CN101576576B - Probe card assembly and medium devices used for same - Google Patents
Probe card assembly and medium devices used for same Download PDFInfo
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- CN101576576B CN101576576B CN 200810099201 CN200810099201A CN101576576B CN 101576576 B CN101576576 B CN 101576576B CN 200810099201 CN200810099201 CN 200810099201 CN 200810099201 A CN200810099201 A CN 200810099201A CN 101576576 B CN101576576 B CN 101576576B
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- probe card
- card assembly
- motherboard
- intermediaries
- electrical contact
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- 239000000523 sample Substances 0.000 title claims abstract description 58
- 238000012360 testing method Methods 0.000 claims abstract description 19
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 abstract description 4
- 238000013461 design Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 235000019587 texture Nutrition 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention discloses a probe card assembly and medium devices used for the same. The probe card assembly is used for testing a wafer to be tested and mainly comprises a motherboard and a subboard, wherein a position on the subboard, which is near the center, is provided with a plurality of test probes for contacting the wafer to be tested. The subboard is provided with a plurality of first electric contacts towards the motherboard in an annular array shape; the outer side of an opening of the center part of the motherboard corresponds to the first electric contacts, and the motherboard is provided with a plurality of second electric contacts in an annular array shape. The probe card assembly further comprises at least one spacer and a plurality of medium devices, wherein the spacer has a preset thickness, is arranged between the motherboard and the subboard and is provided with a plurality of notches for the medium device arranged therein.
Description
Technical field
The intermediary's device that the invention relates to a kind of probe card assembly and be used in probe card assembly is particularly relevant for the probe card assembly person who is used for wafer sort.
Background technology
In the past in semi-conductive wafer process; For the good and the bad of crystal grain on the test wafer (die), must use high performance probe (probe card) to carry out wafer sort before the wafer cutting, like announcement persons such as the bulletin patent US6292005 of the U.S. in the prior art, US6184698, US6398570, US6478596; Has accurate contact mechanism on the probe; Be used for doing contacting with wafer to be measured, turning circuit, and carry out testing electrical property.But the structure of detecting card is quite complicated, and must form with the processes of semiconductor grade, and cost is very expensive.And work as intragranular IC design and layout not simultaneously, probe also must be changed and made again; Usually the quite expensive cost of cost is made probe in order to test a kind of new IC design, if test is unsuccessful, then whole group probe is scrapped, and cost burden is high, therefore causes drawing back of the many companies of industry.Therefore if a kind of probe card assembly can be provided, has interchangeable member, when IC designs not simultaneously; Only need to change partly member, all the other partly still can continue to use probe, so are reusable this probe; And reduce the probe manufacturing cost, real is industry one big Gospel.
Summary of the invention
In order to solve the desirable not to the utmost part of above-mentioned prior art, intermediary's device that the present invention proposes a kind of probe card assembly and is used in probe card assembly is used for the test of wafer.Mainly comprise a motherboard and interchangeable daughter board, be provided with a plurality of test probes near this daughter board adjacent central, in order to contact a wafer to be measured.Daughter board is provided with a plurality of first electrical contacts towards motherboard with the annular array shape, and side is corresponding to the first electrical contact place outside the motherboard central part opening part, is provided with a plurality of second electrical contacts with the annular array shape.Probe card assembly further includes at least one distance piece and a plurality of intermediaries device, and its spacers has a predefined thickness, and is arranged between motherboard and the daughter board, which is provided with a plurality of flutings, so that intermediary's device is wherein ccontaining.The upper and lower both sides of intermediary's device have a plurality of the 3rd electrical contacts and the 4th electrical contact respectively; And intermediary's device is the back elastically deformable by compression; So that the 3rd electrical contact is in order to contact first electrical contact; The 4th electrical contact is in order to contacting second electrical contact so that electric signal from first electrical contact via intermediary's device conducting to the second electrical contact, even also electric signal from the daughter board conducting to motherboard.Because daughter board is replaceable, when needing the change probe, only need daughter board is removed when IC design difference; Change the daughter board that another is made according to new IC design; Again that this is new daughter board simultaneously by distance piece and intermediary's device, is adjusted the depth of parallelism and electrically transmission between daughter board and the motherboard with the motherboard combination; So be reusable this probe, reduce the probe manufacturing cost.
Thus, fundamental purpose of the present invention mainly comprises a motherboard and daughter board in that a kind of probe card assembly is provided, and wherein the circuit design on the daughter board can be complied with different Demand Design, and then the manufacturing expense that therefore can save technology, test and produce is used in replacement.
Secondary objective of the present invention is providing a kind of intermediary's device that is used in probe card assembly, and it has elasticity and conductive effect, is arranged between the motherboard and daughter board of probe card assembly, in order to firmly to transmit the electric signal between motherboard and daughter board.
Description of drawings
Fig. 1 is a synoptic diagram, is first preferred embodiment that proposes according to the present invention, is a kind of probe card assembly.
Fig. 2 is a top view, is first or second preferred embodiment that proposes according to the present invention, is a kind of intermediary device.
Fig. 3 is a side view, is first or second preferred embodiment that proposes according to the present invention, is a kind of intermediary device.
Fig. 4 is the partial enlarged drawing of A part among Fig. 3.
The primary clustering symbol description:
Second electrical contact 12
First electrical contact 22
Fluting 31
The ring texture 32 of hollow
Intermediary's device 4
The 3rd electrical contact 421
The 4th electrical contact 422
Register pin 43
Embodiment
Because the present invention is the intermediary's device that discloses a kind of probe card assembly and be used in probe card assembly; Be used for the test of a wafer to be measured; The wherein use principle of probe card assembly and basic function; For having common knowledge the knowledgeable, correlative technology field can understand, so, no longer do complete description with hereinafter explanation.Simultaneously, graphic with what hereinafter contrasted, be to express the structural representation relevant with characteristic of the present invention, do not need according to the complete drafting of physical size yet, why not chats bright earlier.
At first please refer to Fig. 1 to Fig. 4, is first preferred embodiment that the present invention proposes, and for a kind of probe card assembly 20, is used for the test of a wafer to be measured.Probe card assembly 20 mainly comprises a motherboard 1 and daughter board 2, is provided with a plurality of test probes 21 near daughter board 2 adjacent central, in order to the contact measured wafer.Wherein daughter board 2 simultaneously is provided with a plurality of first electrical contacts 22 of arranging with the annular array shape towards that of motherboard 1 direction; And the motherboard central part is provided with an opening 11; Also there are a plurality of second electrical contacts 12 of setting with the arrangement of annular array shape in opening 11 outsides corresponding to first electrical contact, 22 parts.Further, probe card assembly 20 includes at least one distance piece 3 and a plurality of intermediary's devices 4 in order to the transmission electric signal, and its spacers 3 has a predefined thickness; And be arranged between motherboard 1 and the daughter board 2; Effect with buffering which is provided with a plurality of flutings 31, so that intermediary's device 4 can be wherein ccontaining; And the meaning that protection intermediary device 4 is also arranged; When motherboard 1 locks with daughter board 2 combinations, because distance piece 3 at the anchorage force that thickness direction provides, makes motherboard 1 and daughter board 2 can not damage intermediary's device 4 by pressure.The upper and lower both sides of intermediary's device 4 have a plurality of the 3rd electrical contacts 421 and the 4th electrical contact 422 respectively; Wherein the 3rd electrical contact 421 can be in order to first electrical contact 22 of contact shoe plate 2; And the 4th electrical contact 422 can in order to the contact motherboard 1 second electrical contact 12; And intermediary's device 4 is the back elastically deformable by compression; When probe card assembly 20 assemblies become finished product; Intermediary's device 4 is the states that are in slightly by compression, so can make above-mentioned first electrical contact 22, second electrical contact 12, the 3rd electrical contact 421 more tight with contacting of 422 of the 4th electrical contacts, with reach make electric signal firmly from first electrical contact 22 via intermediary's device 4 conducting to the second electrical contacts 12.What specify is; Because of motherboard 1 and daughter board 2 are independently individual respectively, so daughter board 2 can be according to different Demand Design and then replacement use, the manufacturing expense that therefore can save technology, test and produce; And the manufacturing efficient that improves technology, test and produce; And because the use of distance piece 3 and flexible intermediary device 4 can be eliminated the error that causes because of depth of parallelism difference between motherboard 1 and the daughter board 2, and make the transmission firmly of electric signal.
For the electric signal that makes motherboard 1 and daughter board 2 can have good conducting, intermediary's device 4 further includes a plurality of elastic conduction pins 42, and the one of which end is the 3rd electrical contact 421, and the other end is the 4th electrical contact 422.Elastic conduction pin 42 includes conducting metal particles and suitable macromolecular material; Wherein the material of conducting metal particles is a gold; Gold is for good electrical conductivity characteristic is provided, and macromolecular material is for suitable elasticity is provided, with the distortion after allowing by compression.Intermediary's device 4 also further includes a body 41; Body 41 includes one first framework 411, and second framework 412 that is coated on first framework, 411 outsides, and wherein the elasticity coefficient of second framework 412 is less than the elasticity coefficient of first framework 411; That is the rigidity of first framework 411 is preferable; In order to keep necessary configuration, second framework is softer, in order to elastic deformation to be provided.And intermediary's device 4 further convexes with paired register pin 43, is arranged at the pilot hole of motherboard 1 or daughter board 2 in order to insertion, so that the location of intermediary's device 4 in probe card assembly 20 is more accurately with firm.
Above-mentioned distance piece 3 is the ring texturees 32 that are hollow; And distance piece 3 can be made up of ring texture 32 and those flutings 31 of hollow single plane member; Also can be made up of ring texture 32 and those flutings 31 of hollow a plurality of plane members, wherein ring texture 32 and those flutings 31 with single plane member composition hollow is preferable.
Above-mentioned probe card assembly 20, use therein test probe 21 also can use spring probe (pogo pin) (not shown) except can be as the cantalever type probe among Fig. 1.
The present invention further provides second preferred embodiment, is a kind of intermediary's device 4 that is used in probe card assembly 20.Intermediary's device 4 includes a body 41 and a plurality of elastic conduction pin 42, announcement person in its characteristic such as aforesaid first preferred embodiment.
The above is merely preferred embodiment of the present invention, is not in order to limit interest field of the present invention; Simultaneously above description should be understood and implemented for the special personage who knows the present technique field, so other does not break away from the equivalence of being accomplished under the disclosed spirit and change or modification, all should be included in the claim scope.
Claims (6)
1. a probe card assembly is used for the test of a wafer to be measured, mainly comprises a motherboard and daughter board, is provided with a plurality of test probes near the said daughter board adjacent central, in order to the contact measured wafer, it is characterized in that:
Said daughter board is provided with a plurality of first electrical contacts towards said motherboard with the annular array shape, and said motherboard central part is provided with an opening, and said open outer side is provided with a plurality of second electrical contacts corresponding to said a plurality of first electrical contact places with the annular array shape; Said probe card assembly further includes at least one distance piece and a plurality of intermediaries device; Wherein said distance piece has a predefined thickness; And be arranged between said motherboard and the daughter board, which is provided with a plurality of flutings, so that said a plurality of intermediaries device is wherein ccontaining; Said a plurality of intermediaries device includes a plurality of elastic conduction pins; Said a plurality of elastic conduction pin one of which end is the 3rd electrical contact, and the other end is the 4th electrical contact, and said a plurality of elastic conduction pin includes conducting metal particles and suitable macromolecular material; And said a plurality of intermediaries device is the back elastically deformable by compression; So that said a plurality of the 3rd electrical contact is in order to contacting said a plurality of first electrical contact, said a plurality of the 4th electrical contacts are in order to contacting said a plurality of second electrical contact so that electric signal from said a plurality of first electrical contacts via said a plurality of intermediaries device conducting to said a plurality of second electrical contacts.
2. according to the described probe card assembly of claim 1; It is characterized in that; The thickness of said a plurality of intermediaries device is slightly larger than the predefined thickness of said distance piece, and the thickness of said a plurality of intermediaries device after being out of shape by compression is not less than the predefined thickness of said distance piece.
3. according to the described probe card assembly of claim 2; It is characterized in that; Said a plurality of intermediaries device further includes a body; Said body further includes one first framework, and is coated on the second outside framework of said first framework, and the elasticity coefficient of wherein said second framework is less than the elasticity coefficient of said first framework.
4. according to the described probe card assembly of claim 2, it is characterized in that the two ends of said a plurality of intermediaries device further convex with paired register pin, in order to insert the pilot hole that the location is arranged at said motherboard or said daughter board.
5. according to the described probe card assembly of claim 1, it is characterized in that said a plurality of test probes are cantalever type probe or spring probe.
6. according to the described probe card assembly of claim 1, it is characterized in that ring texture and said distance piece that said distance piece is hollow are ring texture and the said a plurality of flutings of forming hollow with single plane member or a plurality of plane member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810099201 CN101576576B (en) | 2008-05-08 | 2008-05-08 | Probe card assembly and medium devices used for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810099201 CN101576576B (en) | 2008-05-08 | 2008-05-08 | Probe card assembly and medium devices used for same |
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| Publication Number | Publication Date |
|---|---|
| CN101576576A CN101576576A (en) | 2009-11-11 |
| CN101576576B true CN101576576B (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810099201 Active CN101576576B (en) | 2008-05-08 | 2008-05-08 | Probe card assembly and medium devices used for same |
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| Country | Link |
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| CN (1) | CN101576576B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102081111A (en) * | 2010-12-06 | 2011-06-01 | 上海华岭集成电路技术股份有限公司 | Probe card |
| CN104345182B (en) * | 2014-10-29 | 2017-06-27 | 华中科技大学 | A kind of multistation test fixture |
| CN107015035A (en) * | 2016-01-27 | 2017-08-04 | 旺矽科技股份有限公司 | Probe card with replaceable daughter board and using method thereof |
| CN113471103B (en) * | 2021-06-09 | 2023-10-20 | 上海华虹宏力半导体制造有限公司 | Probe module |
| CN113419163B (en) * | 2021-07-12 | 2023-02-10 | 深圳市道格特科技有限公司 | MEMS probe card capable of flexibly adjusting levelness |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1806178A (en) * | 2003-06-09 | 2006-07-19 | Jsr株式会社 | Anisotropic conductive connector and wafer inspection device |
| CN1932529A (en) * | 2005-09-16 | 2007-03-21 | 南茂科技股份有限公司 | Module detecting card |
-
2008
- 2008-05-08 CN CN 200810099201 patent/CN101576576B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1806178A (en) * | 2003-06-09 | 2006-07-19 | Jsr株式会社 | Anisotropic conductive connector and wafer inspection device |
| CN1932529A (en) * | 2005-09-16 | 2007-03-21 | 南茂科技股份有限公司 | Module detecting card |
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| Publication number | Publication date |
|---|---|
| CN101576576A (en) | 2009-11-11 |
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