩定之有機膠。 — 该附屬請求項界定本發明之其他可能實施例,其中之某 些實施例較佳。 ' 【實施方式】 根據本發明之銲接方法係關於產生光輻射之電子元件。 術:光輻射應理解為意指落入可見光譜内之輻射及處於 名光碏外之輻射兩者。該等輻射可係完全單色,或相反 地,可分佈於一個或多個鄰接或不鄰接之頻帶上。該等元 件可达自具有光電子性質之元件及能夠發射處於該可見光 127357.doc 200841975 譜之外之輻射,可能並具有落入此光譜内之輻射的元件。 此等元件係例如在可見光譜及uv内發射之發光二極體 (LED)及/或可見光及/或IR二極體。 秦
藉由根據本發明之方法實施之該等電子元件的銲接係發 生於一無機剛性基板上。此處術語”剛性基板”應理解為意 才曰一扁平狀固態本體,亦即具有一較其之其他尺寸為小之 厚度且具有足夠之撓性及抗扭強度以在外部應力作用下不 鉍形之固態本體。尤其,所使用之剛性基板通常對風,及 一般惡劣天氣包含冰及雪表現出良好抵抗性。該基板可呈 一由一單一無機材料組成之剛性板之形式,或相反地,可 係將若干具有相同無機材料或不同材料之片或板組裝結合 (經膠合或經銲接)在一起之結果。實例為經覆蓋一氧化膜 之金屬板、陶瓷、石英或玻璃板、以及由該等材料中之一 者或多者製成之薄板及膠合板,且其中該等材料中之至少 一者佔據欲進行銲接之表面。 根據本發明之銲接方法係透過超聲波之同步作用發生。 此等波係需要-實體支援以進行傳播之彈性波,亦:聲波 之情形。其頻率通常在自3()至7() KHz之範圍内,且較佳地 自40至6G KHz。超聲輻射之強度係視產生超聲之振盈器之 標稱功率而定。此功率必須適合該欲進行銲接之物體1大 小。當該等電子元件係發光二極體(LED)時,經證實每個 LED 10至20 w左右之功率值相當適合。 絲據本發明之銲接方法中,必須在標準大氣μ力條件 下在一含按體積計大於2%之氧之氣體氣氛中進行操作。 127357.doc 200841975 該基板之化學結構亦必須包括氧原子,例如在固體 體或無定形晶袼中。 結 曰曰 秦
根據本發明,該方法要求使用-可炼銲料,其係-包括 至少金屬錫及鋅之無鉛合金。此方法亦具有無需同時存在 助熔劑或一蝕刻劑之優點,且因此避免此等化合物所致 之腐蝕及污染問題。 在根據本發明之方法之—實施例中,詩銲接之合金亦 包含選自銀、鐵、銅、錦及欽中之至少一金屬。在該鲜接 合金中可存在該等金屬中之若干種或甚至其全部。如上所 表月°亥等金屬會影響該合金之固-液相變溫度及其後之 銲接方法之溫度。應注意選擇在該銲接作t持續之幾十秒 鐘期間其㈣與該等電子元件之良好抵抗性相容之特定合 金0 在了月b /、说Μ &例相容之根據本發明之銲接方法之另 一實施例中,該銲料之合金亦包含選自鈽、銦、矽、鍺、 鎵、銻及砷中之至少一金屬。 根據本發明之銲接方法之一特定較佳實施例係其中該無 機剛性基板係一玻璃或一陶瓷。該方法尤其適合將電子元 件銲接至玻璃。可使用所有類型之玻璃,諸如(例如)鈉鈣 玻璃、硼玻璃、光學玻璃等。鈉鈣玻璃已給出極佳結果。 根據本發明之方法亦極適合將電子元件銲接至經覆蓋金 屬氧化物之玻璃板,尤其係彼等覆蓋有一導電氧化物層之 玻璃板。經常遇到之一實例係塗佈有導電金屬氧化物層之 玻璃。在該等導電層中,亦可使用摻雜氟及/或摻雜銻之 127357.doc 200841975 S η Ο 2 層或由 _ a _ . 义由包含至少一銀層之多個個別金屬氧化物層之 堆疊形成之其他層。 所有杯接方法,根據本發明之銲接方法亦要求銲料 在、旱接零件期間藉由施加熱而溶化。於此情形下,在一超 聲波之輻射場影響下,使該電子元件及該無機基板與該銲 料接觸□為杯料通常係共晶合金或混合物,因而該等鲜 料之每一成份皆具有一熔點或處於一發生熔化之至少極窄 之溫度範圍。施加熱能之目的係提供銲料熔化所需之潛在 熱量以保持處於其已自固相變至液相之狀態。通常,該等 1度逛低於用於製造無機支撐件之材料的溶點。可遇到介 於自約1〇〇。〇至約500。(:之銲料溫度,此相依於共晶之特定 性質。 使用此技術,可藉由一金屬棒同時施加超聲波及熱,該 金屬棒以一尖端或斜面形狀之端件終結,其經受超聲波頻 率之振動,藉由圍繞該棒之周邊纏繞一電阻加熱組件來加 熱該棒。 127357.doc
Claims (1)
- 200841975 十、申請專利範圍: 1· -種涉及使用超聲波將電子元件銲接至—無機剛性基板 之方法,其特徵在於該工作係在一按體積計含大於心氧 之氣體氣氛中執行,該基板之化學結構包含氧原子及該 銲料係一含有至少該等金屬錫及辞之無鉛合全。'' 人 2·如請求項!之銲接方法,其特徵在於該㈣之該合金亦 包含選自銀、鐵、銅、鎳及鈦之至少一金屬。 亦包含選自鈽、銦、矽、鍺、鎵、銻及砷之至少 3·如請求項!或2之銲接方法’其特徵在於該銲料之 允 士I 人,ee 上…. 口、’ 金 屬 4. 如請求項_之銲接方法,其特徵在於該無機剛性基核 為一玻璃或一陶莞。 5. 如=求項4之銲接方法,其特徵在於該無機剛性基板為 一復盍有導電金屬氧化物之玻璃。 6·如明求項5之銲接方法,其特徵在於該等導電金屬氧化 物係一掺雜氟及/或摻雜銻之Sn02層。 月长員5之#接方法,其特徵在於該等導 物為一由一包含至 鸯乳化 銀層之五屬虱化物之多個個別芦 之堆疊構成之層。 曰 8·:請求項_之銲接方法,其特徵在於同時施加該等超 耳波及熱,以使該銲料熔化且藉由化學鍵結將其一方面 :接至該破璃或該導電層及另一方面附接至該等電子元 9·如明求項8之銲接方法,其特徵在於藉由一金屬棒執行 127357.doc 200841975 超聲波及熱之同時施加,該金屬棒以一尖端或斜面形狀 之端件終結,其經受超聲波頻率之振動,該棒係藉由圍 繞其周邊纏繞一電阻加熱元件而經加熱。10.如請求項1或2之銲接方法 發光二極體。 其特徵在於該等 電子元件為 127357.doc 200841975 七、指定代表圖: (一)本案指定代表圖為:(無) 參 (二)本代表圖之元件符號簡單說明: 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式: * (無) 127357.doc
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06126174A EP1932615A1 (fr) | 2006-12-14 | 2006-12-14 | Procédé de soudage de composants éléctroniques |
Publications (1)
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TW200841975A true TW200841975A (en) | 2008-11-01 |
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Application Number | Title | Priority Date | Filing Date |
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TW96148139A TW200841975A (en) | 2006-12-14 | 2007-12-14 | Method of soldering electronic components |
Country Status (4)
Country | Link |
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EP (2) | EP1932615A1 (zh) |
EA (1) | EA014889B1 (zh) |
TW (1) | TW200841975A (zh) |
WO (1) | WO2008071764A1 (zh) |
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CN102642098A (zh) * | 2012-04-23 | 2012-08-22 | 浙江省冶金研究院有限公司 | 漆包线浸焊用高温抗氧化无铅焊棒 |
CN103381526B (zh) * | 2013-06-22 | 2016-02-03 | 宁波市鄞州品达电器焊料有限公司 | 一种新型焊料 |
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US1409964A (en) * | 1921-05-03 | 1922-03-21 | Morrison Nathaniel | Box opener |
JPS5616560B2 (zh) * | 1972-07-20 | 1981-04-16 | ||
US5071058A (en) * | 1988-09-30 | 1991-12-10 | Union Carbide Industrial Gases Technology Corporation | Process for joining/coating using an atmosphere having a controlled oxidation capability |
US5390845A (en) * | 1992-06-24 | 1995-02-21 | Praxair Technology, Inc. | Low-bridging soldering process |
JP2000326088A (ja) * | 1999-03-16 | 2000-11-28 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
-
2006
- 2006-12-14 EP EP06126174A patent/EP1932615A1/fr not_active Withdrawn
-
2007
- 2007-12-13 EP EP07857531.3A patent/EP2099579B1/fr active Active
- 2007-12-13 EA EA200900823A patent/EA014889B1/ru not_active IP Right Cessation
- 2007-12-13 WO PCT/EP2007/063884 patent/WO2008071764A1/fr active Application Filing
- 2007-12-14 TW TW96148139A patent/TW200841975A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EA014889B1 (ru) | 2011-02-28 |
EP2099579A1 (fr) | 2009-09-16 |
WO2008071764A1 (fr) | 2008-06-19 |
EP2099579B1 (fr) | 2015-10-07 |
EP1932615A1 (fr) | 2008-06-18 |
EA200900823A1 (ru) | 2009-12-30 |
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