1273257 九、發明說明： 【發明所屬之技術領域】 本發明係有關於積體電路之測試治具，特別係有關於 一種模組探測卡之構造。 【先前技術】 一在積體電路製造過程中，複數個晶片都必須在一半導 體晶圓上形成積體電路，經單體化切割成個別晶片之後再 進仃封裝，在製程中會進行多道測試以確保功能與效能。 一般而言，在晶圓未切割之前對其中一單顆晶片的測試稱 之為B曰圓檢測或探針測試，由於晶片的設計愈趨於複雜， 晶圓檢測或探針測試可以確定晶圓生產良率的高低，已經 成為整個積體電路製造過程中_關鍵部份。而用以測試晶 圓之測試設備之測試頭（test “峡f係裝設有—探測卡 (probe card) ’作為測試設備與受測晶圓之傳輸介面。 美國專利第5,974,662 E「探測卡之制元件之尖端 之平坦化方法」揭示一種模組探測卡之介面板，其係包含 有一基板及複數個互連接合元件（interc〇nnecti〇n structures)。忒些互連接合元件係呈彎曲針狀且形成於該 基板之上表面與下表面，每一互連接合元件係具有一芯部 (core)及一设部（shell)，該芯部之材質係較該殼部軟，利用 該芯部形成為所需之形狀，再利用電鍍方式在該芯部外層 形成該殼部。然而，該介面板在與探測頭以及印刷電路板 做上下電性連接時，該些互連接合元件分別與探測頭以及 印刷電路板上下壓觸而電性導通，然而由於該些互連接合 6 • 1273257 2件係整體為.彎曲且外露於該基板之外，無法準確控制該 連接合元件之頂端位置，並且當介面板結合在探測頭 :刷電路板之間時，被夾合在中間之介面板之該虺互連 午奋易產生永久變形，導致可供重覆組裝的耐用性 不佳。 。此外，另一種習知模組探測卡之介面板為原申請人於 本:專利公告第493756號「晶圓通用探測卡」所揭示者、，、 :曰曰圓通用探測卡係包含有一介面板、一印刷電路板及一 測頭’丨中該介面卡的-面具有複數個第一針點，而另 ^面具有複數個第二針點，該些第一針點的間距固定，且 該些第二針點間距固定’該印刷電路板係為可替換式，其 上具有-m式電路，権】電路板的一面與晶圓針測機台 電性連接，另—面具有複數個第—針孔，且該㈣—針孔 之間距與该介面板的該些第一針點間距相同，藉此將該些 第一針孔與該介面板之該些第一針點相接合，該探測頭係 為可替換式，具有複數個測針與複數個第二針孔，且該些 第二針孔間距與該彳面板之該些第r針點間距才目同，藉此 將該些第二針孔與該介面板之該些第二針點相接合，但由 於該印刷電路板與該介面板之材質不同導致兩者熱膨脹 係數不同，該印刷電路板所產生翹曲的程度會大幅增加該 印刷電路板之該些複數個第一針孔之共平面誤差值，使得 該介面板的為些第一針點不易全數接觸至該些第一針 孔，會有電性導接失敗之可能。 【發明内容】 7 1273257 本發明之主要目的係在於提供一種模組探測卡，主要 是在一印刷電路板與一探測頭之間插設一具有複數個導 通孔之介面板，而複數個彈簧頂針（p〇 g〇 pin)係結合於該些 導通孔且該些彈簧頂針之第一接觸端係彈性凸出該介面 板之一第一表面，即使該印刷電路板之接墊有著共平面誤 差，該些彈簧頂針亦能全數接觸該印刷電路板之對應接 墊，以解決習知模組探測卡在使用一習知使用外露探針或 凸塊之介面板時產生電性導接失敗的問題。 本發明之次一目的係在於提供一種模組探測卡，利用 複數個彈簧頂針（p〇g〇 pin)設置於.一介面板内，該些彈簧頂 針之第一接觸端係彈性凸出該介面板之第一表面，用以接 觸一印刷電路板之第一接墊，該些彈簧頂針之第二接觸端 係彈性凸出該介面板之第二表面，用以接觸一探測頭之第 一接墊，以克服習知介面板與習知探測頭之間共平坦度不 良無法内部電性導輸之問題。 依據本發明之模組探測卡，主要包含一印刷電路板、 一探測項以及一介面板，該印刷電路板係具有複數個第一 接墊，該探測頭係用以探觸一晶圓，該探測頭係具有複數 個第二接墊，該介面板係用以設置於該印刷電路板與該探 測頭之間，該介面板係包含一基板及複數個彈簧頂針，該 基板係具有一第一表面、一第二表面及複數個貫通孔，該 些貫通孔係貫穿該第一表面及該第二表面，該些彈簧頂針 係結合於該基板之該些貫通孔内，每一彈簧頂針係具有一 第一接觸端、一第二接觸端及一彈簧，該些第一接觸端係 1273257 彈性凸出該第一表面，用以接觸該些第一接墊，該些第二 接觸端係凸出該第二表面，用以接觸該些第二接墊。 【實施方式】 參閱所附圖式，本發明將列舉以下之實施例說明。 依本發明之一具體實施例，請參閱第〖及2圖，一種 模組探測卡1〇〇,其係包含一印刷電路板11〇、一探測頭 120及一介面板130,該印刷電路板11〇係具有複數個第 鲁接墊111，該印刷電路板丨丨〇之材質係選自於FR_4、 FR-5、BT之其中之一的基板且具有多層線路之結構。該 探測頭120係具有一探觸面121以及一結合面122，該探 觸面121上係設置有複數個探針124，例如垂直探針或是 彈性探針，用以探觸一晶圓10(如第2圖所示）或其它積體 電路裝置，例如TCP、⑺^捲帶式積體電路封裝構造， 該結合面122係形成有複數個第二接墊123，該些第二接 墊123係呈矩陣排列為佳。 • 該介面板130係設置於該印刷電路板110與該探測頭 120之間。該介面板丨3 〇係包含一基板丨3丨及複數個彈簧 頂針140(P〇gOpin)，該基板131係選自於塑膠座體、陶瓷 基板、玻璃基板與矽基板之其中之一。如第3圖所示，該 基板131係具有一第一表面132、一第二表面133及複數 個貫通孔134，該些貫通孔134係貫穿該第一表面132及 該第二表面133，該些彈簧頂針14〇係結合於該基板131 之該些貫通孔134内，並與該印刷電路板11〇之該些第一 接墊111以及該探測頭120之該些第二接墊ι23相對應， 1273257 每一彈簧頂針140係具有一第一接觸端141、一第二接觸 端142及一彈簧143。每一彈簧ι43係可容置於對應套管 144内且提供彈性予·對應之第一接觸端141與第二接觸端 142 ’又該套管144係被固定在該介面板130之該些貫通 孔1 34内，故該些第一接觸端14丨係能彈性凸出該第一表 面13 2，用以接觸該印刷電路板丨丨〇之該些第一接墊1η ; 该些第二接觸端142係能凸出該第二表面133，用以接觸 該探測頭120之該些第二接墊123。通常該些第一接觸端 141凸出於該第一表面132之可伸縮長度係不超過imm(亳 米），即可使所有的該些第一接觸端141電性接觸該印刷電 路板110之所有該些第一接墊m，並可容許該印刷電路 板110在較寬範圍的變形翹曲度下該些第一接觸端141仍 可達到良好接觸。同樣地，該些第二接觸端142凸出於該 第二表面133之可伸縮長度亦以不超過(毫米）即可。 較佳地’該介面板13〇係固定結合於該探測頭ι2〇之結合 面122，且保持該探測頭12〇之該些第二接墊ι23與該介 面板130之該些第二接觸端142之間的電性導接關係。 如第2圖所示，該模組探測卡丨〇〇在測試該晶圓i 〇 時會產生熱能，因該印刷電路板11〇與該介面板13〇之熱 膨脹係數均不同會導致該印刷電路板丨丨〇之翹曲程度進而 使其第一接墊111共平面度不良，即該些第一接墊111之 共平面誤差大於或者是等於該探測頭120之該些第二接墊 123之共平面誤差，而造成該印刷電路板丨丨〇與該介面板 13 0之間隙不一致，本發明利用該些彈簧頂針丨4〇之彈簧 10 1273257 143使得該些彈簧頂針140之第一接觸端141具有個別可 收縮性，每一彈簧頂針140之第一接觸端ι41與第二接觸 端142之收縮量可不相同，因此該些第一接觸端141彈性 凸出该第^一表面132之距離係可不相同，且該些第二接觸 端142彈性凸出該第一表面133之距離係可不相同，可隨 著該印刷電路板11 0與該介面板1 3 0之間隙調整、補償， 以克服該印刷電路板110之翹曲或共平坦度不良之無法内 部電性導輸之問題，以確保該些彈簧頂針14〇之第一接觸 端141均能探觸該印刷電路板110之該些第一接墊lu。 較佳地，該印刷電路板1 1 〇在形成有該些第一接塾i i i 之相對向之一表面上係設置有一金屬壓板i 12，其係作為 該印刷電路板11 0之抗翹曲強化件與結合定位。例如複數 個螺栓150等結合件係穿過該探測頭12〇之側邊、該介面 板130之基板131側邊以及該印刷電路板11〇之一預定部 位而螺接至該金屬壓板112之内螺孔，以緊迫結合該探測 頭120、該介面板130與該印刷電路板11〇。因此，該金 屬壓板112係能穩固該探測頭12〇與該介面板13〇相對於 忒印刷電路板110之位置，並且能避免在緊迫該探測頭12〇 與该介面板至該印刷電路板時該印刷電路板產生變形與 翹曲。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準，任何熟知此項技藝者，在不脫離本發明之精神和 範圍内所作之任何變化與修改，均屬於本創作之保護範 園。 11 1273257 【圖式簡單說明】 第1圖·依據本發明之一具體實施例，一種模組探測卡之 元件分解截面示意圖。 第2圖··依據本發明之一具體實施例，該模組探測卡在測 試時探觸一晶圓之截面示意圖。 第3圖：依據本發明之一具體實施例，該模組探測卡之介 面板之局部放大截面示意圖。 _ 【主要元件符號說明】1273257 IX. Description of the Invention: [Technical Field] The present invention relates to a test fixture for an integrated circuit, and more particularly to a construction of a module probe card. [Prior Art] In the manufacturing process of integrated circuits, a plurality of wafers must form an integrated circuit on a semiconductor wafer, and after singulation into individual wafers, the package is inserted into the package, and multiple processes are performed in the process. Test to ensure functionality and performance. In general, testing a single wafer before the wafer is uncut is called a B-circle detection or probe test. As the design of the wafer becomes more complex, wafer inspection or probe testing can determine the wafer. The level of production yield has become a key part of the entire integrated circuit manufacturing process. The test head of the test equipment for testing the wafer (test "gora f-equipped with probe card" as the transmission interface between the test equipment and the tested wafer. US Patent No. 5,974,662 E "Probe Card A method for flattening the tip of a component" discloses a panel of a module probe card that includes a substrate and a plurality of interconnecting components (interc〇nnecti〇n structures). Forming on the upper surface and the lower surface of the substrate, each interconnecting component has a core and a shell, the material of the core being softer than the shell, using the core The portion is formed into a desired shape, and the shell portion is formed on the outer layer of the core by electroplating. However, when the dielectric panel is electrically connected to the probe head and the printed circuit board, the interconnecting joint elements are respectively The probe and the printed circuit board are electrically pressed under the pressure, but since the interconnections 6 • 1273257 2 are integrally bent and exposed outside the substrate, the top of the connection component cannot be accurately controlled. And when the interface panel is combined between the probe head: the brush circuit board, the 虺 interconnection of the interface panel sandwiched in the middle is prone to permanent deformation, resulting in poor durability for repeated assembly. In addition, another conventional module for detecting a module is disclosed by the original applicant in the patent publication No. 493756 "Wafer-General Probe Card", and the general-purpose probe card includes a panel. a printed circuit board and a probe 'the surface of the interface card has a plurality of first pin points, and the other surface has a plurality of second pin points, the pitches of the first pin points are fixed, and the The second pin point is fixed. The printed circuit board is replaceable, and has a -m type circuit thereon. One side of the circuit board is electrically connected to the wafer needle measuring machine, and the other side has a plurality of first pins. a hole, and the distance between the pin holes is the same as the distance between the first pin points of the interface panel, thereby engaging the first pin holes with the first pin points of the interface panel, the probe head Is replaceable with multiple styli and multiple second pinholes And the spacing of the second pinholes is the same as the spacing of the second pinpoints of the panel, thereby engaging the second pinholes with the second pinpoints of the panel, but The difference between the thermal expansion coefficients of the printed circuit board and the dielectric panel is different, and the degree of warpage generated by the printed circuit board greatly increases the coplanar error value of the plurality of first pinholes of the printed circuit board, so that The first pin point of the interface panel is not easy to contact all of the first pinholes, and there is a possibility that the electrical connection fails. [1] The main purpose of the present invention is to provide a module probe card. The main purpose is to insert a dielectric panel having a plurality of via holes between a printed circuit board and a detecting head, and a plurality of spring thimbles are coupled to the conductive vias and the spring thimbles The first contact end elastically protrudes from a first surface of the dielectric panel, and even if the pads of the printed circuit board have a coplanar error, the spring thimbles can fully contact the corresponding pads of the printed circuit board to solve Conventional knowledge Group using a probe card while using conventional known interface board or probe exposed bumps electrically conductively connected problem of failure. The second object of the present invention is to provide a module detecting card, which is disposed in a panel by using a plurality of spring thimbles, and the first contact ends of the spring thimbles elastically protrude from the panel. a first surface for contacting a first pad of a printed circuit board, wherein the second contact end of the spring pin protrudes elastically from the second surface of the interface plate for contacting the first pad of the probe In order to overcome the problem that the common flatness between the conventional interface panel and the conventional probe head is poor, the internal electrical conduction cannot be performed. The module detecting card according to the present invention mainly comprises a printed circuit board, a detecting item and a panel, the printed circuit board having a plurality of first pads, the detecting head is for detecting a wafer, the detecting The head system has a plurality of second pads, the interface panel is disposed between the printed circuit board and the detecting head, the interface panel comprises a substrate and a plurality of spring pins, the substrate has a first surface a second surface and a plurality of through holes extending through the first surface and the second surface, the spring thimbles being coupled to the through holes of the substrate, each spring thimble having a a first contact end, a second contact end and a spring, the first contact end 1273257 elastically protruding from the first surface for contacting the first pads, the second contact ends protruding from the first contact end a second surface for contacting the second pads. [Embodiment] The present invention will be described by way of the following examples. According to a specific embodiment of the present invention, please refer to FIGS. 2 and 2, a module detecting card 1A, which comprises a printed circuit board 11A, a detecting head 120 and a dielectric panel 130. The printed circuit board 11 The lanthanum has a plurality of ruth pads 111, and the material of the printed circuit board is selected from the substrate of one of FR_4, FR-5, and BT and has a structure of a multilayer wiring. The probe head 120 has a detecting surface 121 and a bonding surface 122. The detecting surface 121 is provided with a plurality of probes 124, such as vertical probes or elastic probes, for detecting a wafer 10 . (As shown in FIG. 2) or other integrated circuit device, such as TCP, (7) ^ tape-type integrated circuit package structure, the bonding surface 122 is formed with a plurality of second pads 123, the second pads The 123 series is preferably arranged in a matrix. • The interface panel 130 is disposed between the printed circuit board 110 and the probe head 120. The interface panel 3 includes a substrate 丨3丨 and a plurality of spring thimbles 140 (P〇gOpin) selected from one of a plastic body, a ceramic substrate, a glass substrate and a ruthenium substrate. As shown in FIG. 3 , the substrate 131 has a first surface 132 , a second surface 133 , and a plurality of through holes 134 . The through holes 134 extend through the first surface 132 and the second surface 133 . The spring thimbles 14 are coupled to the through holes 134 of the substrate 131 and correspond to the first pads 111 of the printed circuit board 11 and the second pads ι 23 of the detecting head 120. 1273257 Each spring thimble 140 has a first contact end 141, a second contact end 142, and a spring 143. Each of the springs ι43 can be received in the corresponding sleeve 144 and provide elasticity to the first contact end 141 and the second contact end 142. The sleeve 144 is fixed to the through panel 130. The first contact end 14 is elastically protruded from the first surface 13 2 for contacting the first pads 1 n of the printed circuit board ;; the second contacts The end 142 can protrude from the second surface 133 for contacting the second pads 123 of the detecting head 120. Generally, the first contact end 141 protrudes from the first surface 132 by a length of no more than imm, so that all the first contact ends 141 are electrically contacted with the printed circuit board 110. All of the first pads m can allow the printed circuit board 110 to still achieve good contact with the first contact ends 141 under a wide range of deformation warpage. Similarly, the second contact end 142 protrudes from the second surface 133 by a length that does not exceed (mm). Preferably, the interface panel 13 is fixedly coupled to the bonding surface 122 of the detecting head ,2〇, and the second pads ι23 of the detecting head 12 and the second contact ends of the interface panel 130 are held. Electrical conduction relationship between 142. As shown in FIG. 2, the module detecting cassette generates thermal energy when testing the wafer i, because the thermal expansion coefficient of the printed circuit board 11〇 and the dielectric panel 13 are different, which may result in the printed circuit. The degree of warpage of the slabs is such that the coplanarity of the first pads 111 is poor, that is, the coplanar errors of the first pads 111 are greater than or equal to the second pads 123 of the probes 120. The common plane error causes the printed circuit board 不一致 to be inconsistent with the gap of the dielectric panel 130. The spring plucking spring 10 1273257 143 of the present invention makes the first contact end 141 of the spring thimble 140 The amount of contraction of the first contact end ι 41 and the second contact end 142 of each spring thimble 140 may be different. Therefore, the distance between the first contact ends 141 and the first surface 132 may not be the same. The distance between the second contact end 142 and the first surface 133 may be different, and the gap between the printed circuit board 110 and the interface panel 130 may be adjusted and compensated to overcome the printing. Warping or commonality of circuit board 110 The failure problem can not lose the electrically conductive portion within the flatness, to ensure that a first contact end 141 of the plurality of springs can thimble 14〇 probing the printed circuit board 110 of the plurality of first pads lu. Preferably, the printed circuit board 1 1 is provided with a metal platen i 12 on one of the opposite surfaces of the first contacts iii, which is used as the warpage strengthening of the printed circuit board 110. Parts and binding positioning. For example, a plurality of bolts 150 and the like are screwed into the metal platen 112 through the side of the probe head 12, the side of the substrate 131 of the interface panel 130, and a predetermined portion of the printed circuit board 11 a screw hole for pressing the probe head 120, the dielectric panel 130 and the printed circuit board 11 紧. Therefore, the metal platen 112 can stabilize the position of the probe head 12 and the interface panel 13 relative to the printed circuit board 110, and can avoid the pressing of the probe head 12 and the interface panel to the printed circuit board. The printed circuit board is deformed and warped. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are the protection of the present invention. garden. 11 1273257 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing the components of a module detecting card according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing a probe for detecting a wafer during a test in accordance with an embodiment of the present invention. Fig. 3 is a partially enlarged cross-sectional view showing the panel of the module detecting card in accordance with an embodiment of the present invention. _ [Main component symbol description]
I 10晶圓 100 模組探測卡 110 印刷電路板 111 第一 接墊 112 金屬壓 120 探測頭 121 探觸 面 122 結合面 123 第二接墊 124 探針 130 介面板 131 基板 132 第一表面 133 第二 表面 134 貫通孔 140 彈簧頂針 141 第一接觸端 142 第二 接觸端 143 彈簧 144 套管 150 螺栓 12I 10 wafer 100 module probe card 110 printed circuit board 111 first pad 112 metal pressure 120 probe 121 probe surface 122 bonding surface 123 second pad 124 probe 130 interface panel 131 substrate 132 first surface 133 Two surface 134 through hole 140 spring thimble 141 first contact end 142 second contact end 143 spring 144 sleeve 150 bolt 12