TW200827729A - Wiring fixing method of probe unit and probe unit - Google Patents

Wiring fixing method of probe unit and probe unit Download PDF

Info

Publication number
TW200827729A
TW200827729A TW096149662A TW96149662A TW200827729A TW 200827729 A TW200827729 A TW 200827729A TW 096149662 A TW096149662 A TW 096149662A TW 96149662 A TW96149662 A TW 96149662A TW 200827729 A TW200827729 A TW 200827729A
Authority
TW
Taiwan
Prior art keywords
wiring
probe
insertion hole
hole
probe unit
Prior art date
Application number
TW096149662A
Other languages
English (en)
Chinese (zh)
Other versions
TWI348025B (ja
Inventor
Shigeki Ishikawa
Shogo Imuta
Takashi Nidaira
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200827729A publication Critical patent/TW200827729A/zh
Application granted granted Critical
Publication of TWI348025B publication Critical patent/TWI348025B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW096149662A 2006-12-28 2007-12-24 Wiring fixing method of probe unit and probe unit TW200827729A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006356384 2006-12-28
PCT/JP2007/074211 WO2008081704A1 (ja) 2006-12-28 2007-12-17 プローブユニットの配線固定方法およびプローブユニット

Publications (2)

Publication Number Publication Date
TW200827729A true TW200827729A (en) 2008-07-01
TWI348025B TWI348025B (ja) 2011-09-01

Family

ID=39588388

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096149662A TW200827729A (en) 2006-12-28 2007-12-24 Wiring fixing method of probe unit and probe unit

Country Status (3)

Country Link
JP (1) JP4804542B2 (ja)
TW (1) TW200827729A (ja)
WO (1) WO2008081704A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424165B (zh) * 2009-04-09 2014-01-21 Nhk Spring Co Ltd 接觸探針及探針單元

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI541515B (zh) * 2014-06-27 2016-07-11 旺矽科技股份有限公司 探針卡的定位件與探針卡的探針頭
KR101819355B1 (ko) 2016-08-03 2018-01-16 류동수 후 변위 텐션 부여 방식 와이어 프로브 지그
KR101819354B1 (ko) 2016-08-03 2018-01-16 류동수 후 변위 텐션 부여 방식 프로브 지그 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3538036B2 (ja) * 1998-09-10 2004-06-14 イビデン株式会社 チェッカーヘッドおよびその製造方法
JP2002055118A (ja) * 2000-08-11 2002-02-20 Citizen Watch Co Ltd プローバー
JP2002214285A (ja) * 2001-01-16 2002-07-31 Nagase & Co Ltd ピッチ変換治具
JP2003130888A (ja) * 2001-10-26 2003-05-08 Internet Kk 受けピンを不要としたコンタクトプローブ受け基板
JP3690796B2 (ja) * 2002-01-31 2005-08-31 株式会社コーヨーテクノス 検査冶具及びその製造方法並びに回路基板の製造方法
JP3848582B2 (ja) * 2002-02-12 2006-11-22 株式会社日本マイクロニクス 電気的接続装置
JP2004138385A (ja) * 2002-10-15 2004-05-13 Ibiden Engineering Kk チェッカーヘッドおよびその製造方法
JP2006126180A (ja) * 2004-09-30 2006-05-18 Jsr Corp 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置
JP3849948B1 (ja) * 2005-11-16 2006-11-22 日本電産リード株式会社 基板検査用治具及び検査用プローブ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424165B (zh) * 2009-04-09 2014-01-21 Nhk Spring Co Ltd 接觸探針及探針單元

Also Published As

Publication number Publication date
JP4804542B2 (ja) 2011-11-02
WO2008081704A1 (ja) 2008-07-10
TWI348025B (ja) 2011-09-01
JPWO2008081704A1 (ja) 2010-04-30

Similar Documents

Publication Publication Date Title
JP3486841B2 (ja) 垂直型プローブカード
TW200846668A (en) Probe and probe card having the same
TWI282423B (en) Probe card
TW200804831A (en) Probe card
TW200827729A (en) Wiring fixing method of probe unit and probe unit
TWI264548B (en) Electronic component/interface interposer
WO2016157964A1 (ja) 検査治具及び基板検査装置
TW434407B (en) Probe card
CN103207366A (zh) 测试系统及印刷电路板组件的测试方法
TW200900703A (en) Probe, probe assembly and probe card having the same
TW201131172A (en) Contactor
JP2005345443A (ja) プローブカード用接続ピンおよびそれを用いたプローブカード
TWI359535B (en) Zif connectors and semiconductor testing device an
TWI273246B (en) Elastic probe pins in row and method for fabricating the same
TWI241055B (en) Electrical connector
KR101064852B1 (ko) 프로브 카드용 니들
US7795891B2 (en) Tester with low signal attenuation
TWI394952B (zh) 探針單元
WO2006035856A1 (ja) 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置
TWI298790B (en) Voltage detection circuit and system utilizing the same
JP7298614B2 (ja) プローブ、検査治具、検査装置、及びプローブの製造方法
KR20200074244A (ko) 전기 특성의 검사 방법
TWI317427B (en) Probe head module for multi-site probing
JP2008267833A (ja) 基板検査用治具及びこの治具における接続電極部の電極構造
TWI326770B (ja)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees