.1273243 九、發明說明： -- 【發明所屬之技術領域】 - 本發明係有關於一種多部位探針頭（Multi-site probe head) ’特別係有關於一種可替換式模組探針頭。 【先前技術】 ~ 多部位探測（Multi-site probing)是目前重要的探針卡 發展趨勢。當積體電路電性測試時，探針卡在移動至定位 後可使其探針探觸一積體電路晶圓之複數個晶片之銲 • 墊，故能減少探針卡之移動次數。而所謂全接觸式探針卡 即是探針卡能一次探觸一晶圓之所有晶片之銲墊，在測試 過程中不需要調整探針卡與晶圓之相對位置。然而，目前 可適用於多部位探測之多部位探針頭由於其產品不良率 高導致其價格相當昂貴。 請參閱第1圖，一種習知適用於多部位探測之探針卡 係主要包含一多部位探針頭1〇以及一概呈圓盤狀之多層 籲 印刷電路板2〇,該多層印刷電路板2〇係可組配於一積體 電路測試設備之測試頭（test head)(圖未繪出），結合於該多 層印刷電路板20之該多部位探針頭1〇係為雙面電性導通 之電路基板’其基板材質可為陶瓷、高分子或是半導體。 忒多部位探針頭1 0係具有複數個晶片探測區丨丨，其係為 矩陣排列（matrix arrangement)，可對應於一晶圓之複數個 待測晶片。而每一晶片探測區U上設置有複數個探針12, 用以探觸對應之單一晶片之銲墊。在製造該多部位探針頭 10時，只要一條線路不良則無法使用。並且，使用該多部 5 .1273243 … 位探針頭ι〇進行電性測試時，只要其中一探針12消耗損 _ - 毀，則該多部位探針頭10必須整個被報廢或去除所有探 - 針12進行重新整修。因此，習知之多部位探針頭是相當 昂貴且不耐使用。 【發明内容】 本發明之主要目的係在於提供一種可替換式模組探 針頭，其係由複數個條狀且呈並排排列之探針結合座所組 成，每一探針結合座係具有複數個呈直線排列之晶片探測 參 區，以供設置探針。因此，該些探針結合座係為可個別替 換，不需要報廢整個探針頭，亦能降低多部位探針頭之製 造成本。 本發明之次一目的係在於提供一種可替換式模組探 、十颂/、中母一探針結合座之兩端係形成為一連接部，例 如具有通孔之下沉部位，故能個別結合至一探針卡之多層 印刷電路板，以利個別替換。 依據本發明，一種可替換式模組探針頭係包含複數個 籲^針、、、"合座’其係為條狀且呈並排排列，用以組合成-探 、十頭每一探針結合座係具有複數個呈直線排列之晶片探 :目ΐΐ ΓΞΓ ’、w ’母一晶片探測區係設置有複數個探針。 【實施方式】 在本發明之一具體實施例中，揭示一種可替換式模組 才木針頭。請參閱第2及3圖，該可替換式模組探針頭1 00 係匕3複數個探針結合座110，用以結合複數個探針120。 該些1探針結合座110係為條狀且呈並排排列（如第3圖所 6 .1273243 人）用以組合成該可替換式模組探針頭1 00。該些探針結 一 λ 系可為陶瓷電路基板或是半導體電路基板等。每 ^菜針結合座110係具有複數個呈直線排列之晶片探測^ U1，y對應於一晶圓之複數個待測積體電路晶片（圖未繪 出）A。母一晶片探测區111係設置有複數個探針120。在本 實，例中，違些探針12〇係為由微機電⑽⑽）製程製作 彈陡4木針。而在每—晶片探測區111内之複數個探針12〇 、:w為相同排列。因此，該些探針結合座110係為個別製 造，再模組化構成該可替換式模組探針頭100，可以降低 夕輕k針頭之製造成本。此外，該可替換式模組探針頭 〇〇更可以運用於全晶圓探觸型態。 請再參閱第3圖，每—探針結合座UG之兩端係可形 、為連接部112。在本實施例中，該些連接 =通孔⑴之下沉部位，可利用螺栓等定位元件透過^ 通孔113固定至—探針卡之多層印刷電路板Μ、中介基 =或其它轉接機構，以個別結合該些探針結合座in至該 夕層印刷電路板2G，有利於個別替換該探針結合座11〇。 因此，當運用該可替換式模組探針頭100結合於一多 2刷電路板20、中介基板或其它轉接機構以組裝成一探 十卡時，由該些探針結合座110組合成之該些晶片探測區 11Y亦可呈矩陣排列。在積體電路測試過程，該些晶片探 測區111上之探針120係可一次探觸複數個待測晶片之 墊，達到多部位探測（Multi-siteprobing)Qt某部位之探 針120磨耗損壞，僅需要更換有損壞探針12〇之探針結合 7 1273243 座110即可’不需要報廢整個探針頭。 本1明之保護範圍當視後附之申請專利 者為準，乜彳„ 1 固π界疋 〜 任何热知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變 圍。 化與修改，均屬於本發明之保護範 【圖式簡單說明】 第1圖：習知探針頭裝設於— 才木針卡之探測面示意圖。 ❿ 第2圖：依據本發明之一具體實施例，一種可替換式模組 探針頭裝設於一探針卡之探測面示意圖。 第3圖：依據本發明之一具體實尬办丨^ 貫施例，該可替換式模組探 針頭分解立體示意圖。 【主要元件符號說明】 12 探針 10多部位探針頭11晶片探測區 20多層印刷電路板 100可替換式模組探針頭 112連接部 no探針結合座 π!晶片探測區 113通孔 120探針.1273243 IX. Description of the Invention: -- [Technical Field to Which the Invention Is Applicable] - The present invention relates to a multi-site probe head', particularly to a replaceable module probe head. [Prior Art] ~ Multi-site probing is an important development trend of probe cards. When the integrated circuit is electrically tested, the probe card can be probed to probe the pads of a plurality of wafers of an integrated circuit wafer after being moved to the positioning, thereby reducing the number of movements of the probe card. The so-called full-contact probe card is a solder pad that can probe all the wafers of a wafer at a time. It is not necessary to adjust the relative position of the probe card to the wafer during the test. However, the multi-site probe heads currently available for multi-site detection are relatively expensive due to their high product defect rate. Referring to FIG. 1 , a conventional probe card suitable for multi-site detection mainly includes a multi-part probe head 1 〇 and a substantially disk-shaped multilayer printed circuit board 2 〇, the multilayer printed circuit board 2 The tether system can be assembled on a test head (not shown) of an integrated circuit test device, and the multi-part probe head 1 combined with the multi-layer printed circuit board 20 is electrically conductive on both sides. The circuit substrate 'the substrate material may be ceramic, polymer or semiconductor. The multi-site probe head 10 has a plurality of wafer detection regions 丨丨 which are matrix arrangements and can correspond to a plurality of wafers to be tested on a wafer. Each of the wafer detection areas U is provided with a plurality of probes 12 for detecting the pads of the corresponding single wafer. When the multi-part probe head 10 is manufactured, it cannot be used as long as one line is defective. Moreover, when the plurality of 5.1273243 bit probe heads are used for electrical testing, as long as one of the probes 12 consumes damage, the multi-site probe head 10 must be completely scrapped or removed. - Needle 12 is refurbished. Therefore, the conventional multi-part probe head is quite expensive and resistant to use. SUMMARY OF THE INVENTION The main object of the present invention is to provide a replaceable module probe head which is composed of a plurality of strip-shaped and side-by-side probe binding bases, each of which has a complex number A linear array of probe detection zones for the placement of probes. Therefore, the probe binding systems are individually replaceable, and it is not necessary to scrap the entire probe head, and the manufacturing cost of the multi-part probe head can also be reduced. The second object of the present invention is to provide a replaceable modular probe, a ten-inch/, and a middle-mother-probe joint. The two ends of the probe joint are formed as a joint portion, for example, having a through-hole sinking portion, so that individual A multilayer printed circuit board bonded to a probe card for individual replacement. According to the present invention, a replaceable module probe head system includes a plurality of needles, and a "seat" which is strip-shaped and arranged side by side for combination into a probe and a probe. The needle-bonding system has a plurality of wafer probes arranged in a line: the target ΓΞΓ ', w 'mother-wafer detection zone is provided with a plurality of probes. [Embodiment] In an embodiment of the present invention, a replaceable modular wood needle is disclosed. Referring to Figures 2 and 3, the replaceable module probe head 100 is configured with a plurality of probe holders 110 for combining a plurality of probes 120. The 1 probe binding bases 110 are strip-shaped and arranged side by side (as shown in FIG. 3, 161.72332) for combining the replaceable module probe heads 100. The probe junctions λ can be ceramic circuit substrates or semiconductor circuit substrates. Each of the vegetable pin sockets 110 has a plurality of wafer detectors in a straight line, U1, y corresponding to a plurality of integrated circuit circuit chips (not shown) A of a wafer. The mother-to-wafer detection area 111 is provided with a plurality of probes 120. In the present case, the probes 12 are made by the micro-electromechanical (10) (10)) process. The plurality of probes 12〇, :w in each wafer detection zone 111 are in the same arrangement. Therefore, the probe binding bases 110 are individually manufactured and modularized to form the replaceable module probe head 100, which can reduce the manufacturing cost of the light-k needle. In addition, the replaceable module probe head can be used in a full wafer probe format. Referring to FIG. 3 again, the ends of each probe coupling UG are shaped to be the connecting portion 112. In this embodiment, the connection portion of the through hole (1) can be fixed to the multilayer printed circuit board of the probe card by using a positioning member such as a bolt through the through hole 113, an intermediate substrate = or other switching mechanism. In order to individually replace the probe bonding pads in to the printed circuit board 2G, it is advantageous to individually replace the probe bonding pads 11〇. Therefore, when the replaceable module probe head 100 is combined with a multi-two brush circuit board 20, an interposer substrate or other switching mechanism to assemble a probe card, the probe bonding pads 110 are combined. The wafer detecting regions 11Y may also be arranged in a matrix. During the integrated circuit test process, the probes 120 on the wafer detection areas 111 can detect the pads of the plurality of wafers to be tested at one time, and the probes 120 of the multi-site probing Qt are worn and damaged. It is only necessary to replace the probe with the damaged probe 12〇 in combination with the 7 1273243 seat 110. It is not necessary to scrap the entire probe head. The scope of protection of this invention is subject to the patent application of the appended claims. Anyone who knows the skill of the art will be able to make any changes without departing from the spirit and scope of the invention. And the modification belongs to the protection model of the present invention. [Simplified description of the drawing] Fig. 1: Schematic diagram of the detection surface of the conventional probe head mounted on the xylophone card. ❿ Figure 2: Implementation according to one embodiment of the present invention For example, a schematic diagram of a replaceable module probe head mounted on a probe card. FIG. 3 is a schematic diagram of a replaceable module probe according to one embodiment of the present invention. Stereoscopic schematic diagram of the head. [Main component symbol description] 12 probe 10 multi-part probe head 11 wafer detection area 20 multilayer printed circuit board 100 replaceable module probe head 112 connection part no probe binding seat π! wafer detection Zone 113 through hole 120 probe