JP5631715B2 - Electrical inspection apparatus and wiring board manufacturing method - Google Patents

Description

  The present invention relates to an electrical inspection apparatus and a method for manufacturing a wiring board.

  In a manufacturing process of a wiring board such as a printed board, an electrical inspection apparatus is used to inspect electrical characteristics such as electrical quality of the wiring pattern. Such an electrical inspection apparatus includes a pair of electrical inspection jigs, and each jig has a probe whose tip is exposed to the measurement surface. When inspecting the electrical characteristics of the wiring board, the wiring board is sandwiched between a pair of electrical inspection jigs so that the measurement surfaces face each other, and the probe of each electrical inspection jig is brought into contact with the wiring board. Thus, electrical characteristics such as electrical quality of the wiring pattern are measured (Patent Document 1). The electrical signal (mainly current) obtained by the inspection is measured by a tester or the like, for example.

  In addition, in the case where metal terminals are formed on the main surface and the back surface of the wiring board, the pair of electric inspection jigs are sandwiched with the measurement surfaces facing each other as described above. Electrical characteristics such as electrical quality of the wiring pattern electrically connected to the metal terminal are measured by bringing the probe of the electrical inspection jig into contact with the metal terminal.

  In this case, when a probe is brought into contact with a metal terminal belonging to the power supply-ground region located substantially at the center of the wiring board, and electrical characteristics such as electrical quality of a wiring pattern formed mainly inside the wiring board are measured, The pressure contact position between the probe of the electrical inspection jig contacting from above and the electrical inspection probe contacting from below is substantially coincident with the wiring board, and the pressing force is also substantially coincident. Even when it is thin and has low rigidity, the wiring board is unlikely to warp when measuring the electrical characteristics described above.

  On the other hand, the probe is brought into contact with a metal terminal belonging to the signal line region located outside the power supply-ground region of the wiring board and relatively positioned at the end of the wiring board, and mainly the electrical quality of the signal lines of the wiring board, etc. When measuring the electrical characteristics of the wiring board, the electrical characteristics are measured by the four-terminal method. Therefore, the probe of the electrical inspection jig that comes into contact with the wiring board from above is the signal line area to be measured on the wiring board. The electrical inspection probe that contacts only the metal terminal from the lower side contacts from approximately the center to the end of the wiring board.

  Therefore, the pressure contact position of the probe of the electrical inspection jig that contacts the wiring board from above and the electrical inspection probe that contacts from the lower side do not match, and the pressing force also does not match. When the thickness is relatively thin and the rigidity is low, the wiring board is warped when measuring the electrical characteristics described above. As a result, the probe of each electrical inspection jig may not be in partial contact with the metal terminal of the wiring board, and thus the electrical characteristics such as the electrical quality of the signal line may not be measured. It was.

JP-A-10-170582

  The present invention provides an electrical inspection apparatus capable of performing an inspection of electrical characteristics of a wiring board with high accuracy without depending on the inspection position of the wiring board, and by using the electrical inspection apparatus. An object of the present invention is to provide a method of manufacturing a wiring board capable of performing an inspection of electrical characteristics with high accuracy.

In order to achieve the above object, the present invention provides:
The conductor layers and the resin insulating layers are alternately laminated, and have a first main surface and a second main surface located on the opposite side of the first main surface, and the first main surface side and the second main surface side. In addition, an apparatus for electrical inspection of a wiring board having a metal terminal electrically connected to the conductor layer,
A plurality of first probes that are electrically connected to the metal terminal on the first main surface side and whose tip is exposed to the first measurement surface; and the tip is exposed to the first measurement surface; A first electric inspection jig having an air tube configured to be positioned in a non-inspection region on the first main surface side of the wiring board during inspection;
A second electrical inspection jig having a plurality of second probes electrically connected to the metal terminal on the second main surface side and having a tip portion exposed on the second measurement surface;
The first electrical inspection jig and the second electrical inspection jig are arranged to face each other such that the first measurement surface and the second measurement surface are opposed to each other .
An elastic sheet is affixed to the outer periphery of the first electric inspection jig, the elastic sheet is in close contact with the wiring board during inspection, and the non-inspection area of the wiring board is held airtight. It is related with the apparatus for an electrical test | inspection of a wiring board characterized by having comprised so .

The present invention also provides:
The conductor layers and the resin insulating layers are alternately laminated, and have a first main surface and a second main surface located on the opposite side of the first main surface, and the first main surface side and the second main surface side. A step of producing a wiring substrate having a metal terminal electrically connected to the conductor layer;
The wiring board is positioned between the first electric inspection jig and the second electric inspection jig of the electric inspection apparatus according to claim 1 or 2 , and the first electric inspection is performed. In the first measurement surface of the jig for jig, the tip of the air tube of the first electric inspection jig is positioned in the non-inspection region on the first main surface side of the wiring board, and the non-inspection The plurality of first probes of the first electric inspection jig serve as inspection regions of the wiring board in a state where air is blown from the air pipe to the region and air pressure is applied to the non-inspection region. The plurality of second probes of the second electric inspection jig on the second measurement surface of the second electric inspection jig are brought into contact with the metal terminal on the first main surface side, Electrically contacting a metal terminal on the second main surface side of the wiring board; And performing electrical inspection of the inspection area,
It is related with the manufacturing method of a wiring board characterized by providing.

  According to the present invention, the plurality of first probes whose tip portions are exposed on the first measurement surface, and the tip portions are exposed on the first measurement surface, and the first main surface of the wiring board is inspected at the time of inspection. A first electric inspection jig having an air tube configured to be positioned in the non-inspection region, and a second electric probe having a plurality of second probes whose tip portions are exposed on the second measurement surface. An electric inspection jig, and the first electric inspection jig and the second electric inspection jig are arranged to face each other so that the first measurement surface and the second measurement surface face each other. A device for electrical inspection of a wiring board is prepared, and using this, a conductor layer and a resin insulating layer are alternately laminated, and the first main surface and the opposite side of the first main surface And a second main surface located on the first main surface side and the second main surface side and electrically connected to the conductor layer. Electrical quality, etc. of the wiring pattern of the wiring board having a genus terminal, and to measure the electrical characteristics of the wiring pattern.

  Specifically, the wiring board is positioned between the first electric inspection jig and the second electric inspection jig of the electric inspection apparatus, and the first measurement surface of the first electric inspection jig is used. The air tube of the first electric inspection jig blows air to the non-inspection region on the first main surface of the wiring board, and the plurality of first probes of the first electric inspection jig are A plurality of second probes of the second electric inspection jig are brought into contact with the metal terminals of the inspection region on the first main surface of the wiring board, and on the second measurement surface of the second electric inspection jig. Electrical inspection is performed on the inspection area of the wiring board by making electrical contact with metal terminals on the second main surface of the wiring board.

  Therefore, for example, the metal terminal belonging to the signal line region located outside the power supply-ground region on the first main surface of the wiring substrate and positioned relatively at the end of the wiring substrate is connected to the first from above the wiring substrate. Even when a plurality of first probes of an electrical inspection jig are brought into contact with each other and the electrical characteristics such as electrical quality of the signal lines of the wiring board are measured by the four-terminal method, the first electrical inspection jig is used. In addition to the plurality of first probes brought into contact with the metal terminals in the signal line area, which is the inspection area on the first main surface of the wiring board, air is blown from the air pipe to the non-inspection area of the wiring board. I am doing so.

  For this reason, when the plurality of second probes of the second electrical inspection jig are brought into contact with the wiring board from below from the substantial center to the end portion of the wiring board, The inspection area corresponds to the approximate center of the wiring board, and the first electrical inspection jig is loaded with air pressure from the air blown from the air tube at the approximate center. The pressing force of the first plurality of probes and air pressure of the first electric inspection jig that comes into contact with the second electric inspection probe that comes into contact with the lower part comes to substantially coincide.

  As a result, even when the wiring board is relatively thin and has low rigidity, the wiring board does not warp when measuring the electrical characteristics described above. Therefore, it is possible to avoid the case where the probe of each electrical inspection jig does not partially contact the metal terminal of the wiring board, and avoid the state where the electrical characteristics such as the electrical quality of the signal line cannot be measured. can do.

  When the power-ground area on the first main surface of the wiring board is used as the inspection area and the electrical characteristics of this area are inspected, the first electric inspection treatment is inherently performed as described in the background art. The pressure contact position and the pressing force of the first probe of the tool and the second probe of the second electric inspection jig are substantially the same, but the first electric inspection jig has an air tube as described above. By having it, the degree of coincidence of the pressing force is improved due to the air pressure by the air from the air pipe. Therefore, according to the present invention, it is possible to improve the inspection accuracy of the electrical characteristics of the power supply-ground region.

  However, as described above, the operational effects of the present invention are more prominent when the signal line region located at a relatively end portion of the wiring board is used as the inspection region and the electrical characteristics of the inspection region are inspected. Will be.

  In an example of the present invention, the metal terminal in the non-inspection area of the wiring board can be a metal terminal constituting the semiconductor element mounting area of the wiring board. This is due to the above-described structure of the wiring board in which the semiconductor element mounting area (power supply-ground area) of the wiring board is generally located at the substantially central portion thereof.

In the present invention, an elastic sheet is attached to the outer peripheral portion of the first measurement surface of the first electric inspection jig, and the elastic sheet is in close contact with the wiring board during the inspection. The non-inspection area of the substrate is configured to be kept airtight. In this case, particularly when inspecting the electrical characteristics of the signal line region as described above, the air blown from the air tube of the first electrical inspection jig contacting from above is non-inspected in which the air is kept airtight. Since the air pressure in the non-inspection area can be kept sufficiently high, the pressing force of the second probe of the second electric inspection jig contacting from below is relatively high. Even in such a case, even when the wiring board is relatively thin and has low rigidity, it is possible to more reliably prevent the wiring board from being warped during the measurement of the electrical characteristics described above.

  Therefore, it is possible to more reliably avoid the case where the probe of each electrical inspection jig does not partially contact the metal terminal of the wiring board, and reliably measure the electrical characteristics such as the electrical quality of the signal line. be able to.

  As described above, according to the present invention, there is provided an electrical inspection apparatus capable of performing the inspection of the electrical characteristics of the wiring board with high accuracy without depending on the inspection position of the wiring board. By using the electrical inspection apparatus, it is possible to provide a method of manufacturing a wiring board capable of performing electrical property inspection with high accuracy.

It is a top view of the wiring board in an embodiment. Similarly, it is a top view of the wiring board in an embodiment. It is a figure which expands and shows a part of cross section at the time of cutting the wiring board shown to FIG. 1 and 2 along the II line. It is a figure which expands and shows a part of cross section at the time of cutting the wiring board shown to FIG. 1 and 2 along the II-II line. It is a figure which shows schematic structure of the apparatus for electrical inspection in embodiment. It is the figure which showed a mode that the electrical inspection of the wiring board shown in FIG. 1 was performed using the apparatus for electrical inspection shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Wiring board)
First, the configuration of the wiring board used in the method of the present invention will be described. However, the wiring board shown below is merely an example, and is not particularly limited as long as it has at least one conductor layer and a resin insulating layer.

  1 and 2 are plan views of the wiring board according to the present embodiment. FIG. 1 shows the state when the wiring board is viewed from the upper side, and FIG. 2 shows the wiring board when viewed from the lower side. Shows the state. 3 is an enlarged view showing a part of a cross section when the wiring board shown in FIGS. 1 and 2 is cut along the line II, and FIG. 4 is shown in FIGS. It is a figure which expands and shows a part of cross section at the time of cutting the said wiring board along the II-II line.

  A wiring board 1 shown in FIGS. 1 to 4 has both surfaces of a plate-like core 2 made of a heat-resistant resin plate (for example, bismaleimide-triazine resin plate), a fiber-reinforced resin plate (for example, glass fiber-reinforced epoxy resin), or the like. In addition, core conductor layers M1 and M11 (also simply referred to as conductor layers) forming metal wirings 7a formed in a predetermined pattern are formed by Cu plating, respectively. These core conductor layers M1 and M11 are formed as a plane conductor pattern that covers most of the surface of the plate-like core 2, and are used as a power supply layer or a ground layer.

  On the other hand, a through-hole 12 drilled by a drill or the like is formed in the plate-like core 2, and a through-hole conductor 30 that connects the core conductor layers M 1 and M 11 to each other is formed on the inner wall surface thereof. The through hole 12 is filled with a resin filling material 31 such as an epoxy resin.

  In addition, first via layers (build-up layers: insulating layers) V1 and V11 made of the thermosetting resin composition 6 are formed on the core conductor layers M1 and M11, respectively. Further, first conductor layers M2 and M12 forming a patterned metal wiring 7b are formed on the surface by Cu plating. The core conductor layers M1 and M11 and the first conductor layers M2 and M12 are interconnected by vias 34, respectively. Similarly, second via layers (build-up layers: insulating layers) V2 and V12 using the thermosetting resin composition 6 are formed on the first conductor layers M2 and M12, respectively.

  Second conductor layers M3 and M13 having metal terminal pads 10 and 17 are formed on the second via layers V2 and V12, respectively. The first conductor layers M2 and M12 and the second conductor layers M3 and M13 are interconnected by vias 34, respectively. The via 34 includes a via hole 34h, a via conductor 34s provided on the inner peripheral surface thereof, a via pad 34p provided so as to be electrically connected to the via conductor 34s on the bottom surface side, and a via conductor 34h on the opposite side to the via pad 34p. A via land 341 projecting outward from the periphery of the opening.

  As described above, the core conductor layer M1, the first via layer V1, the first conductor layer M2, and the second via layer V2 are sequentially laminated on the first main surface MP1 of the plate core 2. The first wiring laminated portion L1 is formed. On the second main surface MP2 of the plate-like core 2, the core conductor layer M11, the first via layer V11, the first conductor layer M12, and the second via layer V12 are sequentially laminated, and the second The wiring laminated portion L2 is formed. A plurality of metal terminal pads 10 are formed on the first main surface CP1, and a plurality of metal terminal pads 17 are formed on the second main surface CP2.

  The metal terminal pad 17 is used as a back surface land (PGA pad, BGA pad) for connecting the wiring board 1 to a mother board, a socket or the like by a pin grid array (PGA) or a ball grid array (BGA). The wiring board 1 is formed on the outer peripheral portion excluding the substantially central portion, and is arranged in a rectangular shape so as to surround the substantially central portion.

  Further, a solder resist layer 8 having an opening 8a is formed on the first main surface CP1, and the metal terminal pad 10 is exposed from the solder resist layer 8 through the opening 8a. A solder resist layer 18 having an opening 18a is also formed on second main surface CP2, and metal terminal pad 17 is exposed from solder resist layer 18 through opening 18a.

  In the opening 8a, solder bumps 11 made of solder such as Sn-Pb, Sn-Ag, and Sn-Ag-Cu are formed so as to be electrically connected to the metal terminal pads 10. . Furthermore, solder balls and pins (not shown) are formed in the opening 18 a so as to be electrically connected to the metal terminal pads 17.

  1 to 4, the wiring board 1 in the present embodiment has a substantially rectangular plate shape, and the size thereof can be, for example, about 35 mm × about 35 mm × about 1 mm.

  Also, the solder bumps 11 shown in FIG. 1 constitute a semiconductor element mounting region of the wiring board 1, and the solder bumps 11 shown by white circles in the drawing constitute a power source-ground region of the semiconductor element mounting region, and are black circles. The solder bumps 11 shown constitute a signal line region of the semiconductor element mounting region.

(Electrical inspection jig and wiring board manufacturing method)
Next, an example of an electrical inspection apparatus according to the present invention and a method for manufacturing a wiring board using the electrical inspection apparatus will be described. In the present embodiment, it is assumed that the electrical inspection of the signal line region located outside the semiconductor element mounting region of the wiring board 1 is performed.

  FIG. 5 is a diagram illustrating a schematic configuration of the electrical inspection apparatus according to the present embodiment. FIG. 6 illustrates a state in which the electrical inspection of the wiring board illustrated in FIG. 1 is performed using the electrical inspection apparatus illustrated in FIG. FIG. In these drawings, in order to clarify the characteristics of the electrical inspection apparatus of the present embodiment and the characteristics when the wiring board is measured using the electrical inspection apparatus, the electrical inspection apparatus and the electrical inspection The state of the electrical inspection using the apparatus is shown as a cross-sectional view.

  As shown in FIG. 5, the electrical inspection apparatus 40 of the present embodiment includes a first electrical inspection jig 41 and a second electrical inspection jig 42.

  The first electrical inspection jig 41 includes a first housing 411, a probe support material 412, and a second housing 413. Further, in the first housing 411, it is provided so as to extend from the inside to the outside, that is, to be connected to a tester or the like outside the first housing 411 from the lower surface of the first housing 411. The plurality of first wirings 414 and the plurality of first wirings 414 are electrically connected to each other, held by the probe support material 412, and further extended downward in the second housing 413. And a plurality of first probes 415 whose tip portions are exposed on the first measurement surface 41A.

  Further, in the first housing 411, a plurality of air formed of an elastic member that also extends outward from the inside, that is, extends outward from the lower surface of the first housing 411. A pipe 417 is provided, and an air pipe 416 connected to each of the plurality of air pipes 417 is provided. The air tube 416 is held by the probe support member 412, and further extends downward in the second housing 413, and its tip is exposed to the first measurement surface 41A. The air tube 416 is held by the probe support member 412 and, as will be described below, its tip portion needs to be positioned in the non-inspection region of the wiring board. Configure. The plurality of air pipes 417 are connected to an air compressor or the like outside the first housing.

  Further, an elastic sheet 418 is affixed to the outer peripheral portion of the first measurement surface 41A of the first electric inspection jig 41, and the elastic sheet 418 is used during the electric inspection in the wiring board manufacturing method described below. Is in close contact with the wiring board, and the non-inspection area of the wiring board is hermetically maintained. Since the elastic sheet is required to adhere to the wiring board, it can be made of, for example, silicon rubber.

  The probe support 412 is configured by combining four members, ie, a first member 412A, a second member 412B, a third member 412C, and a fourth member 412D. Further, the probe support member 412 is fixed and held to the first housing 411 by a screw 419.

  Since the electrical inspection apparatus 40 shown in FIG. 5 is configured to perform electrical inspection of the signal line region of the wiring board 1 as described above, a plurality of air is applied to the plurality of first probes 415. Tube 416 is located inwardly thereof. Furthermore, the number of the plurality of first probes can be set to four so that they can be used for measurement by, for example, the four probe method.

  The second electrical inspection jig 42 includes a first housing 421, a probe support member 422, and a second housing 423. Further, the first casing 421 is provided so as to extend from the inside to the outside, that is, to be connected to a tester or the like outside the first casing 421 from the lower surface of the first casing 421. The plurality of first wirings 424 and the plurality of first wirings 424 are electrically connected to each other, are held by the probe support member 422, and further extend upward in the second housing 423. , A plurality of second probes 425 whose tip portions are exposed on the second measurement surface 42A are provided.

  Note that the probe support member 422 is configured by combining four members, that is, a first member 422A, a second member 422B, a third member 422C, and a fourth member 422D. Further, the probe support member 412 is fixed and held to the first housing 421 by a screw 429.

  Further, in the electrical inspection apparatus 40 shown in FIG. 5, the first measurement surface 41A of the first electrical inspection jig 41 and the second measurement surface 42A of the second electrical inspection jig 42 face each other. It is configured in this way.

  In FIG. 5, due to the size of the solder bumps 11 and the solder balls or pins (not shown) of the wiring board shown in FIGS. 1 and 2, the plurality of first probes 414 are formed so that their diameters are reduced. The plurality of second probes 425 are formed to have a large diameter. However, since the size of such a probe is caused by the size of solder bumps or the like formed on the wiring board 1, it can be changed as appropriate depending on the size of solder bumps or the like.

  Next, a method for manufacturing a wiring board (electrical inspection method) using the electrical inspection apparatus 40 shown in FIG. 5 will be described with reference to FIG.

  First, a wiring substrate 1 as shown in FIGS. 1 to 4 is manufactured using a conventional method such as a semi-additive method, a full additive method, or a subtractive method. Next, as shown in FIG. 6, the first electric inspection jig 41 of the electric inspection apparatus 40 shown in FIG. 5 and the semiconductor element mounting region of the wiring board 1 shown in FIG. The wiring board 1 is disposed between the second electrical inspection jigs 42, that is, between the first measurement surface 41A and the second measurement surface 42A.

  After that, the first electric inspection jig 41 is moved downward so that the solder bumps 11 belonging to the power supply-ground area, which is the non-inspection area, of the semiconductor element mounting area on the first main surface CP1 of the wiring board 1 are moved. On the other hand, air is blown from the air pipe 416 via the air pipe 417 to apply air pressure to the non-inspection area, and to the solder bumps 11 belonging to the signal line area in the semiconductor element mounting area as the inspection area. A plurality of first probes 415 are brought into contact with each other.

  At the same time, the second electric inspection jig 42 is moved upward, and as shown in FIG. 2, a solder ball (not shown) on the second main surface CP2 on the side facing the semiconductor element mounting region of the wiring board 1 Alternatively, the second probe 425 is brought into contact with a pin or the like. As a result, the electrical continuity of the signal lines (wiring patterns) existing in the signal line region which is the inspection region of the wiring board 1 is transmitted via the first electric inspection jig 41 and the second electric inspection jig 42. Thus, the electrical characteristics such as electrical quality of the signal line (wiring pattern) can be inspected.

  The electrical signal (mainly current) obtained by the inspection is measured by a tester or the like, for example.

  In the present embodiment, the wiring board 1 is positioned between the first electrical inspection jig 41 and the second electrical inspection jig 42 of the electrical inspection apparatus 40, and the first electrical inspection jig 41. On the first measurement surface 41A, the power supply-ground region constituting the semiconductor element mounting region which is the non-inspection region on the first main surface CP1 of the wiring board 1 from the air tube 416 of the first electric inspection jig 41. The plurality of first probes 415 of the first electric inspection jig 41 are brought into contact with the solder bumps 11 in the signal line region, which is the inspection region of the wiring board 1, in a state where air is blown on and air pressure is applied. I am letting. Also, on the second measurement surface 42A of the second electrical inspection jig 42, the plurality of second probes 425 of the second electrical inspection jig 42 are illustrated on the second main surface CP2 of the wiring board 1. Electrical inspection is performed on the signal line region, which is the inspection region of the wiring board 1, by making electrical contact with a solder ball or the like that does not.

  Therefore, even when the plurality of second probes 425 of the second electrical inspection jig 42 are brought into contact with the wiring board 1 from below from the substantial center to the end of the wiring board 1, Air pressure is applied to the power supply-ground area, which is a non-inspection area of the wiring board 1, from the air tube 416 of the first electric inspection jig 41.

  As a result, the first plurality of probes 415 and the air pressure of the first electric inspection jig 41 in contact with the wiring board 1 from above and the second electric inspection jig 42 in contact with the wiring board 1 from below. The pressing force with the second probe 425 also almost coincides. For this reason, even when the wiring board 1 is relatively thin and has low rigidity, the wiring board 1 does not warp when measuring the electrical characteristics described above. Therefore, it is possible to avoid a case where the probe of each electric inspection jig does not partially contact the solder bump 11 or the solder ball of the wiring board 1 and the electric lines of the signal lines (wiring patterns) in the signal line area. It is possible to avoid a state in which electrical characteristics such as pass / fail cannot be measured.

  In the present embodiment, as described above, the case where the signal line region located outside the semiconductor element mounting region on the first main surface CP1 of the wiring substrate 1 is used as the inspection region has been described. The power-ground region on the first main surface CP1 is used as an inspection region, and the electrical inspection apparatus and the wiring board of the present invention are also used for inspecting electrical characteristics such as electrical quality such as a wiring pattern in this region. The manufacturing method can be applied.

  However, as described above, the operational effects of the present invention are more prominent when the signal line region positioned relatively at the end of the wiring board 1 is used as the inspection region and the electrical characteristics of the inspection region are inspected. Will be.

  Also, as shown in FIG. 6, in this embodiment, an elastic sheet 418 is attached to the outer periphery of the first measurement surface 41A of the first electric inspection jig, and the elastic sheet 418 is wired during inspection. It is configured to be in close contact with the first main surface CP1 of the substrate 1 so that the non-inspection region corresponding to the semiconductor element mounting region of the wiring substrate 1 is kept airtight. In this case, particularly when the electrical characteristics of the signal line region as described above are inspected, the air blown from the air pipe 416 of the first electrical inspection jig 41 in contact with the upper side is kept airtight. Since it comes to be held in the non-inspection area, the air pressure in the non-inspection area can be kept sufficiently high, and the pressing force of the second probe 425 of the second electric inspection jig 42 contacting from below Even when the wiring board 1 is comparatively high, the wiring board 1 is comparatively thin, and the rigidity is low, it is possible to more reliably prevent the wiring board 1 from warping when measuring the electrical characteristics described above.

  Therefore, the case where the probes 415 and 425 of the electric inspection jigs 41 and 42 are not partially in contact with the solder bumps 11 and the solder balls of the wiring board 1 can be more reliably avoided, and the electric power of the signal line can be avoided. It is possible to reliably measure the electrical characteristics such as good and bad.

  However, the elastic body sheet 418 as described above is not an essential component, and even when the elastic body sheet 418 is not provided, if the pressure of the air blown from the air pipe 416 is appropriately adjusted, the above-described elastic body sheet 418 can be used without any particular problem. An effect can be produced. However, if the non-inspection region can be kept airtight by the elastic sheet 418, the air pressure necessary to obtain the above-described effects can be easily realized.

  As shown in FIG. 6, in the present embodiment, the elastic sheet 418 holds not only the non-inspection area of the wiring board 1 but also the inspection area in an airtight manner. In comparison, the size of the inspection area is sufficiently small, and even in such a case, the air pressure is applied to the non-inspection area without affecting the inspection of the electrical characteristics in the inspection area. Can be held. Therefore, the above-described operational effects can be obtained.

  The present invention has been described in detail with specific examples. However, the present invention is not limited to the above contents, and various modifications and changes can be made without departing from the scope of the present invention.

1 Wiring board,
M1 Core conductor layer V1 1st via layer M2 1st conductor layer V2 2nd via layer M3 2nd conductor layer M11 Core conductor layer V11 1st via layer M12 1st conductor layer V12 2nd via layer M13 2nd conductor layer 7a, 7b Metal wiring 8, 18 Solder resist layer 8a, 18a Opening 11 Solder bump 34 Via 34h Via hole 34l Via land 34p Via pad 34s Via conductor 40 Electrical inspection device 41 First electrical inspection jig 42 Second Electrical Inspection Jig 41A First Measurement Surface 42A Second Measurement Surface 414 Multiple First Wirings 415 Multiple First Probes 416 Multiple Air Pipes 417 Multiple Air Pipes 418 Elastic Sheet 424 Plural second wirings 425 Plural second probes

Claims (5)

The conductor layers and the resin insulating layers are alternately laminated, and have a first main surface and a second main surface located on the opposite side of the first main surface, and the first main surface side and the second main surface side. In addition, an apparatus for electrical inspection of a wiring board having a metal terminal electrically connected to the conductor layer,
A plurality of first probes that are electrically connected to the metal terminal on the first main surface side and whose tip is exposed to the first measurement surface; and the tip is exposed to the first measurement surface; A first electric inspection jig having an air tube configured to be positioned in a non-inspection region on the first main surface side of the wiring board during inspection;
A second electrical inspection jig having a plurality of second probes electrically connected to the metal terminal on the second main surface side and having a tip portion exposed on the second measurement surface;
The first electrical inspection jig and the second electrical inspection jig are arranged to face each other such that the first measurement surface and the second measurement surface are opposed to each other .
An elastic sheet is affixed to the outer periphery of the first electric inspection jig, the elastic sheet is in close contact with the wiring board during inspection, and the non-inspection area of the wiring board is held airtight. An apparatus for electrical inspection of a wiring board, characterized by being configured as described above . The apparatus for electrical inspection of a wiring board according to claim 1 , wherein the elastic sheet is made of silicon rubber. The conductor layers and the resin insulating layers are alternately laminated, and have a first main surface and a second main surface located on the opposite side of the first main surface, and the first main surface side and the second main surface side. A step of producing a wiring substrate having a metal terminal electrically connected to the conductor layer;
The wiring board is positioned between the first electric inspection jig and the second electric inspection jig of the electric inspection apparatus according to claim 1 or 2 , and the first electric inspection is performed. In the first measurement surface of the jig for jig, the tip of the air tube of the first electric inspection jig is positioned in the non-inspection region on the first main surface side of the wiring board, and the non-inspection The plurality of first probes of the first electric inspection jig serve as inspection regions of the wiring board in a state where air is blown from the air pipe to the region and air pressure is applied to the non-inspection region. The plurality of second probes of the second electric inspection jig on the second measurement surface of the second electric inspection jig are brought into contact with the metal terminal on the first main surface side, Electrically contacting a metal terminal on the second main surface side of the wiring board; And performing electrical inspection of the inspection area,
A method of manufacturing a wiring board, comprising: 4. The method of manufacturing a wiring board according to claim 3 , wherein the metal terminal in the non-inspection area of the wiring board is a metal terminal constituting a semiconductor element mounting area of the wiring board. 5. The method of manufacturing a wiring board according to claim 3 , wherein the inspection area of the wiring board is a signal line area located outside a semiconductor element mounting area of the wiring board.

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