TWI796167B - Precisely positionable test sockets - Google Patents

Abstract

A test seat capable of precise positioning, comprising: a test seat body, a floating plate arranged on the test seat body, and a side pushing device arranged on the side of the test seat body; a side pushing element that moves the body horizontally, and a force applying element that exerts a force on the side pushing element, wherein when the wafer is put into the wafer testing section on the floating plate, the side pushing element is pushed by the force applying element The applied force makes the push end of the side pushing element push the wafer in the side direction, thereby positioning the wafer in the wafer testing section.

Description

Precisely positionable test sockets

The invention relates to the technical field of wafer testing, in particular to a device capable of more precisely positioning wafers on test seats.

After the chip is manufactured, it needs to be tested to clarify its various electrical properties. Figure 1 and Figure 2 show the conventional wafer testing method, which is to put the wafer C into the wafer testing part B1 of the floating plate B on the test seat body A, and then use the jig to press down the wafer C and the floating plate B together , so that the probes located under the floating plate B protrude upwards to contact the contacts on the chip C, and then conduct current to test various performance indicators of the chip C.

In order to make the wafer be put into the wafer testing part as accurately as possible for testing, the inner peripheral dimension of the concave wafer testing part needs to be consistent with the peripheral dimension of the wafer, but in order to make the wafer can be put into the wafer testing part smoothly, it is usually necessary to place the wafer The inner dimension of the test part plus a proper tolerance, but in this way there is a gap between the outer periphery of the wafer and the inner periphery of the wafer test part, although the jig has the ability to press the wafer and the floating plate down during the test process. To a certain extent, the effect of fixing the wafer in the vertical direction, but when the test seat body needs to rotate to test the wafer (such as a gyroscope wafer), the centrifugal force generated will make the wafer move in the horizontal direction, and the wafer cannot be fixed reliably. Difficulties in wafer test operation caused, unable to be calibrated or tested.

The object of the present invention is to provide a wafer test seat which can securely fix the wafer for precise positioning.

The present invention provides a chip test seat capable of precise positioning, which may include: a test seat body with a concave portion formed above, and several probes are arranged below the test seat body corresponding to the concave portion; In the recess, the floating plate is formed with a recessed wafer test portion, and at least one elastic element is arranged between the floating plate and the test seat body, so that the floating plate can move elastically in the vertical direction, and the probes A plurality of pinholes penetrating the bottom surface of the wafer testing part from bottom to top; and a side pushing device, which is arranged on one side of the test seat body, and the side pushing device may at least include: a side pushing element, which is slidably fitted on the test seat body, so that the pushing end of the side pushing element can horizontally move into or out of the wafer testing part; and at least one force applying element acts on the side pushing element, so that the pushing end of the side pushing element Into the wafer testing section, wherein a wafer is put into the wafer testing section when the pushing end of the lateral pushing element is withdrawn from the wafer testing section, and the side pushing element is pushed by the force applying element Apply force to make the push end of the side pushing element push one side of the wafer, so that the wafer is positioned in the wafer testing section. With this structure, the wafer is firmly supported by the side pushing element, so when the test seat body rotates, the centrifugal force generated will not cause the wafer to move in the horizontal direction, so that the wafer can be accurately positioned, calibrated and tested .

Preferably, the side pushing device further includes a fixing base, the side pushing element is slidably fitted on the fixing base and the test base body at the same time, the fixing base is fixed on the test base body, the first end of the force applying element is Fixed on the fixing seat, the opposite second end of the force applying element contacts the side pushing element. In this way, the force-applying element exerts force on the side pushing element in the horizontal direction, so that the side pushing element exerts a pushing force on the side of the wafer to clamp the wafer, so that the wafer is reliably fixed.

Preferably, the force applying elements can be elastic thimbles. Thereby, the elastic force of the spring in the elastic thimble is used to provide the force applied to the side pushing element, so that the wafer can obtain a fixed force for proper positioning, reduce the use of electric and pneumatic equipment, and facilitate the repair and maintenance of the test seat.

Preferably, the periphery of the wafer testing part is formed as a slope. In this way, when the wafer is easily put into the wafer testing section, the oblique guides the wafer, so that the wafer can be accurately dropped into the wafer testing section.

Preferably, the side pushing element can have a slider, one end of the slider forms the push end of the protrusion, and the opposite end of the slider forms an operating end of the other protrusion, and the second end of the force applying element The two ends act on the push end. In this way, under the action of the force-applying element, the slider drives the push button to tighten or loosen the chip, which is convenient for testing and replacing the chip.

Preferably, the test seat body is provided with a slideway, the slideway includes a horizontal part and a vertical part, the vertical part communicates with the wafer testing part of the floating plate, and the sliding block of the side pushing element is slidably fitted on the horizontal part. part, so that the push end moves horizontally in the vertical part. In this way, the sliding of the slider is guided by the slideway, the sliding precision of the slider is improved, and more precise clamping of the wafer is facilitated.

Preferably, the fixing base is provided with at least one blind hole, and the first end of the at least one elastic thimble is fixed in the blind hole. Thereby, the positioning and setting of the elastic thimble is facilitated, and the stability of setting the elastic thimble is improved.

Preferably, an air channel may be opened in the side pushing element, and an air blowing hole communicating with the air channel is opened at the push end of the side pushing element. In this way, the wafer is closely attached to the inner wall of the wafer testing part under the action of the air flow by blowing air, and the positioning accuracy of the wafer in the wafer testing part is improved.

Preferably, an air intake channel may be provided on the floating plate, and a plurality of communication holes communicating with the air intake channel are provided on the inner wall of the wafer testing part. In this way, the wafer is sucked by means of suction, and the blowing effect of the side pusher element is used to make the wafer and the inside of the wafer testing section adhere more closely, and the positioning accuracy of the wafer in the wafer testing section is improved.

Preferably, a detection element is provided on the side wall of the test seat body, and the detection element is connected with the air intake channel to detect the airflow in the air intake channel. In this way, the position of the wafer in the wafer testing section can be known by detecting the air intake passage or the airflow in the intake passage, so that the wafer can be completely positioned in the wafer testing section.

In summary, the present application includes at least one of the following beneficial technical effects:

1. The wafer is clamped on the inner wall of the wafer testing part by using the side pushing element, which prevents the wafer from moving in the horizontal direction during the testing process, improves the stability of the wafer during the testing process, and improves the testing accuracy of the wafer;

2. Set the air blowing hole on the side pushing element to blow air and set the communication hole on the wafer testing part to inhale air. Using the pushing and attracting effect of the airflow, the wafer and the inner wall of the wafer testing part can be attached more closely, and the wafer can be lifted on the wafer. Positioning accuracy within the test section.

In order to facilitate the understanding of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. The drawings show some, but not all, embodiments of the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making progressive efforts belong to the protection scope of the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used in the description of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

As shown in FIG. 3 to FIG. 6 , the wafer test socket capable of precise positioning provided by the present invention includes: a test socket body 1 , a floating plate 2 and a side pushing device 3 . Wherein, the test seat body 1 is a base for setting the floating plate 2 , the lateral thrust device 3 and the probe 4 (as shown in FIG. 6 ). A plurality of probes 4 are provided on the lower surface of the test socket body 1, and each probe 4 is arranged vertically so that the tip thereof faces upward. The floating plate 2 is arranged on the test socket body 1 to carry the wafer 5 to be tested, and the floating plate 2 can move vertically relative to the test socket body 1. When the floating plate 2 moves downward relative to the test socket body 1 When the needle point of the probe protrudes from the bottom surface of the wafer test portion 21 of the floating plate 2, when the floating plate 2 moves upward relative to the test seat body 1, the needle point of the probe 4 is submerged into the bottom surface of the wafer test portion 21 of the floating plate 2. The side pushing device 3 is installed on the side of the test seat body 1 to provide a side thrust to the side of the wafer 5 placed on the floating plate 2, so that the wafer 5 can be further accurately positioned and fixed.

More specifically, as shown in Figure 6, a recess 11 is formed on the top of the test seat body 1, and a plurality of recesses 111 are arranged on the bottom surface of the recess 11, and elastic elements 12 are respectively arranged in each recess 111; the bottom surface of the recess 11 is also A plurality of probe holes 112 are provided, and probes 4 can be movably inserted in selected probe holes 112 as required, and the tip of the probe 4 protrudes above the bottom surface of the recess 11 by an appropriate length. The plurality of probes 4 are disposed on the probe base 41 , and the probe base 41 is fixed on the bottom of the test base body 1 , so the probes 4 passing through the probe holes 112 are fixedly disposed. The probe base 41 equipped with the probe 4 is electrically connected to the detection equipment (not shown in the figure) via wires; the side of the test base body 1 is also formed with a slideway for matching the side thrust element 31 of the side thrust device 3 13. Viewed from the direction of FIG. 6, the slideway 13 is L-shaped, that is, the slideway 13 has a horizontal part 131 and a vertical part 132. The horizontal part 131 is a part for slidingly matching the side pushing element 31, and the vertical part 132 is a portion extending to the recess 11 and communicating with the recess 11 .

As shown in FIGS. 4 and 6 , the floating plate 2 is a board for matchingly arranged in the recess 11 of the test seat body 1 and used for carrying the wafer 5 , and a recessed wafer testing portion 21 is formed on the floating plate 2 , and the inner side peripheral surface of the wafer testing portion 21 of the depression is preferably formed as a slope with a relatively wide upper end and a relatively narrow lower end, so that the wafer can be easily introduced into the wafer test via the slope when it is put into the wafer testing portion 21. In part 21; In addition, the bottom surface of wafer testing part 21 is provided with plural pinholes 211, and the quantity and position of these pinholes 211 correspond to the probe hole 112 that is arranged on test seat body 1, that is, when floating plate 2 When set in the concave portion 11 of the test base body 1, the pinholes 211 and the probe holes 112 are linearly corresponding to each other, so that the upper tip of each probe 4 set in the probe holes 112 can penetrate into the pinholes 211 .

Furthermore, the lower bottom surface of the floating plate 2 is provided with a plurality of positioning holes 22, the number and positions of these positioning holes 22 correspond to the concave holes 111 arranged on the test socket body 1, so that when the floating plate 2 is arranged in the concave portion 11 , the upper end of the elastic element 12 is positioned in the positioning holes 22, therefore, the upper and lower ends of the elastic element 12 respectively act on the positioning hole 22 of the floating plate 2 and the concave hole 111 of the test socket body 1, so that the floating plate 2 can move elastically in the vertical direction; in other words, when the floating plate 2 is subjected to a downward force, the elastic member 12 is compressed to store the elastic force, and when the force is released, the stored elastic force is released to make the floating plate 2 move upwards; in a preferred embodiment, the bottom surface of the wafer test portion 21 of the floating plate 2 has an appropriate thickness, and when the floating plate 2 is not subjected to a downward force, the elastic element 12 can move the floating plate 2 upwards Move to a height position so that the needle point of the probe 4 is submerged in the pinhole 211, and when the floating plate 2 is subjected to a downward force, the floating plate 2 is pushed down to a lower height position so that the probe 4 protrudes from the needle hole 211, and at the same time makes the elastic element 12 compressed to store the elastic force.

The side pushing device 3 is arranged on one side of the test seat body 1 to provide a side pushing force to the wafer 5 placed in the wafer testing portion 21 of the floating plate 2 . As shown in FIG. 4 and FIG. 6 , the first embodiment of the side thrust device 3 includes: a side thrust element 31 , a force applying element 32 and a fixing seat 33 . Wherein, the side push element 31 has an elongated slider 311, one end of the slider 311 forms a raised push end 312, and the opposite end of the slider 311 forms another raised operating end 313, and the push end 312 is In order to contact with one side of wafer 5 and provide the end of lateral thrust; Operating end 313 is used to operate the end that pushes element 31 to slide in the direction opposite to recessed portion 11, can be connected to automatic operation equipment or manually Operation; the slider 311 is a part that is slidably fitted to the horizontal part 131 of the slideway 13, and the push end 312 is a part located at the vertical part 132 of the slideway 13. When the slider 311 is operated to slide horizontally on the horizontal part 131 , the pushing end 312 moves horizontally in the vertical portion 132 , and then the pushing end 312 extends into the wafer testing portion 21 of the floating plate 2 or exits the wafer testing portion 21 .

In order to make the pushing end 312 automatically apply an active force to the side of the wafer 5, the side pushing device 3 also includes a force applying element 32 and a fixed seat 33; The first end is disposed on the fixing seat 33 , and the opposite second end acts on the push end 312 , so that the second end of the force applying element 32 exerts force on the push end 312 . Specifically, the force applying element 32 is an elastic thimble, and the elastic thimble has a shell 321, and a spring (not shown) is arranged in the shell 321, and the thimble 322 is penetrated in the shell 321, so that a part of the thimble 322 is positioned at In the casing 321 and subjected to spring action, and the other end of the thimble 322 is exposed from the casing 321, therefore, when the thimble 322 is pushed axially, the thimble 322 can be moved relative to the casing 321 and retracted in the casing 321, when the thimble 322 is released Then the thimble 322 is pushed out of the shell 321 by the spring.

As shown in FIG. 4 , the fixing seat 33 is formed with a guide groove 331 , holes 332 on opposite sides of the guide groove 331 , and a plurality of blind holes 333 above the guide groove 331 , and the sliding block 311 of the side pushing element 31 is slidingly fitted. In the guide groove 331 and the chute 131 of the test seat body 1, insert the first ends of the plurality of force applying elements 32 into the corresponding blind holes 333 and fix them, and then pass the screws 34 through the holes 332 to lock Insert the screw hole provided on the side of the test seat body 1 to fix the fixing seat 33 on the test seat body 1, and at the same time make the slider 311 slide in the guide groove 331 and the chute 131, and the second end of the force applying element 32 Act on the push end 312. Wherein, the number of the force application elements 32 depends on the force to be applied to the pre-pushing end 312 .

The actual operation mode of the first embodiment of the present invention is described as follows: when the side pushing element 31 is operated so that the pushing end 312 withdraws from the wafer testing section 21 of the floating plate 2, the wafer 5 is put into the wafer testing section 21 ( As shown in Figure 6), the wafer 5 is exerted downward pressure with a jig (not shown in the figure), and then the floating plate 2 is moved downward so that the needle tip of the probe 4 protrudes from the needle at the bottom of the wafer test seat 21. hole 211 to contact the contact point on the bottom surface of the wafer 5, and then release the operation so that the force applying element 32 exerts an active force on the pushing end 312 of the side pushing element 31, so that the pushing end 312 pushes one side of the wafer 5 to clamp Hold the wafer 5, make the wafer 5 positioned in the wafer test section 21 (as shown in Figure 7), and pass through the current to each probe 4 through the detection equipment to detect various electrical performance indicators to the wafer 5; Even if the main body 1 is driven to rotate, the wafer 5 will not be displaced, so that the purpose of precisely positioning the wafer can be achieved. After the test is completed, operate the operating end 313 to make the push end 312 withdraw from the wafer testing section 21, so that the tested wafer 5 can be taken out.

Then, the second embodiment of the present invention is described as follows:

Referring to Fig. 8 and Fig. 9, the difference between the second embodiment and the first embodiment is that a plurality of air blowing holes 314 are provided on the side of the pushing end 312 of the side pushing element 31 facing the wafer testing part 21, and the slide block 311 There is an air channel 315 communicating with a plurality of blowing holes 314, and the air channel 315 extends to the end of the slider 311 away from the push end 312, and communicates with an air supply device (not shown in the figure). A large amount of high-pressure airflow is passed into the air channel 315 through the air supply device, and the high-pressure airflow is ejected from the air blowing hole 314 to blow to the wafer 5 in the wafer test section 21, so as to push the wafer 5 and the inner wall of the wafer test section 21 to fit more tightly. compact, improving the positioning accuracy of the wafer 5.

Referring to Fig. 8 and Fig. 9, a plurality of communication holes 23 are provided on the inner side wall of the wafer test section 21, and the communication holes 23 are arranged on the side of the wafer test section 21 towards the air blow hole 314 of the push end 312, and the floating plate 2 is provided with There are a plurality of intake passages 24 communicating with the communication holes 23 one by one. A plurality of detection elements 10 are arranged on the floating plate 2 , and the detection elements 10 may be sensors for detecting the airflow velocity in the intake passage 24 . More precisely, when the side pushing element 31 pushes the wafer 5, the air suction device draws air, so that the wafer testing section 21 has an attractive force on the wafer 5, further making the wafer 5 and the inner wall of the wafer testing section 21 adhere tightly, The positioning accuracy of the wafer 5 is improved. When the inner wall of the wafer 5 and the wafer test section 21 was fully attached, the flow velocity of the air flow in the communication hole 23 was less, that is, the flow velocity of the air flow in the air inlet channel 24 was less; When there is a gap, the flow velocity of the airflow in the communication hole 23 is relatively high, that is, the flow velocity of the airflow in the air intake channel 24 is relatively high. When the wafer 5 is positioned in the wafer testing section 21, the detection element 10 detects the air flow in the communication hole 23 in real time, and according to the air flow data measured by the sensor, the positioning of the wafer 5 is completely judged to further improve the positioning accuracy of the wafer 5 .

The implementation principle of the second embodiment is as follows: when the side pushing element 31 pushes the wafer 5 to be positioned in the wafer testing section 21, the airflow is blown out from the air blowing hole 314 of the pushing end 312, and at the same time the communication hole 23 of the wafer testing section 21 The wafer 5 is attracted to improve the positioning efficiency of the wafer 5 and at the same time improve the positioning accuracy of the wafer 5 . The detection element 10 detects the air flow in the communication hole 23 , which is convenient for judging whether the positioning of the wafer 5 is complete according to the detection result, and further improves the positioning accuracy of the wafer 5 in the wafer testing part 21 .

The above-mentioned embodiments only represent preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

"Learning" A: Test socket body B: Floating board B1: Wafer Test Department C: chip "this invention" 1: Test socket body 10: Detection element 11: Concave 111: concave hole 112: probe hole 12: elastic element 13: slideway 131: Horizontal Department 132: vertical part 2: Floating board 21:Wafer testing department 211: pinhole 22: Positioning hole 23: Connecting hole 24: Intake channel 3: side thruster 31: side thrust element 311: slider 312: push end 313: Operation terminal 314: blow hole 315: airway 32: Force component 321: shell 322: Thimble 33: Fixed seat 331: guide groove 332: hole 333: blind hole 34: screw 4: Probe 41: Probe seat 5: Wafer

1 is a perspective view showing the structure of a conventional chip test seat; Fig. 2 is a plan view showing the structure of a conventional chip test seat; Fig. 3 is a perspective view showing the first embodiment of the test socket which can be accurately positioned according to the present invention; Fig. 4 is a three-dimensional exploded view showing the first embodiment of the test seat which can be accurately positioned according to the present invention; Fig. 5 is a top plan view showing the first embodiment of the test seat which can be accurately positioned according to the present invention; Fig. 6 is a plane cross-sectional view showing that the side pushing element is in an open state in the first embodiment of the test seat that can be accurately positioned according to the present invention; Fig. 7 is a plane sectional view showing that the side pushing element of the test seat capable of precise positioning of the present invention is in a closed state to clamp the wafer; Fig. 8 is a cross-sectional view showing the internal structure of the side pushing element in the second embodiment of the test seat which can be accurately positioned according to the present invention; and Fig. 9 is a cross-sectional view showing the internal structure of the floating plate in the second embodiment of the test socket capable of precise positioning according to the present invention.

1: Test socket body

2: Floating board

21:Wafer testing department

3: side thruster

31: side thrust element

311: slider

312: push end

313: Operation terminal

32: Force component

321: shell

322: Thimble

33: Fixed seat

331: guide groove

332: hole

333: blind hole

34: screw

5: Wafer

Claims (9)

A test seat capable of precise positioning, comprising: a test seat body, a recess is formed above the test seat body, and several probes are arranged below the test seat body corresponding to the recess; a floating plate is arranged on the test seat body In the concave portion, the floating plate is formed with a concave wafer test portion, and at least one elastic element is arranged between the floating plate and the test seat body, so that the floating plate can move elastically in the vertical direction, and the probes The needle penetrates several pinholes on the bottom surface of the wafer testing part from bottom to top; a side pushing device is arranged on one side of the test seat body, and the side pushing device at least includes: a fixing seat fixed on the test seat body a side pushing element, which is slidably fitted in the fixing seat and the test seat body at the same time, so that the pushing end of the side pushing element can move horizontally into or out of the wafer testing part; and at least one force applying element, which The first end is fixed on the fixing seat, and the opposite second end contacts and acts on the side pushing element, so that the pushing end of the side pushing element extends into the wafer testing part, wherein, operating the side pushing element makes the pushing A wafer is put into the wafer testing section under the condition that the trigger end withdraws from the wafer testing section, and when the operation is released, the force applying element exerts a force on the side pushing element, so that the pushing end of the side pushing element pushing one side of the wafer so that the wafer is positioned in the wafer testing section. The test socket capable of precise positioning as claimed in claim 1, wherein the force-applying elements are elastic thimbles. The test seat capable of precise positioning as claimed in claim 1, wherein the periphery of the wafer testing portion is formed as a slope. The test seat capable of precise positioning as described in claim 2, wherein the side pushing element has a slider, one end of the slider forms the protruding push end, and the opposite end of the slider forms another protrusion The operating end is raised, and the second end of the force-applying element acts on the push end. The test seat capable of precise positioning as described in claim 4, wherein the test seat body is provided with a slideway, the slideway includes a horizontal part and a vertical part, and the vertical part communicates with the wafer testing part of the floating plate , the sliding block is slidably matched with the horizontal part, so that the push end moves horizontally in the vertical part. The test seat capable of precise positioning according to claim 2, wherein the fixing seat is provided with at least one blind hole, and the first end of the at least one elastic thimble is disposed in the blind hole. According to the test seat capable of precise positioning as described in claim 1, an air channel is provided in the side pushing element, and an air blow hole communicated with the air channel is provided at the push end. According to the test seat capable of precise positioning as described in claim 7, an air inlet channel is provided on the floating plate, and a plurality of communication holes communicating with the air inlet channel are provided on the inner wall of the wafer testing part. As for the test seat capable of precise positioning as described in Claim 8, a detection element is provided on the side wall of the test seat body, and the detection element is connected with the air intake channel to detect the airflow in the air intake channel.

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