CN104880658A - Testing device for semiconductor chip - Google Patents
Testing device for semiconductor chip Download PDFInfo
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- CN104880658A CN104880658A CN201510232767.1A CN201510232767A CN104880658A CN 104880658 A CN104880658 A CN 104880658A CN 201510232767 A CN201510232767 A CN 201510232767A CN 104880658 A CN104880658 A CN 104880658A
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Abstract
The invention discloses a testing device for a semiconductor chip. The top surface and the bottom surface of a top clamping board are equipped with a top groove and a bottom groove, respectively. T through holes are successively arranged between the top groove and the bottom groove on the top clamping board. A bottom clamping board is provided with through holes corresponding to the T through holes. An elastic testing rod is embedded into the T through holes and the through holes. The top pin body of the elastic testing rod successively passes through a first pin hole and a second pin hole and exposes a chip slot. The bottom pin body of the elastic testing rod passes through the through hole and is exposed. A positioning mechanism comprises a cover body and two bolt bodies, wherein the cover body is equipped with a through hole on the center thereof and each bolt body is composed of a rod and a head. A knob cover, a second spring, and a T-shaped push rod are successively arranged in the through hole on the cover body from top to bottom. The head of each bolt body is used for being embedded into installing through holes of a left arc bar hole and a right arc bar hole. The rod of each bolt body is embedded into a rod hole on the bottom end face of the cover body. The side surface of the cover body is provided with a threaded hole communicated with the rod hole. A threaded rod is screwed into the threaded hole for fastening the bolt bodies. According to the testing device, contact pressure between the elastic testing rod and the pins of a MEMS chip can be correspondingly adjusted according to the characteristic of the MEMS chip such that it contributes to the adjustment of a contact surface of the MEMS chip and the elastic testing rod.
Description
Technical field
The present invention relates to chip testing technology field, be specifically related to a kind of proving installation for semi-conductor chip.
Background technology
In the research and development and large-scale production process of semi-conductor chip, all need to test all kinds of performances of chip, chip test base is the critical component in proving installation.The function of test bench is by the transmission of electric signal and electric current between chip positioning clamping and wiring board, and its function quality directly affects reliability and the accuracy of chip testing.Travelling speed along with chip improves with electronic product size Minus few day by day, also day by day improves the requirement of test bench performance.In general, the critical piece of test bench comprises spring probe, probe carriage, other electrical connections.Have pin cave in probe carriage to place the needle body of spring probe, needle body holds placement upper dynamic pin therein, spring and lower dynamic pin, and keeps good contact to guarantee the transmission of electric current and electric signal with dynamic pin.Dynamic pin moves to keep the electronics between chip and lower-class line plate to connect in needle body up and down, also can the dimensional tolerence of compensation chips and the another parts of proving installation.
Summary of the invention
The object of the invention is to provide a kind of proving installation for semi-conductor chip, this proving installation for semi-conductor chip can should adjust flexibility test rod and the contact of MEMS chip pin according to respective MEMS chip specific phase, also thus be conducive to the surface of contact adjusting MEMS chip and flexibility test rod.
For achieving the above object, the technical solution used in the present invention is: a kind of proving installation for semi-conductor chip, comprise train wheel bridge, lower plate, detent mechanism, PCB and host computer, the upper surface of described train wheel bridge and lower surface have upper groove and low groove, described lower plate to embed in low groove and is fixed in described PCB, in described PCB, some wire one end of plating are signal contact point, and the dry root wire other end is signal output point; Host computer for the electric signal analyzed is connected to the signal output point of described PCB;
Train wheel bridge is positioned at upper groove both sides and is respectively equipped with left arc slot, right arc slot, and left arc slot one end has installation through hole, and the right arc slot other end has another and installs through hole;
The upper groove of described train wheel bridge with offer several between low groove successively and be communicated with " T " through hole formed by the first pin hole with shrinkage pool, lower plate has the through hole corresponding with " T " through hole and the 3rd pin hole, the supporting plate of the one chip groove had for placing MEMS sensing chip embeds in described upper groove, is provided with several second pin holes in this chip groove.
One flexibility test rod embeds described " T " through hole, in through hole and the 3rd pin hole, this flexibility test rod comprises sleeve, be located at the upper pin in sleeve from top to bottom, first spring and the lower needle body contacted with PCB signal contact point, upper pin and lower needle body can move along in sleeve under external force, described first pin hole and the 3rd pinhole diameter are all less than through hole and shrinkage pool diameter, sleeve is seamlessly positioned at the shrinkage pool of train wheel bridge and the through hole of lower plate, the upper pin of flexibility test rod runs through the first pin hole successively, second pin hole exposed chip groove, the lower needle body of flexibility test rod runs through the 3rd pin hole and exposes, described sleeve height slightly larger than shrinkage pool and through-hole diameter and,
Described detent mechanism comprises center to be had in the lid of through hole and 2 keys be made up of rod and head, this through hole and is disposed with button lid, the second spring and for being pressed in the MEMS sensing chip back side and being positioned at the "T"-shaped push rod directly over chip groove from top to bottom, the rod of described 2 keys is installed on lid lower surface respectively, the head of key for embedding in the installation through hole of described left arc slot, right arc slot, thus realizes rod and moves in left arc slot, right arc slot;
The rod of described key embeds in the rod aperture of lid lower surface, and this lid side surface offers the threaded hole be communicated with rod aperture, and a threaded rod screws in threaded hole, for fastening described key.
In technique scheme, further improved plan is as follows:
In such scheme, the upper groove of described train wheel bridge is arranged with low groove is vertical in the horizontal direction.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1. the present invention is used for the proving installation of semi-conductor chip, its detent mechanism comprises lid and 2 keys be made up of rod and head that center has through hole, button lid is disposed with from top to bottom in this through hole, second spring and for being pressed in the MEMS sensing chip back side and being positioned at the "T"-shaped push rod directly over chip groove, the rod of described 2 keys is installed on lid lower surface respectively, the head of key is for embedding described left arc slot, in the installation through hole of right arc slot, thus realize rod at left arc slot, mobile in right arc slot, knob lid regulates T-shaped push rod to withstand chip by the second spring to make the pin of chip just to the position of pin hole, every position of two pin hole grooves and the site error of chip pin are no more than 0.01MM, secondly, during operation, key need move along left and right arc slot, thus is conducive to the surface of contact adjusting MEMS chip and flexibility test rod.
2. the present invention is used for the proving installation of semi-conductor chip, its flexibility test rod embeds described " T " through hole, in through hole and the 3rd pin hole, this flexibility test rod comprises sleeve, be located at the upper pin in sleeve from top to bottom, first spring and the lower needle body contacted with PCB signal contact point, upper pin and lower needle body can move along in sleeve under external force, described first pin hole and the 3rd pinhole diameter are all less than through hole and shrinkage pool diameter, sleeve is seamlessly positioned at the shrinkage pool of train wheel bridge and the through hole of lower plate, the upper pin of flexibility test rod runs through the first pin hole successively, second pin hole exposed chip groove, the lower needle body of flexibility test rod runs through the 3rd pin hole and exposes, described sleeve height slightly larger than shrinkage pool and through-hole diameter and, sleeve is fixed in shrinkage pool and through hole, needle body is removable, also prevent the pin of damage chip, avoid the bending and distortion of flexibility test rod and through hole, and damage shrinkage pool and through hole.
Accompanying drawing explanation
Fig. 1 is the proving installation structural representation of the present invention for semi-conductor chip;
Fig. 2 is detent mechanism structural representation of the present invention;
Fig. 3 is the proving installation partial structurtes schematic diagram one of the present invention for semi-conductor chip;
Fig. 4 is the proving installation partial structurtes schematic diagram two of the present invention for semi-conductor chip;
Fig. 5 is the proving installation partial structurtes schematic diagram three of the present invention for semi-conductor chip.
In above accompanying drawing: 1, train wheel bridge; 2, lower plate; 3, detent mechanism; 4, upper groove; 5, low groove; 6, left arc slot; 7, right arc slot; 81, through hole is installed; 82, through hole is installed; 9, " T " through hole; 91, the first pin hole; 92, shrinkage pool; 10, through hole; 11, chip groove; 111, the second pin hole; 12, supporting plate; 13, flexibility test rod; 131, sleeve; 132, upper pin; 133, the first spring; 134, lower needle body; 14, lid; 141, through hole; 142, rod aperture; 143, threaded hole; 15, key; 151, rod; 152, head; 16, button lid; 17, the second spring; 18, "T"-shaped push rod; 19, threaded rod; 20, PCB; 201, wire; 202, signal contact point; 203, signal output point; 21, host computer; 22, groove; 23, the 3rd pin hole.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of proving installation for semi-conductor chip, comprise train wheel bridge 1, lower plate 2, detent mechanism 3, PCB 20 and host computer 21, the upper surface of described train wheel bridge 1 and lower surface have upper groove 4 and low groove 5, described lower plate 2 to embed in low groove 5 and is fixed in described PCB 20, in described PCB 20, some wires 201 one end of plating is signal contact point 202, and the dry root wire other end is signal output point 203; Host computer 21 for the electric signal analyzed is connected to the signal output point 203 of described PCB 20;
Train wheel bridge 1 is positioned at upper groove 4 both sides and is respectively equipped with left arc slot 6, right arc slot 7, and left arc slot 6 one end has installs through hole 81, and right arc slot 7 other end has another and installs through hole 82;
The upper groove 4 of described train wheel bridge 1 with offer several between low groove 5 successively and be communicated with " T " through hole 9 formed by the first pin hole 91 with shrinkage pool 92, lower plate 2 has the through hole 10 corresponding with " T " through hole 9 and the 3rd pin hole 23, the supporting plate 12 of the one chip groove 11 had for placing MEMS sensing chip embeds in described upper groove 4, is provided with several second pin holes 111 in this chip groove 11;
One flexibility test rod 13 embeds described " T " through hole 9, in through hole 10 and the 3rd pin hole 23, this flexibility test rod 13 comprises sleeve 131, be located at the upper pin 132 in sleeve 131 from top to bottom, first spring 133 and the lower needle body 134 contacted with PCB 20 signal contact point 202, upper pin 132 and lower needle body 134 under external force can along mobile in sleeve 131, described first pin hole 91 and the 3rd pin hole 23 diameter are all less than through hole 10 and shrinkage pool 92 diameter, sleeve 131 is seamlessly positioned at the shrinkage pool 92 of train wheel bridge 1 and the through hole 10 of lower plate 2, the upper pin 132 of flexibility test rod 13 runs through the first pin hole 91 successively, second pin hole 111 is exposed chip groove 11 also, the lower needle body 134 of flexibility test rod 13 runs through the 3rd pin hole 23 and exposes, described sleeve 131 height slightly larger than shrinkage pool 92 and through hole 10 diameter and,
Described detent mechanism 3 comprises lid 14 and 2 keys 15 be made up of rod 151 and head 152 that center has through hole 141, button lid 16 is disposed with from top to bottom in this through hole 141, second spring 17 and for being pressed in the MEMS sensing chip back side and being positioned at the "T"-shaped push rod 18 directly over chip groove 11, the rod 151 of described 2 keys 15 is installed on lid 14 lower surface respectively, the head 152 of key 15 is for embedding described left arc slot 6, the installation through hole 81 of right arc slot 7, in 82, thus realize rod 151 at left arc slot 6, mobile in right arc slot 7.
The rod 151 of above-mentioned key 15 embeds in the rod aperture 142 of lid 14 lower surface, and this lid 14 side surface offers threaded hole 143, threaded rod 19 be communicated with rod aperture 142 and screws in threaded hole 143, for fastening described key 15.
The upper groove 4 of above-mentioned train wheel bridge 1 is arranged with low groove 5 is vertical in the horizontal direction.
Through hole 141 upper diameter of above-mentioned lid 14 is greater than through hole 141 lower diameter, and end plate and the push rod of described "T"-shaped push rod 18 lay respectively at through hole 141 upper and lower.
Above-mentioned supporting plate 12 has a groove 22, and described chip groove 11 is positioned at this groove 22.
When adopting the above-mentioned proving installation for semi-conductor chip, its knob lid regulates T-shaped push rod to withstand chip by the second spring to make the pin of chip just to the position of pin hole, and every position of two pin hole grooves and the site error of chip pin are no more than 0.01MM; Secondly, during operation, key need move along left and right arc slot, thus is conducive to the surface of contact adjusting MEMS chip and flexibility test rod; Again, sleeve is fixed in shrinkage pool and through hole, and needle body is removable, also prevent the pin of damage chip, avoids the bending and distortion of flexibility test rod and through hole, and damages shrinkage pool and through hole.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (2)
1. the proving installation for semi-conductor chip, it is characterized in that: comprise train wheel bridge (1), lower plate (2), detent mechanism (3), PCB (20) and host computer (21), the upper surface of described train wheel bridge (1) and lower surface have upper groove (4) and low groove (5), described lower plate (2) to embed in low groove (5) and is fixed in described PCB (20), in described PCB (20), some wires (201) one end of plating is signal contact point (202), the dry root wire other end is signal output point (203), host computer (21) for the electric signal analyzed is connected to the signal output point (203) of described PCB (20),
Train wheel bridge (1) is positioned at upper groove (4) both sides and is respectively equipped with left arc slot (6), right arc slot (7), and left arc slot (6) one end has installs through hole (81), and right arc slot (7) other end has another and installs through hole (82);
The upper groove (4) of described train wheel bridge (1) with offer several between low groove (5) successively and be communicated with " T " through hole (9) formed by the first pin hole (91) with shrinkage pool (92), lower plate (2) has the through hole (10) corresponding with " T " through hole (9) and the 3rd pin hole (23), the supporting plate (12) of the one chip groove (11) had for placing MEMS sensing chip embeds in described upper groove (4), is provided with several second pin holes (111) in this chip groove (11);
One flexibility test rod (13) embeds described " T " through hole (9), in through hole (10) and the 3rd pin hole (23), this flexibility test rod (13) comprises sleeve (131), be located at the upper pin (132) in sleeve (131) from top to bottom, first spring (133) and the lower needle body (134) contacted with PCB (20) signal contact point (202), upper pin (132) and lower needle body (134) under external force can be mobile in sleeve (131), described first pin hole (91) and the 3rd pin hole (23) diameter are all less than through hole (10) and shrinkage pool (92) diameter, sleeve (131) is seamlessly positioned at the shrinkage pool (92) of train wheel bridge (1) and the through hole (10) of lower plate (2), the upper pin (132) of flexibility test rod (13) runs through the first pin hole (91) successively, second pin hole (111) exposed chip groove (11), the lower needle body (134) of flexibility test rod (13) runs through the 3rd pin hole (23) and exposes, described sleeve (131) height slightly larger than shrinkage pool (92) and through hole (10) diameter with,
Described detent mechanism (3) comprises lid (14) and 2 keys (15) be made up of rod (151) and head (152) that center has through hole (141), button lid (16) is disposed with from top to bottom in this through hole (141), second spring (17) and for being pressed in the MEMS sensing chip back side and being positioned at the "T"-shaped push rod (18) directly over chip groove (11), the rod (151) of described 2 keys (15) is installed on lid (14) lower surface respectively, the head (152) of key (15) is for embedding described left arc slot (6), the installation through hole (81 of right arc slot (7), 82) in, thus realize rod (151) in left arc slot (6), mobile in right arc slot (7),
The rod (151) of described key (15) embeds in the rod aperture (142) of lid (14) lower surface, this lid (14) side surface offers the threaded hole (143) be communicated with rod aperture (142), one threaded rod (19) screws in threaded hole (143), for fastening described key (15).
2. the proving installation for semi-conductor chip according to claim 1, is characterized in that: the upper groove (4) of described train wheel bridge (1) is arranged with low groove (5) is vertical in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510232767.1A CN104880658B (en) | 2013-07-23 | 2013-07-23 | Test device for acceleration transducer |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510232767.1A CN104880658B (en) | 2013-07-23 | 2013-07-23 | Test device for acceleration transducer |
| CN201310311229.2A CN103399176B (en) | 2013-07-23 | 2013-07-23 | Test system for acceleration sensor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310311229.2A Division CN103399176B (en) | 2013-07-23 | 2013-07-23 | Test system for acceleration sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104880658A true CN104880658A (en) | 2015-09-02 |
| CN104880658B CN104880658B (en) | 2018-09-07 |
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310311229.2A Active CN103399176B (en) | 2013-07-23 | 2013-07-23 | Test system for acceleration sensor |
| CN201510232189.1A Active CN104914374B (en) | 2013-07-23 | 2013-07-23 | Device for the detection of acceleration transducer electrical property |
| CN201510232767.1A Active CN104880658B (en) | 2013-07-23 | 2013-07-23 | Test device for acceleration transducer |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310311229.2A Active CN103399176B (en) | 2013-07-23 | 2013-07-23 | Test system for acceleration sensor |
| CN201510232189.1A Active CN104914374B (en) | 2013-07-23 | 2013-07-23 | Device for the detection of acceleration transducer electrical property |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN103399176B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105675120A (en) * | 2016-04-26 | 2016-06-15 | 中国电子科技集团公司第二十六研究所 | Wafer frequency test device |
| CN109187224A (en) * | 2018-10-08 | 2019-01-11 | 北方电子研究院安徽有限公司 | A kind of chip pin detection device |
| CN109917199A (en) * | 2017-12-12 | 2019-06-21 | 致茂电子(苏州)有限公司 | Modularization compression bonding apparatus and the electronic component detection equipment for having the device |
| TWI796167B (en) * | 2022-03-16 | 2023-03-11 | 四方自動化機械股份有限公司 | Precisely positionable test sockets |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103399176B (en) * | 2013-07-23 | 2015-07-01 | 苏州固锝电子股份有限公司 | Test system for acceleration sensor |
| CN106680546B (en) * | 2017-02-22 | 2023-05-12 | 西安派瑞功率半导体变流技术股份有限公司 | Self-adaptive power semiconductor chip test adapter |
| CN112595413B (en) * | 2021-03-03 | 2021-10-08 | 山东新港电子科技有限公司 | Detection tool for vibration sensor |
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- 2013-07-23 CN CN201310311229.2A patent/CN103399176B/en active Active
- 2013-07-23 CN CN201510232189.1A patent/CN104914374B/en active Active
- 2013-07-23 CN CN201510232767.1A patent/CN104880658B/en active Active
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| US20010005141A1 (en) * | 1999-12-21 | 2001-06-28 | Peter Pochmuller | Configuration for testing chips using a printed circuit board |
| CN100545659C (en) * | 2006-08-21 | 2009-09-30 | 雅马哈株式会社 | Test chip socket |
| CN201166674Y (en) * | 2007-12-06 | 2008-12-17 | 沈阳圣仁电子科技有限公司 | Buffering vertical probe card |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105675120A (en) * | 2016-04-26 | 2016-06-15 | 中国电子科技集团公司第二十六研究所 | Wafer frequency test device |
| CN109917199A (en) * | 2017-12-12 | 2019-06-21 | 致茂电子(苏州)有限公司 | Modularization compression bonding apparatus and the electronic component detection equipment for having the device |
| CN109917199B (en) * | 2017-12-12 | 2022-03-15 | 致茂电子(苏州)有限公司 | Modular pressure welding device and electronic component detection equipment with same |
| CN109187224A (en) * | 2018-10-08 | 2019-01-11 | 北方电子研究院安徽有限公司 | A kind of chip pin detection device |
| TWI796167B (en) * | 2022-03-16 | 2023-03-11 | 四方自動化機械股份有限公司 | Precisely positionable test sockets |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104880658B (en) | 2018-09-07 |
| CN104914374B (en) | 2018-04-27 |
| CN103399176B (en) | 2015-07-01 |
| CN104914374A (en) | 2015-09-16 |
| CN103399176A (en) | 2013-11-20 |
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