CN1932529A - Module detecting card - Google Patents
Module detecting card Download PDFInfo
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- CN1932529A CN1932529A CN 200510103332 CN200510103332A CN1932529A CN 1932529 A CN1932529 A CN 1932529A CN 200510103332 CN200510103332 CN 200510103332 CN 200510103332 A CN200510103332 A CN 200510103332A CN 1932529 A CN1932529 A CN 1932529A
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- interface panel
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- 239000000523 sample Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 6
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- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
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- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention is concerning a kind of module and probe into card, mainly including more than a level PC boards, one interface plank and on probing into a head, that the PC board have plural the first and connect mat, the interface's plank establishes PC board in that with should probe into a head of, the interface's plank includes one basic plank and plural spring coil crest needle, the basic plank has a the first surface, a the second surface and plural master bore, those some run-through bores pierce through should the first surface and should the second surface, those some needles combining those is some run-through bores in the basic knothole, the each spring coil crest needle has a the first contact carry, a the second contact carry and one spring coil, should some the first contact carry flexibility bulge should the first surface, get in touch with those some firsts and connect mat in order to, can resolve the know-how PC board connects mat of the total flat surface error margin cause with know-how interface knothole convex piece point of contact creation the electricity lead and connect a bad problem.
Description
Technical field
The present invention relates to a kind of measurement jig of integrated circuit, particularly relate to a kind of module detecting card of novel structure.
Background technology
In the manufacture process of integrated circuit, a plurality of wafers (are chip, below all be called wafer) all must on the semiconductor wafer, form integrated circuit, after cutting into individual wafer, singulation encapsulates again, in processing procedure, can carry out the multiple tracks test to guarantee its function and usefulness.Generally speaking, before wafer does not cut the test of one single wafer wherein being referred to as wafer detects or probe test, because it is complicated that the design of wafer more is tending towards, wafer detection or probe test can be determined the height of wafer production yield, and it is partly crucial to have become one in the whole ic manufacturing process.And normally be equiped with a detecting card (probe card) in order to the measuring head (test head) of the testing apparatus of test wafer, as the transmission interface of testing apparatus and tested wafer.
In the prior art, United States Patent (USP) the 5th, 974, No. 662 " flattening methods at the tip of the detecting element of detecting card " have disclosed a kind of interface panel of module detecting card, and it includes a substrate and plurality of interconnected joint element (interconnection structures).Those interconnection joint elements are upper surface and the lower surfaces that are crooked needle-like and are formed at this substrate, each interconnection joint element has a core (core) and a shell portion (shell), the material of this core is soft than this shell portion, utilize this core to form required shape, utilize plating mode again in outer this shell portion that forms of this core.Yet, this interface panel is being done when electrically connecting up and down with detecting head and printed circuit board (PCB), those interconnection joint elements press down and touch and electrically conduct respectively with on detecting head and the printed circuit board (PCB), yet joint elements are that integral body is crooked and exposes to outside this substrate because those interconnect, can't accurately control the apical position of those interconnection joint elements, and when interface panel is combined between detecting head and the printed circuit board (PCB), be easy to generate permanent strain by clamping at those interconnection joint elements of the interface panel of centre, causing can be not good for the durability that repeats to assemble.
In addition, the another kind of interface panel that has known module detecting card now is that the original application people is in No. 493756 " the general detecting card of wafer " those disclosed herein of TaiWan, China patent announcement, the general detecting card of this wafer includes an interface panel, one printed circuit board (PCB) and a detecting head, wherein the one side of this interface card has a plurality of first pin marks, and another side has a plurality of second pin marks, the spacing of those first pin marks is fixed, and those second pin mark spacings are fixed, this printed circuit board (PCB) is for replaceable, has a test circuit on it, the one side of this printed circuit board (PCB) is surveyed board with the wafer pin and is electrically connected, another side then has a plurality of first pin holes, and the spacing of those first pin holes is identical with those first pin mark spacings of this interface panel, by this those first pin holes are engaged with those first pin marks of this interface panel, this detecting head is for replaceable, have a plurality of chaining pins and a plurality of second pin hole, and those second pin hole spacings are identical with those second pin mark spacings of this interface panel, by this those second pin holes are engaged with those second pin marks of this interface panel, but because this printed circuit board (PCB) is different with different both thermal expansivity that cause of material of this interface panel, the degree of warpage that this printed circuit board (PCB) produces can significantly increase the copline error amount of those a plurality of first pin holes of this printed circuit board (PCB), make those first pin marks of this interface panel be difficult for contacting to those first pin holes totally, and have the possibility that is electrically conducted failure.
This shows that above-mentioned existing module detecting card obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that module detecting card exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of module detecting card of new structure, just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing module detecting card exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of module detecting card of new structure, can improve general existing module detecting card, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
Fundamental purpose of the present invention is, overcome the defective that existing module detecting card exists, and provide a kind of module detecting card of new structure, technical matters to be solved be make its can solve existing known module detecting card use a known use expose the interface panel of probe or projection the time produce and be electrically conducted the problem of failure, thereby be suitable for practicality more.
Another object of the present invention is to, a kind of module detecting card of new structure is provided, technical matters to be solved is to make it can overcome that flatness is bad altogether between existing known interface panel and the known detecting head can't electrically lead defeated problem in inside, thereby is suitable for practicality more.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.According to a kind of module detecting card that the present invention proposes, it comprises: a printed circuit board (PCB), and it has a plurality of first connection pads; One detecting head, it is to touch a wafer in order to spy, this detecting head has a plurality of second connection pads; And an interface panel, in order to be arranged between this printed circuit board (PCB) and this detecting head, this interface panel comprises: a substrate, and it has a first surface, a second surface and a plurality of through hole, and those through holes run through this first surface and this second surface; And a plurality of spring thimbles (pogo pin), it is incorporated into those through holes of this substrate, each spring thimble has one first contact jaw, one second contact jaw and a spring, those first contact jaw elasticity are protruded this first surface, in order to contact those first connection pads, those second contact jaws protrude this second surface, in order to contact those second connection pads.
The object of the invention to solve the technical problems also adopts following technical measures further to realize.
Aforesaid module detecting card, the scalable length that wherein said those first contact jaws protrude from this first surface is to be no more than 1mm (millimeter).
Aforesaid module detecting card, wherein said detecting head have a spy and touch a face and a faying face, and this spy is touched face and is provided with plurality of probes, and those second connection pads are that arranged is in this faying face.
Aforesaid module detecting card, this faying face of wherein said detecting head are secure bond this second surfaces in this interface panel.
Aforesaid module detecting card, wherein said printed circuit board (PCB) is provided with a metal platen, and is urgent in conjunction with this detecting head, this interface panel and this printed circuit board (PCB) for a plurality of conjunctions.
Aforesaid module detecting card, the distance that wherein said those first contact jaw elasticity are protruded this first surface is inequality.
Aforesaid module detecting card, wherein said each spring thimble has a sleeve pipe, and it is fixed in those through holes of this interface panel, to hold corresponding spring.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, major technique of the present invention thes contents are as follows: the invention provides a kind of module detecting card, mainly comprise a printed circuit board (PCB), one detecting head and an interface panel, this printed circuit board (PCB) has a plurality of first connection pads, this detecting head is to touch a wafer in order to spy, this detecting head is to have a plurality of second connection pads, this interface panel is in order to be arranged between this printed circuit board (PCB) and this detecting head, this interface panel comprises a substrate and a plurality of spring thimble, this substrate has a first surface, one second surface and a plurality of through hole, those through holes are to run through this first surface and this second surface, those spring thimbles are to be incorporated in those through holes of this substrate, each spring thimble has one first contact jaw, one second contact jaw and a spring, those first contact jaws are that elasticity is protruded this first surface, in order to contact those first connection pads, those second contact jaws are to protrude this second surface, in order to contact those second connection pads.
By technique scheme, module detecting card of the present invention has following advantage at least:
1, module detecting card of the present invention, it mainly is to plug an interface panel with a plurality of vias between a printed circuit board (PCB) and a detecting head, and a plurality of spring thimbles (pogo pin) are to be incorporated into those vias, and first contact jaw of those spring thimbles is first surfaces that elasticity is protruded this interface panel, even the connection pad of this printed circuit board (PCB) has the copline error, those spring thimbles also can contact the corresponding connection pad of this printed circuit board (PCB) totally, and can solve existing known module detecting card use a known use expose the interface panel of probe or projection the time produce and be electrically conducted the problem of failure, thereby be suitable for practicality more.
2, module detecting card of the present invention, it utilizes a plurality of spring thimbles (pogo pin) to be arranged in the interface panel, first contact jaw of those spring thimbles is first surfaces that elasticity is protruded this interface panel, in order to contact first connection pad of a printed circuit board (PCB), second contact jaw of those spring thimbles is second surfaces that elasticity is protruded this interface panel, in order to contact second connection pad of a detecting head, flatness is bad altogether between existing known interface panel and the known detecting head can't electrically lead defeated problem in inside and can overcome, thereby is suitable for practicality more.
In sum, the module detecting card of special construction of the present invention, mainly comprise a multilayer board, one interface panel and a detecting head, this printed circuit board (PCB) has a plurality of first connection pads, this interface panel is arranged between this printed circuit board (PCB) and this detecting head, this interface panel comprises a substrate and a plurality of spring thimble, this substrate has a first surface, one second surface and a plurality of through hole, those through holes run through this first surface and this second surface, those spring thimbles are incorporated into those through holes of this substrate, each spring thimble has one first contact jaw, one second contact jaw and a spring, those first contact jaw elasticity are protruded this first surface, in order to contact those first connection pads, the copline error that can solve the connection pad of known printed circuit board (PCB) causes producing the bad problem that is electrically conducted with the bump bond of known interface panel.It has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing module detecting card has the multinomial effect of enhancement, thus be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is according to a specific embodiment of the present invention, is a kind of element exploded cross-sectional synoptic diagram of module detecting card.
Fig. 2 is according to a specific embodiment of the present invention, is that this module detecting card is visited the schematic cross-section that touches a wafer when test.
Fig. 3 is according to a specific embodiment of the present invention, and schematic cross-section is amplified in the part of the interface panel of this module detecting card.
10: wafer 100: module detecting card
110: 111: the first connection pads of printed circuit board (PCB)
112: metal platen 120: detecting head
121: visit the face 122 that touches: faying face
130: interface panel 131: substrate
132: first surface 133: second surface
134: through hole 140: spring thimble
142: the second contact jaws of 141: the first contact jaws
143: spring 144: sleeve pipe
150: bolt
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of module detecting card, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also Fig. 1, shown in Figure 2, according to a kind of module detecting card 100 of a preferred embodiment of the present invention, it comprises a printed circuit board (PCB) 110, a detecting head 120 and an interface panel 130, wherein:
This printed circuit board (PCB) 110, have a plurality of first connection pads 111, the material of this printed circuit board (PCB) 110 is one of them substrates that are selected from epoxy resin copper-clad plate (FR-4, FR-5), bismaleimide-triazine resin (Bismaleimide Triazine Resin is called for short the BT resin), and has the structure of multilayer line.
This detecting head 120, have a spy and touch a face 121 and a faying face 122, this spy is touched face 121 and is provided with plurality of probes 124, for example Vertrical probe or elastic probe, touch wafer 10 (as shown in Figure 2) or other integrated circuit (IC) apparatus in order to spy, for example the coil type IC circuit packing structure of packaging part (Tape CarrierPackage is called for short TCP), membrane of flip chip packaging part (Chip On Film is called for short COF) is carried in winding, this faying face 122 is formed with a plurality of second connection pads 123, and those second connection pads 123 are that to be arranged be good.
This interface panel 130 is to be arranged between printed circuit board (PCB) 110 and the detecting head 120.This interface panel 130 comprises a substrate 131 and a plurality of spring thimble 140 (pogo pin), wherein:
This substrate 131 is to be selected from one of them of plastic seat body, ceramic substrate, glass substrate and silicon substrate.As shown in Figure 3, this substrate 131 has a first surface 132, a second surface 133 and a plurality of through hole 134, and those through holes 134 are to run through first surface 132 and second surface 133;
Those spring thimbles 140, be to be incorporated in those through holes 134 of substrate 131, and corresponding with those second connection pads 123 of those first connection pads 111 of printed circuit board (PCB) 110 and detecting head 120, each spring thimble 140 has one first contact jaw 141, one second contact jaw 142 and a spring 143.Each spring 143 can be placed in the corresponding sleeve pipe 144 and provide elasticity to give corresponding first contact jaw 141 and second contact jaw 142, this sleeve pipe 144 is to be fixed in those through holes 134 of interface panel 130 again, so those first contact jaws 141 can elasticity protrude first surface 132, in order to those first connection pads 111 of contact print circuit board 110; Those second contact jaws 142 are to protrude second surface 133, in order to those second connection pads 123 of contact detecting head 120.The scalable length that common those first contact jaws 141 protrude from first surface 132 is to be no more than 1mm (millimeter), can make all those first connection pads 111 of those all first contact jaw, 141 electrical contact print circuit boards 110, and this printed circuit board (PCB) 110 of tolerable those first contact jaws 141 under the distortion angularity of relative broad range still can reach good contact.Similarly, those second contact jaws 142 scalable length of protruding from second surface 133 also gets final product to be no more than 1mm (millimeter).Preferably, these interface panel 130 secure bond are in the faying face 122 of detecting head 120, and the relation that is electrically conducted between those second contact jaws 142 of those second connection pads 123 of maintenance detecting head 120 and interface panel 130.
See also shown in Figure 2, this module detecting card 100 can produce heat energy when test wafer 10, because of all different meetings with the thermal expansivity of interface panel 130 of printed circuit board (PCB) 110 cause the warpage degree of this printed circuit board (PCB) 110 and then make the same flatness of its first connection pad 111 bad, be those first connection pads 111 the copline error greater than or equal the copline error of those second connection pads 123 of detecting head 120, and cause this printed circuit board (PCB) 110 inconsistent with the gap of interface panel 130, the present invention utilizes the spring 143 of those spring thimbles 140 to make first contact jaw 141 of those spring thimbles 140 have indivedual contractilities, first contact jaw 141 of this each spring thimble 140 and the amount of contraction of second contact jaw 142 can be inequality, therefore the distance of those first contact jaw, 141 elasticity protrusion first surfaces 132 is can be inequality, and the distance that those second contact jaw, 142 elasticity are protruded first surface 133 is can be inequality, can be along with the printed circuit board (PCB) 110 and the gap of interface panel 130 are adjusted, compensation, with the warpage that overcomes this printed circuit board (PCB) 110 or altogether flatness bad can't inner electrically lead defeated problem, thereby first contact jaw 141 that can guarantee those spring thimbles 140 all can be visited those first connection pads 111 that touch printed circuit board (PCB) 110.
Preferably, this printed circuit board (PCB) 110 be formed with those first connection pads 111 relatively to a surface be provided with a metal platen 112, its be as the anti-warpage stiffener of this printed circuit board (PCB) 110 with combine the location.For example a plurality of bolt 150 conjunctions such as grade are predetermined positions of substrate 131 sides of the side that passes detecting head 120, interface panel 130 and printed circuit board (PCB) 110 and be screw-coupled to the inner bolt hole of metal platen 112, with urgent in conjunction with this detecting head 120, this interface panel 130 and this printed circuit board (PCB) 110.Therefore, this metal platen 112 is detecting head 120 and the position of interface panel 130 with respect to printed circuit board (PCB) 110 firmly, and this printed circuit board (PCB) produces distortion and warpage can avoid at urgent this detecting head 120 with this interface panel to this printed circuit board (PCB) the time.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art are in the scope that does not break away from technical solution of the present invention, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (7)
1, a kind of module detecting card is characterized in that it comprises:
One printed circuit board (PCB), it has a plurality of first connection pads;
One detecting head, it is to touch a wafer in order to spy, this detecting head has a plurality of second connection pads; And
One interface panel, in order to be arranged between this printed circuit board (PCB) and this detecting head, this interface panel comprises:
One substrate, it has a first surface, a second surface and a plurality of through hole, and those through holes run through this first surface and this second surface; And
A plurality of spring thimbles (pogo pin), it is incorporated into those through holes of this substrate, each spring thimble has one first contact jaw, one second contact jaw and a spring, those first contact jaw elasticity are protruded this first surface, in order to contact those first connection pads, those second contact jaws protrude this second surface, in order to contact those second connection pads.
2, module detecting card according to claim 1 is characterized in that the scalable length that wherein said those first contact jaws protrude from this first surface is to be no more than 1mm (millimeter).
3, module detecting card according to claim 1 is characterized in that wherein said detecting head has a spy and touches a face and a faying face, and this spy is touched face and is provided with plurality of probes, and those second connection pads are that arranged is in this faying face.
4, module detecting card according to claim 3, this faying face that it is characterized in that wherein said detecting head are secure bond this second surfaces in this interface panel.
5, module detecting card according to claim 1 is characterized in that wherein said printed circuit board (PCB) is provided with a metal platen, and is urgent in conjunction with this detecting head, this interface panel and this printed circuit board (PCB) for a plurality of conjunctions.
6, module detecting card according to claim 1 is characterized in that the distance that wherein said those first contact jaw elasticity are protruded this first surface is inequality.
7, module detecting card according to claim 1 is characterized in that wherein said each spring thimble has a sleeve pipe, and it is fixed in those through holes of this interface panel, to hold corresponding spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510103332 CN1932529A (en) | 2005-09-16 | 2005-09-16 | Module detecting card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510103332 CN1932529A (en) | 2005-09-16 | 2005-09-16 | Module detecting card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1932529A true CN1932529A (en) | 2007-03-21 |
Family
ID=37878464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510103332 Pending CN1932529A (en) | 2005-09-16 | 2005-09-16 | Module detecting card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1932529A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101576576B (en) * | 2008-05-08 | 2012-05-30 | 南茂科技股份有限公司 | Probe card assembly and medium devices used for same |
| CN109390734A (en) * | 2017-08-02 | 2019-02-26 | 英研智能移动股份有限公司 | Portable electronic device |
| CN111446062A (en) * | 2020-04-08 | 2020-07-24 | 王国义 | Winding type rectangular chip inductor |
-
2005
- 2005-09-16 CN CN 200510103332 patent/CN1932529A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101576576B (en) * | 2008-05-08 | 2012-05-30 | 南茂科技股份有限公司 | Probe card assembly and medium devices used for same |
| CN109390734A (en) * | 2017-08-02 | 2019-02-26 | 英研智能移动股份有限公司 | Portable electronic device |
| CN111446062A (en) * | 2020-04-08 | 2020-07-24 | 王国义 | Winding type rectangular chip inductor |
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