JP2000227443A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To evaluate a characteristic of a mounted semiconductor by electrically connecting a probe card base board and a head part, to which a probe pin is fixed, via a BGA package for flip-chip mounting a measured semiconductor. SOLUTION: A first electrode on the lower face of a probe card base board 1 is arranged in compliance with a soldering ball 16 in a BGA package 13, and the first electrode and the back face of the BGA package 13 are connected together by the soldering ball 16. A second electrode in a head part 2 is also arranged matchingly with a surface electrode in the BGA package 13, and then, both electrodes are fastened by a fixing apparatus 4 so as to be connected together. In this way, using the PGA package 113, to which a semiconductor element is flip-chip mounted, the probe card base board 1 and the head part 2 are electrically connected together, so that designing and manufacture of a conversing base board matching the measured semiconductor element is not required. In addition, a measurement result close to that in actual installation can be provided, because an electric characteristic of the semiconductor element is measured through wiring of the BGA package 13 to which a semiconductor is actually mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card for measuring the electrical characteristics of a semiconductor device in a wafer state, and more particularly to a BGA by flip chip bonding.
The present invention relates to a vertical probe card used for measuring a semiconductor device mounted on a package.

[0002]

2. Description of the Related Art FIG. 8 is a cross-sectional view of a COBRA probe (registered trademark, sold by Tokyo Cathode Research Laboratory Co., Ltd. and ESJ Corporation) which is an example of a vertical probe card having a conventional structure. In the figure, 1 is a probe card substrate, 2 is a head portion, 3 is a probe pin, 4 is a fixing member, 5 is a solder, 6
Denotes a reinforcing plate, 7 denotes a space transformer, 10 denotes a probe card, and 100 denotes a conversion board. In such a probe card, a wiring layer including external terminals for connection to a prober device is provided on the upper surface of a probe card substrate 1 made of, for example, a resin plate material, and the wiring layer is provided on the lower surface of the substrate via through holes. The second terminal is electrically connected to the first terminal (in FIG. 8, covered with the solder 5). On the other hand, the probe pins 3 are fixed to, for example, a head portion 2 made of a plastic hollow box. Below the head portion, the tips of the probe pins 3 are arranged so as to correspond to the positions of the pads of the semiconductor element to be measured. Fixed.
On the upper surface of the head unit 2, second terminals (not shown) connected to the respective probe pins 3 are provided. In the probe card of FIG. 8, the first terminal on the lower surface of the probe card substrate 1 and the second terminal on the upper surface of the head 2 are connected to the conversion substrate 10.
0 is electrically connected. Conversion board 100
Are provided with three-dimensional wiring including through holes, and are further designed to control the characteristic impedance of such three-dimensional wiring to improve transmission characteristics. The connection between the first terminal on the lower surface of the probe card substrate 1 and the terminal on the upper surface of the conversion substrate 100 is made by solder 5. The connection between the terminal on the lower surface of the conversion substrate 100 and the second terminal on the upper surface of the head unit 2 is performed by passing the fixing member 4 through the through hole in a state where the terminals are in contact with each other. Is fixed to the reinforcing plate 6.

In such a probe card, the wiring on the probe card substrate 1 is also formed from a wiring layer without using cable wiring, and is used for high-speed operation because the conversion substrate 100 with controlled characteristic impedance is used. It was also possible to measure the electrical characteristics of the high-frequency device and the like.

[0004]

In the above-described probe card, the conversion board 100 needs to be designed for each probe card in consideration of the characteristic impedance, and a certain period is required for designing the conversion board 100. In addition, there is a problem that the manufacturing cost is increased because the probe card is manufactured individually according to each probe card. Further, the connection between the conversion board 100 and the probe card board 1 is performed by the solder 5, but when reflowing the solder, the probe card board 1 (having a diameter of 200 to 300 mm) needs to be put in a reflow furnace. There was also a problem that a large furnace was indispensable for the production of the slag. Further, as the semiconductor device becomes an IC, the density of electrodes on the upper surface of the head unit 2 connected to each probe pin 3 increases, and it is difficult to align the second electrode of the head unit 2 with the lower electrode of the conversion substrate 100. There was also the problem of becoming. Further, in evaluating the electrical characteristics of a semiconductor element, there has been a growing demand for measuring and evaluating the electrical characteristics of a state mounted on a package. On the other hand, as described in Japanese Patent Application Laid-Open No. Hei 10-132855, a method has been proposed in which a capacitance or the like generated when mounted on a package is formed by being previously incorporated into a wiring board together with probe pins. However, such a method has a problem that time and cost are separately required for manufacturing the substrate wiring. Therefore, an object of the present invention is to provide a probe card whose characteristic impedance is controlled without using a conversion board, and which can evaluate the electrical characteristics of a semiconductor element actually mounted on a package.

[0005]

Accordingly, as a result of earnest study, the inventor of the present invention actually flip-chip mounts a semiconductor element for measuring an electrical connection between a probe card substrate and a head portion on which probe pins are fixed. By using a BGA package, it is possible to control the characteristic impedance and to evaluate the electrical characteristics of the semiconductor device actually mounted on the package.
It has been found that the use of a package makes it unnecessary to design a conversion board, and that a probe card can be provided at a low cost and in a short period of time, thus completing the present invention.

That is, the present invention relates to a probe card for bringing a probe pin into contact with a semiconductor element formed on a wafer and measuring electrical characteristics of the semiconductor element in a wafer state via the probe pin. A probe card substrate having one terminal, and a head portion having the probe pin fixed thereto and having a second terminal electrically connected to the probe pin, wherein the probe card substrate and the head portion are the semiconductor The BGA package for flip-chip mounting the elements is stacked and fixed, and the first terminal and the second terminal are electrically connected via wiring of the BGA package. Is a probe card. As described above, the probe card substrate and the head unit form a BGA for flip-chip mounting a semiconductor element.
The package is stacked and fixed so as to sandwich the package therebetween, and the first terminal and the second terminal are electrically connected via the wiring of the BGA package, so that the probe corresponding to the element to be measured is provided. According to the arrangement of the second electrodes of the head unit on which the pins are arranged, it is not necessary to separately manufacture the conversion substrate, and the manufacturing period of the probe card can be shortened and the manufacturing cost can be reduced. That is, the electrode arrangement on the solder ball forming surface of the BGA package is generally a standardized electrode arrangement, and since the arrangement does not change depending on the mounted element, the connection between such an electrode and the first electrode of the probe card is made by the solder ball. Can be easily performed.
On the other hand, the element mounting surface of the BGA package has a structure in which the semiconductor element to be measured is flip-chip mounted on such a surface, so that the arrangement of the second electrodes connected to the probe pins and the electrode arrangement of the element mounting surface In the case of overlapping, the electrodes facing each other are electrodes to be connected just. Therefore, the probe card having a standardized electrode arrangement and the second electrodes of the head section having different arrangements depending on the semiconductor element to be measured can be easily connected via the BGA package on which the semiconductor to be measured is actually flip-chip mounted. Can be electrically connected. Further, since the electrical characteristics of the semiconductor element are measured via the BGA package actually used, it is possible to evaluate the electrical characteristics close to those measured in the state of the final product mounted on the package. Further, the connection between the BGA package and the probe card substrate is made by solder 5, but since the BGA package is small, reflow can be performed using a small furnace.

It is preferable that the semiconductor device mounting surface of the BGA package is on the head side and the solder ball forming surface of the BGA package is stacked and fixed on the probe card substrate side. This is because, by overlapping, a probe card corresponding to the semiconductor element to be measured can be formed without changing the electrode arrangement or the like.

Further, according to the present invention, a relay board in which terminals provided on both surfaces thereof are connected by three-dimensional wiring is further stacked between the probe card substrate and the BGA package, and three-dimensional wiring between the terminals is provided. The first terminal and the wiring of the BGA package are electrically connected to each other via the first terminal, and the relay board and the probe card board are fixed by a fixture.

[0009] An anisotropic conductive sheet is sandwiched between the relay board and the probe card board, and the fixing tool presses the anisotropic conductive sheet to press the terminals of the relay board and the probe card board. Is preferably electrically connected to the first terminal. As described above, by using the relay board, pressure can be applied between the relay board and the probe card, so that the anisotropic conductive sheet can be used for electrical connection between the relay board and the probe card. Become. As a result, electrical connection using an anisotropic conductive sheet is possible even when the distance between the electrodes provided on the relay board and the probe card board becomes narrow and solder connection becomes difficult.

It is preferable that the terminals of the relay board connected to the terminals of the BGA package are provided at positions corresponding to the arrangement of the terminals of the BGA package. With such an electrode arrangement, the BGA package and the relay board are overlapped so that the positions of the respective electrodes substantially correspond to each other.
Just heating until the solder ball is melted, the electrode position is automatically aligned by the surface tension of the melted solder,
The BGA package and the relay board can be positioned with high accuracy.

It is preferable that terminals provided on both sides of the relay board are electrically connected by through holes. This is because the production of the relay board is easy.

It is preferable that the relay board has a reinforcing member embedded in the relay board. This is to prevent warping of the relay board when an anisotropic conductive sheet is sandwiched between the relay board and the probe card board and pressed.

The relay board may have a bypass capacitor mounted thereon. By using such a structure, the bypass capacitor can be conventionally disposed near the probe pin (that is, near the semiconductor element to be measured), and noise generated during the measurement can be reduced.

Preferably, the area of the relay board is larger than the area of the BGA package. This is because by increasing the area, the mounting position of the bypass capacitor can be secured, and a hole through which the fixture is passed can be provided.

[0015] The fixing tool is formed by a screw which penetrates a hole provided in the relay board and a hole provided in the probe card board to fasten the board and a nut screwed to the tip of the screw. Preferably,

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a sectional view of the vertical probe card according to the first embodiment. In the figure, the same reference numerals as those in FIG. 8 indicate the same or corresponding parts, and reference numeral 13 denotes a BAG package (Ball).
Grid Alley package).

FIG. 2 shows a flip chip BGA package 13 used in the probe card of FIG.
(A) is a top view, and (b) is a cross-sectional view along II-II. In the figure, 14 is a package substrate, 15 is a semiconductor element such as an IC mounted, 16 is a solder ball, and 18 is an underfill.

In the probe card according to the first embodiment, as in the conventional structure shown in FIG.
The semiconductor element to be measured is fixed between the first electrode on the lower surface of the probe card substrate 1 and the second electrode on the upper surface of the head unit 2 unlike the conventional structure. BAG package 1 actually flip-chip mounted
3 are connected.

That is, in the probe card according to the first embodiment, the first electrode on the lower surface of the probe card
The first electrodes on the lower surface of the probe card substrate 1 and the back surface of the BGA package 13 are arranged corresponding to the solder balls 16 of the GA package
6. On the other hand, the second electrode of the head unit 2 is also arranged corresponding to the surface electrode of the BGA package 13, and is fastened by the fixture 4 to connect between the two electrodes.

As described above, the electrical connection between the probe card substrate 1 and the head unit 2 is performed by using the BGA package 13 on which the semiconductor element to be measured is actually flip-chip mounted, thereby achieving the conventional structure. As described above, it is not necessary to design and manufacture the conversion board 4 in accordance with the semiconductor element to be measured, so that it is possible to shorten the manufacturing period of the probe card, to reduce the manufacturing cost and to manufacture the probe card at low cost. Can be.

Further, the BG on which the semiconductor element is actually mounted
Since the electrical characteristics of the semiconductor device are measured through the wiring of the A package 13, a measurement result close to the electrical characteristics measured by mounting the semiconductor device on the BGA package 13 is obtained. For this reason, in the measurement using the conventional probe card, the final shipping inspection (final test) which is necessary after measuring the characteristics of each semiconductor element and further after incorporating the semiconductor element in the package is performed by the present invention. The use of such a probe card eliminates the need for the probe card and simplifies the manufacturing process of the semiconductor device.

FIG. 3 is a schematic diagram of a measurement process using the above probe card. The same reference numerals as in FIG. 1 denote the same or corresponding parts, 8 denotes a performance board, 9 denotes a pogo pin ring, 10 denotes a probe card, 11 denotes a wafer having a semiconductor element to be measured formed on the surface, and 12 denotes a wafer chuck. Is a fixing table for fixing the wafer 11, and 17 is a test head.

In measuring the electrical characteristics of the semiconductor device, first, a wafer 11 having a semiconductor device formed on its surface is used.
Is fixed on the fixed base 12 by sucking from the back surface of the wafer 11. On the other hand, the probe card 10 is attached to a pogo pin ring 9, and the pogo pin ring 9 is attached to a performance board 8 attached to a test head 17. In such a state, the external terminals formed on the probe card substrate of the probe card 10 are finally connected to the measurement system (not shown) of the prober device via the wiring formed on the pogo pin ring 9 and the like.
It is connected to the. Next, when the fixing base 12 is raised, the tip of the probe pin 3 comes into contact with the pad portion of the semiconductor element formed on the wafer 11 to be in a state of being electrically connected, and the semiconductor system is measured using the measuring system. The electrical characteristics of the device are measured. After the measurement, the fixing base 12 moves down, moves to a position above the semiconductor element to be measured next, and then moves up. The electric characteristics of the semiconductor element are sequentially measured by repeating the same steps. By performing such a measurement on all the semiconductor elements formed on the wafer, for example, it is possible to exclude semiconductor elements whose characteristics are out of specification. Usually, the measurement is performed by automatic control using a computer.

Embodiment 2 FIG. Embodiment 2 of the present invention will be described with reference to FIGS. FIG. 4 is a cross-sectional view of the vertical probe card according to the second embodiment. In the figure, the same reference numerals as those in FIG. 8 indicate the same or corresponding parts, 23 is a fixing tool composed of a screw and a nut screwed to the tip thereof, 25 is an anisotropic conductive sheet, 26 is a spacer, 34 Is a relay board. FIG. 5 shows a first relay board 34 used for the probe card of FIG.
Is a top view, (b) is a sectional view along Va-Va, (c)
FIG. 4 is an enlarged view of a portion A, and FIG. 4D is a cross-sectional view taken along line Vc-Vc. In the figure, 31 is a hole for passing a screw, 34 is a relay board, 35 is an electrode formation region, 36 is a land, 37 is a through hole, and 38 is a reinforcing inner layer. Relay board 34
Is made of, for example, a non-conductive synthetic resin plate, and the corresponding lands 36 (electrodes) are arranged at substantially the same locations on both sides, and the corresponding lands are electrically connected by through holes 37. . Further, a hole 31 is provided outside the electrode formation region 35. The wiring of the relay board 34 is simply
Just by electrically connecting the lands 36 formed at the corresponding positions on both surfaces of the substrate with the through holes 37, the structure can be made very simple, easy, and inexpensive.

In the probe card according to the second embodiment, in addition to the configuration of the probe card according to the first embodiment, a relay board 34 is sandwiched between the probe card board 1 and the BGA package 13. Relay board 34
The connection between the probe card substrate 1 and the anisotropic conductive sheet 2
5 is performed. That is, in the first embodiment,
Although the probe card substrate 1 and the BGA package 13 are directly connected, in the second embodiment, the corresponding lands (electrodes) on the front and back surfaces are connected by through holes, and the space between the probe card substrate 1 and the probe card substrate 1 is fixed. Relay board 34 having a hole for the BGA package 13 is disposed between the probe card board 1 and the BGA package 13.

An anisotropic conductive sheet 25 is sandwiched between the probe card board 1 and the relay board 34, and the fixtures 23 are inserted into holes provided in the probe card board 1 and the relay board 34, respectively. Through, the anisotropic conductive sheet 25 is tightened. As a result, the anisotropic conductive sheet 25 is sandwiched between the electrodes and pressed between the electrodes provided so as to correspond to the opposing surfaces of the probe card substrate 1 and the relay substrate 34, respectively. , And electrically connect the two electrodes. In particular, when the integration of the semiconductor elements to be measured advances, the number of electrodes provided on the probe card substrate 1 and the relay substrate 34 increases, and the electrode spacing becomes narrow, adjacent connections using conventional soldering are used. Although a short circuit may occur between the electrodes, the use of the anisotropic conductive sheet 25 can prevent such a short circuit. As the anisotropic conductive sheet 25, for example, an anisotropic conductive rubber in which a spherical conductive material is dispersed in a rubber material can be used. As the anisotropic conductive rubber, for example, Shin-Etsu Twin Connector MT-type sold by Shin-Etsu Polymer Co., Ltd. can be used. Further, the fixing tool 23 includes a hole 31 provided in the relay board 34,
It consists of a screw that penetrates a hole (not shown) provided in the probe card substrate 1 and fastens these substrates, and a nut that is screwed to the tip of the screw. This is because, by using such a fixing member 23, the probe card substrate 1 and the relay substrate 34 can be easily tightened.

Further, the relay board 34 according to the present embodiment
Is provided with a reinforcing inner layer 38 made of, for example, copper foil. Therefore, even if the probe card substrate 1 and the relay substrate 34 are fastened with the fixture 23 with the anisotropic conductive sheet 25 interposed therebetween,
The relay board 34 having a thickness of usually about 3 mm is curved,
It is possible to prevent the electrode from being disconnected at the center of the relay board 34. When the force for fastening the probe card substrate 1 and the relay substrate 34 is relatively small, the reinforcing inner layer 38 may not be provided.

On the other hand, the BGA package 13 and the relay board 3
4 is electrically connected using the solder balls 16 of the BGA package 13. Since the surface electrodes of the relay board 34 on the side connected to the BGA package 13 are also provided corresponding to the electrode positions of the probe card board 1,
Such an arrangement corresponds to the solder balls 16 of the BGA package 13.
Also corresponds to the position. Therefore, the BGA package 1
3 and the relay board 34 are overlapped so that the positions of the electrodes on the respective surfaces correspond to each other, and heated to a temperature at which the solder balls 16 are melted, thereby fixing both electrodes in an electrically connected state. Can be. In this case, if the solder balls 16 are melted by overlapping the two electrodes horizontally, the alignment is automatically performed so that the two electrodes just overlap due to the influence of the surface tension of the solder. For this reason, the alignment between the BGA package 13 and the relay board 34 can be performed with high precision by self-alignment only by aligning the electrodes so that the two electrodes substantially overlap.

In this embodiment, first, the BGA package 13 and the relay board 34 are fixed with solder,
In order to manufacture the probe card by fixing the relay board 34 and the probe card board 1 with the fixture 23, in the soldering process of the BGA package 13 and the relay board 34, generally, a rectangular shape having a size of 100 mm × 100 mm is used. It is sufficient that the small BGA package 13 and the relay board 34 are put in a reflow furnace for reflow, and the probe card board 1 does not need to be put in the reflow furnace unlike the conventional structure. Therefore, it is possible to manufacture a probe card using a small reflow furnace as compared with a probe card having a conventional structure.

FIGS. 6A and 6B show a second relay board 44 that can be used in place of the relay board 34. FIG. 6A is a top view, FIG. 6B is a cross-sectional view taken along VIa-VIa, and FIG.
Is an enlarged view of a portion B, (d) is a cross-sectional view (right side) along VIb-VIb, and a cross-sectional view (left side) along VIc-VIc. In the figure, reference numeral 41 denotes a hole through which the fixture 23 passes, 44 denotes a relay board, 45 denotes an electrode forming region, 46 denotes a land, 47 denotes a through hole, 48 denotes a reinforcing inner layer, and 49 denotes a bypass capacitor (chip capacitor). is there. The reinforcing inner layer 48 also functions as a wiring, and a device capacitor 49 is connected between the GND side and the power supply side wiring. By forming the bypass capacitor 49 on the relay board 44 in this manner, the bypass capacitor 49 can be provided in the vicinity of the probe pin 3, that is, in the vicinity of the semiconductor element to be measured, thereby reducing noise during measurement. As a result, accurate measurement can be performed.

Embodiment 3 A third embodiment of the present invention will be described with reference to FIG. FIG. 7 shows the present invention using a VCPC sold by JEOL Ltd.
(Vertical Contact Probe Card) is a cross-sectional view when applied to. 4, the same reference numerals as those in FIG. 4 denote the same or corresponding parts, and 33 denotes a probe pin having a semicircular curved portion. In other words, the VCPC is designed so that the probe pins have such a shape so that the electrical connection is good when the probe pins are in contact with the pad portion of the semiconductor element.

As described above, the probe card structure of the present invention can be applied to the VCPC. By adopting such a structure, the probe card structure corresponding to the electrode structure of the semiconductor element to be measured can be obtained.
CPC can be supplied at low cost and in a short period of time.

[0033]

As is clear from the above description, in the probe card of the present invention, a probe card is manufactured using a BGA package for flip-chip mounting a semiconductor element to be measured. It can be manufactured at low cost.

Further, the measurement of the electrical characteristics of the semiconductor element
Since the evaluation is performed through a circuit of the BGA package on which the semiconductor element is mounted, the electrical characteristics can be evaluated in a state close to a final product in which the semiconductor element is mounted on the BGA package.

Further, by using the relay board, it becomes possible to manufacture a probe card which is positioned with high accuracy by a relatively easy method and at a low cost.

Further, by connecting the relay substrate and the probe card substrate using an anisotropic conductive sheet, it becomes possible to produce a probe card for measuring a semiconductor element having a high degree of integration.

Further, by providing a reinforcing inner layer on the relay board, disconnection at the center of the relay board can be prevented, and by providing a bypass capacitor on the relay board, noise during measurement can be reduced. It is possible to obtain highly accurate measurement results.

[Brief description of the drawings]

FIG. 1 is a sectional view of a probe card according to a first embodiment of the present invention.

FIG. 2A is a top view of a BGA package. (B) It is sectional drawing in II-II of a BGA package.

FIG. 3 is a process chart of a method for measuring a semiconductor element using the probe card according to the first embodiment of the present invention;

FIG. 4 is a sectional view of a probe card according to a second embodiment of the present invention.

FIG. 5A is a top view of a first relay board. (B) It is sectional drawing in Va-Va of a 1st relay board. (C) It is an enlarged view of the A section of the 1st relay board. (D) It is sectional drawing in Vc-Vc of a 1st relay board.

FIG. 6A is a top view of a second relay board. (B) It is sectional drawing in VIa-VIa of a 2nd relay board. (C) It is an enlarged view of the B section of the 2nd relay board. (D) VIb-VIb and VIc-V of the second relay board
It is sectional drawing in Ic.

FIG. 7 is a sectional view of a probe card according to a third embodiment of the present invention.

FIG. 8 is a sectional view of a probe card according to a conventional structure.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Probe card board, 2 head part, 3 probe pins, 4 fixing members, 5 solder, 6 reinforcing plate, 7 space transformer, 8 performance board, 9
Pogo pin ring, 10 probe card, 11 wafer, 12 fixing stand, 13 BGA package, 14 package board, 15 semiconductor element, 16 solder ball, 1
7 Spacer, 18 Underfill, 23 Fixture (screw and nut screwed to its tip), 25 Anisotropic conductive sheet, 31, 41 Hole for screw passing, 3
4, 44 relay board, 35, 45 electrode formation area, 3
6, 46 lands, 37, 47 through holes, 38, 4
8 Reinforcing inner layer, 49 Bypass capacitor (chip capacitor), 100 Conversion board.

Claims (9)

[Claims] 1. A probe card for bringing a probe pin into contact with a semiconductor element formed on a wafer and measuring an electrical characteristic of the semiconductor element in a wafer state via the probe pin, the probe card having a first terminal. A probe card substrate, and a head portion having the probe pins fixed thereto and having a second terminal electrically connected to the probe pins. The probe card substrate and the head portion flip-chip the semiconductor element. A probe card, wherein the probe card is stacked and fixed so as to sandwich a BGA package for mounting, and the first terminal and the second terminal are electrically connected via wiring of the BGA package. . 2. A relay board in which terminals provided on both surfaces thereof are connected by three-dimensional wiring is further stacked between the probe card substrate and the BGA package, and the relay board is provided via the three-dimensional wiring between the terminals. The probe card according to claim 1, wherein the first terminal is electrically connected to the wiring of the BGA package, and the relay board and the probe card board are fixed by a fixture. 3. An anisotropic conductive sheet is sandwiched between the relay board and the probe card board, and the fixing tool presses the anisotropic conductive sheet to press the terminal of the relay board and the probe. 3. The probe card according to claim 2, wherein the first terminal of the card board is electrically connected. 4. The probe card according to claim 2, wherein the terminals of the relay board connected to the terminals of the BGA package are provided at positions corresponding to the arrangement of the terminals of the BGA package. 5. The probe card according to claim 4, wherein terminals provided on both surfaces of the relay board are electrically connected by through holes. 6. The probe card according to claim 2, wherein a reinforcing member is embedded in the relay board. 7. The probe card according to claim 2, wherein the relay board has a bypass capacitor mounted thereon. 8. The probe card according to claim 2, wherein an area of the relay board is larger than an area of the BGA package. 9. The fixing tool is passed through a hole provided in the relay board and a hole provided in the probe card board, and is screwed to a screw for fastening these boards and a tip thereof. The probe card according to claim 2, comprising a nut.