1317427 九、發明說明： 【發明所屬之技術領域】 特別係有關於一種多 本發明係有關於一種探針卡 部位探測之探針頭模組。 【先前技術】 在積盤電路測試領域中，使用探針卡(—aw)裝 =在一探測機台内，探針卡在_探針頭（ρ_⑽）之 表面設有探針’用以電性探觸—待測積趙電路(dut test)’以作為電性傳輸界面。在測試過程 ’會有磨耗、歪斜或斷針之現象，而需要整修。 整修方式是更換探針頭’須將所有探針磨除，再 权置新的探針。然對於多部位探測（multi_si 、S，會造成相當大的浪費與不方便。所謂的 罙阅，便是在一次探壓的動作中，同時電性導接 T ,個待測積體電路’單就測試同一類型之積體電路， 夕°P位探測之探針卡比單部位探測之探針卡具有數倍 至數十倍的揲針數量。 第 1 圖所示，一種習知多部位探測之探針卡1 〇〇 卞 贾 ^ 探針頭11 0、一印刷電路板1 20以及複數個 探針130。兮挪必丄 该探針頭1 1 0之一表面1丨丨係定義有複數個 矩陣排列$ _、ai ^ 探測區11 2 ’每一探測區11 2係可對應至一 Λ〉彳積體電路。該探針頭n〇之另一表面係設置於該 電路板12〇上。每一探針13〇係具有一固定端⑴ 及一探測端1 1 132 ’該些固定端131係直接焊接於該探針 1317427 頭11 0之該些探測區丨丨2内，該些探測端1 3 2係可同時 探觸複數個待測積體電路之電極端或測試墊。以往當其 中一探斜13〇損壞時，則需要更換整個探針頭u〇。導 致大幅増加了多部位探測之探針卡丨00之整修成本與 時間。 、 【發明内容】 本發明之主要目的係在於提供一種多部位探測之探1317427 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a probe head module for detecting a probe card portion. [Prior Art] In the field of stack circuit testing, the probe card (—aw) is mounted = in a probe machine, and the probe is placed on the surface of the probe head (ρ_(10)) with a probe 'for electricity. Sexual exploration - the dut test to be measured as an electrical transmission interface. During the test process, there will be wear, skew or broken needles, which will require refurbishment. The refurbishment method is to replace the probe head. All probes must be removed and a new probe is placed. However, for multi-site detection (multi_si, S, it will cause considerable waste and inconvenience. The so-called reading is in the action of one pressure detection, while the electrical conduction T, the circuit to be tested is 'single In the case of testing the same type of integrated circuit, the probe card of the °P bit detection has several times to several tens of times the number of 揲 pins than the single-position probe card. Figure 1 shows a conventional multi-site detection. The probe card 1 has a probe head 11 0, a printed circuit board 1 20, and a plurality of probes 130. The surface of the probe head 1 1 0 is defined by a plurality of The matrix arrangement $ _, ai ^ detection area 11 2 'each detection area 11 2 can correspond to a 彳 彳 体 body circuit. The other surface of the probe head n 设置 is disposed on the circuit board 12 。. Each of the probes 13 has a fixed end (1) and a detecting end 1 1 132 '. The fixed ends 131 are directly soldered to the detecting areas 丨丨2 of the heads 11 0 of the probes 1317427, and the detecting ends are 1 3 2 system can simultaneously probe the electrode ends or test pads of a plurality of integrated circuits to be tested. In the past, when one of the probes was damaged, 13〇 was damaged. In this case, the entire probe head u〇 needs to be replaced, which results in a large increase in the cost and time of repairing the probe card 00 of the multi-site detection. SUMMARY OF THE INVENTION The main object of the present invention is to provide a multi-site detection probe.
針頭模組’當部份探針故障或磨耗損傷時，僅需置換具 有故障探針之探針轉接片而不需替換整個的探針頭模 組’具有節省成本、重工及增加使用方便性之功效。 本發明的目的及解決其技術問題是採用以下技術方 案來實現的。依據本發明，一種多部位探測之探針頭模 組主要包含一探針頭基板以及複數個探針轉接片。該探 針頭基板之一表面係定義有複數個矩陣排列之探測 區，母一探測區内係設有複數個連接墊。該些探針轉接 片係具有一上表面與一下表面該上表面係設有複數個 探針，該下表面係設有複數個接合端。其中，每—探針 轉接片係# 口至對應之探冑區，以使該些接合端連接至 該些連接墊。 本發明&目#及解決其技術問題還可採用卩下技術 措施進一步實現。 在4述的多位探測之探針頭模組中，該些探針轉 接片係可具有與該、 探針頊基板相同之熱膨脹係數。 4 t述的多部位禊泪丨丨夕抱Λ, ~ u ^ ... 6 1317427 接片係可為半導體、陶瓷或膠片材賓 在前述的多部位探測之探斜頭模 接片係可具有複數個貫孔，以接合驾 在前述的多部位探測之探針頭模 可填入有焊接劑，以固定該些探針。 在前述的多部位探測之探針頭模 無鉛銲料或導電膠。 在前述的多部位探測之探針頭模 係可為銲球。 在前述的多部位探測之探針頭模 轉接片係可具有實質相同的尺寸、厚 【實施方式】 本發明之一具體實施例，揭示一 針頭模組。第2圖係為該探針頭模組 3圖係為該探針頭模組之立體示魚圖 針頭模組之探針頭基板之立體示意圖 示，該多部位探測之探針碩棋組2〇〇 印刷電路板310 ’以级成一探針卡。 該探針頭模組200係主要包含一探針 數個探針轉接片220,其中複數個探 些探針轉接片220’每—探針轉接片 待測積體電路，如一晶圓之其中一晶 一封裝構造（圖未緣出）。請參閱第4 基板210之一表面211係定義有複數 組中，該些探針轉 〖些探針之一端。 組中，該些貫孔内係 組中，該焊接劑係為 組中，該些接合端 組中’所有的探針 度與線路分佈。 種多部位探測之探 之戴面示意圖，第 ，第4圖係為該探 。請參閱第2圖所 係可裝設在一多層 配合參閱第3圖， 頭基板210以及複 針230係設置於該 220係可對應於一 片或一捲帶之其中 圖所示，該探針頭 個矩陣排列之探測 1317427 區 212， 該探針頭 個被動元 請參I 係具有一 設有複數 端 240 〇 . 能以回銲 220係可 一固定端 測端2 3 2 半導體產 接片220 具有通用 共用與置 請再I 220係接' 連接至該-片2 2 0係 數。例如| 膠片材質 因此， 探針2 3 (M 的複數個老 探測之探針頭 一探針頭，而 當部份之探針 每一探測區212内係設有複數個連接墊213。 基板210於該些探測區212之外可設置有複數 件，以作電性保護與穩壓。 聞第5、6八及6B圖所示，該些探針轉接片220 上表面221與一下表面222，該上表面221係 個探針230 ’該下表面222係設有複數個接合 在本實施例中’該些接合端24〇係可為銲球， 方式接合至該些連接墊213。該些探針轉接片 具有複數個貫孔223，以接合該些探針23〇之 231。此外，每一探針23〇係具有一懸空之探 ，用以探觸晶圓、BGA、TCP或TCP封裝件等 品之電極端或測試墊。較佳地，所有的探針轉 係可具有實質相同的尺寸、厚度與線路分佈， 性以利替換，故每一探針轉接片22〇係可互相 s至對應之探測區2 1 2，以4 u 12以使該些接合端24 座連接墊213。右夫香及丨+ 在本實施例中，該些探針轉4 可具此有與該探針頭基板21〇相同之熱膨… 。〜探針轉接# 220係可為半導體、陶^ 在上述的多部位 不直接焊設於單 針轉接片220， 模組中，該些 是接合在個別 23〇發生故障 1317427 或磨耗損傷時’僅需置換具有故障探針之探針轉接片 220而不需替換整個的探針頭模組2〇〇(如第2及3圖所 示），具有節省成本、重工及增加使用方便性之功效。 第7A至7E圖係進一步揭示前述探針轉接片22〇設 置探針23 0之製造方法。首先，請參閱第7A圖所示， 提供複數個探針轉接片220。每一探針轉接片22〇係具 有一上表面221、一下表面222及複數個貫孔223，其 中該下表面222係設有複數個金屬墊224，且該些金屬 墊224係位於對應該些貫孔223之一端。在本實施例 中，該些貫孔223係貫穿該上表面221與該下表面222。 接著，請參閱第7B圖所示，置入複數個探針23〇 於該些貫孔223中.每一探針23〇皆具有一固定端231 與一探測端232’該些固定端231係連接至一連接桿233 並位於該些貫孔223内，該些探測端232係具有突出於 該探針轉接片22〇之一致性高度。接著，請參閱第Μ 圖2示，填入一焊接劑25〇，用以焊接該些探針23〇之 固定端231於該些貫孔223並使該些探針23〇與該些金 屬墊22 4達到電性連接。在本實施例中，該焊接劑2 5 〇 係可為無鉛焊料。在不同實施例中，該焊接劑25〇或可 為導電膠。 後清參閱第7D圊所示，切斷該連接桿233與 該些探針23〇之連接。最後，請參閱第7E圖所示，設 數個例如銲球之接合端24〇於該些探針轉接片220 3下表面222，便可製成上述具有探針230之探針轉 1317427 接片220。 以上所述，僅是本發明的較佳實施例而已，並非對 本發明作任何形式上的限制，雖然本發明已以較佳實施 例揭露如上，然而並非用以限定本發明，任何熟悉本專 業的技術人員，在不脫離本發明技術方案範圍内，當可 利用上述揭示的技術内容作出些許更動或修飾為等同 變化的等效實施例，但凡是未脫離本發明技術方案的内 各’依據本發明的技術實質對以上實施例所作的任何簡 單修改、等同變化與修飾’均仍屬於本發明技術方案的 範圍内。 【圖式簡單說明】 第1圖：習知多部位探測之探針卡之截面示意圖。 第2圖：依據本發明之一具體實施例，一種多部位探測 之探針頭模組之截面示意圖。 第3圖：依據本發明之一具體實施例，該探針頭模組之 立體示意圖。 第4圖：依據本發明之一具體實施例，該探針頭模組之 探針頭基板之立體示意圖。 第5圖：依據本發明之一具體實施例，該探針頭模組之 其中一探針轉接片之截面示意圖。 第6A與6B圖：依據本發明之一具體實施例，該探針轉 接片之正向與反向立體示意圖。 第7Α至7Ε圖：依據本發明之一具體實施例，該探針頭 模組之其中一探針轉接片在製造流程中之戴面示 1317427 意圖。 【主要元件符號說明】Needle module 'When part of the probe is faulty or wear damaged, it only needs to replace the probe adapter with the faulty probe without replacing the entire probe head module' with cost saving, heavy work and increased ease of use. The effect. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. According to the present invention, a probe head module for multi-site detection mainly comprises a probe head substrate and a plurality of probe adapter sheets. One of the surfaces of the probe substrate defines a plurality of matrix array detection zones, and a plurality of connection pads are disposed in the mother detection zone. The probe adapter sheets have an upper surface and a lower surface. The upper surface is provided with a plurality of probes, and the lower surface is provided with a plurality of joint ends. Wherein, each probe adapter is connected to the corresponding detection zone so that the joint ends are connected to the connection pads. The present invention & </ RTI> and solving its technical problems can be further realized by adopting the technical measures. In the probe head module of the multiple probes described in the above description, the probe transfer tabs may have the same thermal expansion coefficient as the probe cassette substrate. 4 t described multiple parts of the tears 丨丨 Λ Λ, ~ u ^ ... 6 1317427 接片 can be semiconductor, ceramic or film material in the above-mentioned multi-site detection of the probe head die can have A plurality of through holes are used to join the probe head molds which are detected in the above-mentioned multiple parts to be filled with a solder to fix the probes. The probe head mold probed in the above multiple parts is lead-free solder or conductive paste. The probe tip module detected in the aforementioned multi-site can be a solder ball. The above-mentioned multi-site probe tip die adapter can have substantially the same size and thickness. [Embodiment] One embodiment of the present invention discloses a needle module. FIG. 2 is a perspective schematic view showing the probe head module 3 of the probe head module of the probe head module of the probe head module, and the multi-site detection probe master chess group The printed circuit board 310' is stepped into a probe card. The probe head module 200 mainly includes a probe and a plurality of probe adapters 220, wherein a plurality of probe adapters 220' each of the probe adapters are to be tested, such as a wafer. One of the crystal-packaged structures (not shown). Referring to the surface 211 of one of the fourth substrates 210, a plurality of groups are defined, and the probes are turned to one end of the probes. In the set, in the inner set of the through holes, the solder is in the group, and all the probe degrees and line distributions in the joint end groups. A schematic diagram of the wearing of a multi-site detection, the fourth and fourth figures are the probes. Please refer to FIG. 2 for mounting in a multi-layer. Referring to FIG. 3, the head substrate 210 and the multi-needle 230 are disposed on the 220-series which may correspond to one or a reel. The first matrix arrangement detects 1317427 area 212, and the first passive element of the probe has a complex end 240 〇. It can be reflowed 220 can be a fixed end measuring end 2 3 2 semiconductor production piece 220 With a universal share and a request, I 220 is connected to the -2 2 0 coefficient. For example, the film material is therefore a probe 2 3 (multiple old probe probe heads of M), and a plurality of connection pads 213 are provided in each detection zone 212 of the partial probes. A plurality of components may be disposed outside the detection zones 212 for electrical protection and voltage regulation. The upper surface 221 and the lower surface 222 of the probe adapters 220 are shown in Figures 5, 6 and 6B. The upper surface 221 is a probe 230 ′. The lower surface 222 is provided with a plurality of joints. In the embodiment, the joint ends 24 can be solder balls, and the joints are connected to the connection pads 213. The probe adapter has a plurality of through holes 223 for engaging the probes 23 231. In addition, each probe 23 has a floating probe for detecting wafers, BGA, TCP or TCP. The electrode end or test pad of the package or the like. Preferably, all of the probe transfer systems can have substantially the same size, thickness and line distribution, and can be replaced by a property, so that each probe transfer piece 22 can be s to each other to the corresponding detection zone 2 1 2, to 4 u 12 so that the joint ends 24 are connected to the pad 213. Right Fuxiang and 丨+ in this In the embodiment, the probes 4 can have the same thermal expansion as the probe head substrate 21. The probe transfer #220 can be a semiconductor, and the ceramics are not directly soldered in the above multiple parts. It is provided in the single-needle adapter piece 220, the module, which is engaged in the failure of 1317427 or wear damage of the individual 23〇, and only needs to replace the probe adapter piece 220 with the faulty probe without replacing the whole probe. The needle module 2〇〇 (as shown in Figures 2 and 3) has the effect of cost saving, heavy work and increased ease of use. Figures 7A to 7E further disclose the aforementioned probe adapter piece 22 First, please refer to Fig. 7A to provide a plurality of probe adapters 220. Each probe adapter 22 has an upper surface 221, a lower surface 222 and a plurality of through holes. 223, wherein the lower surface 222 is provided with a plurality of metal pads 224, and the metal pads 224 are located at one end of the corresponding through holes 223. In the embodiment, the through holes 223 extend through the upper surface 221 And the lower surface 222. Next, as shown in Fig. 7B, a plurality of probes 23 are placed Each of the probes 223 has a fixed end 231 and a detecting end 232'. The fixed ends 231 are connected to a connecting rod 233 and located in the through holes 223. The detecting ends 232 It has a uniform height protruding from the probe adapter piece 22. Next, referring to FIG. 2, a soldering agent 25 is filled in, for soldering the fixed ends 231 of the probes 23 The through holes 223 and the probes 23 are electrically connected to the metal pads 224. In this embodiment, the solders 25 can be lead-free solder. In various embodiments, the solder 25 can be a conductive paste. After the cleaning, as shown in Fig. 7D, the connecting rod 233 is disconnected from the probes 23B. Finally, as shown in FIG. 7E, a plurality of bonding ends 24 such as solder balls are disposed on the lower surface 222 of the probe adapters 220 3 to form the probes 1317427 with the probes 230. Slice 220. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention. [Simple description of the figure] Fig. 1 is a schematic cross-sectional view of a conventional probe card for multi-site detection. Figure 2 is a cross-sectional view of a probe head module for multi-site detection in accordance with an embodiment of the present invention. Figure 3 is a perspective view of the probe head module in accordance with an embodiment of the present invention. Figure 4 is a perspective view of a probe head substrate of the probe head module in accordance with an embodiment of the present invention. Figure 5 is a cross-sectional view showing one of the probe adapters of the probe head module in accordance with an embodiment of the present invention. 6A and 6B are schematic diagrams showing the forward and reverse directions of the probe transfer piece in accordance with an embodiment of the present invention. 7 to 7: In accordance with an embodiment of the present invention, one of the probe adapter modules of the probe head module is intended to be worn in the manufacturing process. [Main component symbol description]
100 探針卡 110 探針頭 111 表面 112 探測區 120 印刷電路板 130 探針 131 固定端 132 探測端 200 探針頭模組 210 探針頭基板 211 表面 212 探測區 213 連接墊 220 探針轉接片 221 上表面 222 下表面 223 貫孔 224 金屬塾 230 探針 231 固定端 232 探測端 233 連接桿 240 接合端 250 焊接劑 310 印刷電路板100 probe card 110 probe head 111 surface 112 detection area 120 printed circuit board 130 probe 131 fixed end 132 detection end 200 probe head module 210 probe head substrate 211 surface 212 detection area 213 connection pad 220 probe transfer Sheet 221 Upper surface 222 Lower surface 223 Through hole 224 Metal 塾 230 Probe 231 Fixed end 232 Probe end 233 Connecting rod 240 Engaging end 250 Solder 310 Printed circuit board