WO2018068627A1

WO2018068627A1 - Apparatus for chip testing and programming, and manufacturing method therefor

Info

Publication number: WO2018068627A1
Application number: PCT/CN2017/103164
Authority: WO
Inventors: 肖敏
Original assignee: 肖敏
Priority date: 2016-10-12
Filing date: 2017-09-25
Publication date: 2018-04-19
Also published as: CN107942223A

Abstract

An apparatus for chip testing and programming, and a manufacturing method therefor. The apparatus comprises a main board (1). The main board (1) is formed with a first placement region (10) corresponding to the main board (1) of a chip (2), a plurality of first pins (12) surrounding the first placement region (10) and respectively corresponding to a plurality of pins of the chip (2), a plurality of first contacts (16) outside the first placement region (10), and a plurality of first wires (14), wherein each of the first wires (14) connects one of the first pins (12) to one of the first contacts (16). When the chip (2) is placed on the first placement region (10), the plurality of pins of the chip are respectively in contact with the plurality of first pins (12). The apparatus and method can simplify a manufacturing process and reduce costs, and it is easy for a user to determine whether the apparatus is in good contact with a chip.

Description

Device for chip testing and programming and method of manufacturing same

Reference to related application

The present application claims priority to Chinese Patent Application No. 201610891906.6, filed on Oct. 12,,,,,,,,,,,,,,,,,

Technical field

Embodiments of the present disclosure relate to apparatus for chip testing and programming and methods of fabricating the same.

Background technique

The test bench or programming block of the chip is used extensively in the electronics industry. The main purpose is to write software into a large number of chips, as well as software development and functional testing before plate making. However, existing test or programming bases are more expensive. For example, the price of a programming base for a square flat package (QFP) chip is generally several hundred to several thousand dollars, which is too expensive for development, so there is no development process. Use a lot.

An important disadvantage of the existing programming base is that the user cannot confirm whether the programming seat is in good contact with the placed chip.

Summary of the invention

The present disclosure provides an apparatus for chip testing and programming and a method of fabricating the same that can simplify the manufacturing process, reduce cost, and enable the user to simply confirm whether the device is in good contact with the chip.

According to an aspect of the present disclosure, an apparatus for chip testing and programming is provided, including a motherboard on which a first placement area corresponding to a body of the chip, a plurality of tubes surrounding the first placement area and the chip are formed a plurality of first pins corresponding to the respective legs, a plurality of first contacts outside the first placement area, and a plurality of first wires, each of the first wires connecting a first pin and a first contact connection. When the chip is placed on the first placement area, the plurality of pins of the chip are respectively in contact with the plurality of first pins.

According to an embodiment, the first placement area, the first lead, the first contact, and the first wire are formed on the first surface of the main board, and the second surface of the main board is further formed with a plurality of second pins, the plurality of The two pins respectively correspond to the plurality of pins of the chip, and each of the second pins is adjacent to but not in contact with the corresponding one of the first pins, And when the chip is placed on the first placement area, each pin of the chip is in contact with the corresponding first pin and the second pin, respectively. A plurality of second contacts and a plurality of second wires are formed on the second surface of the main board opposite to the first surface outside the first placement area, and each of the second wires has a second contact and a second Pin connection.

According to an embodiment, at least two first positioning holes are further formed on the main board, the device further includes: a pressing plate, wherein the pressing plate is formed with at least two second positioning holes corresponding to the first positioning holes of the main board, and at least two A positioning pin for insertion into the first and second positioning holes. When the chip is placed on the first placement area of the main board and the pressure plate is covered, the first positioning hole and the second positioning hole are respectively aligned, and inserted into the first and second positioning holes through the positioning pin to position the chip in the first placement region.

According to an embodiment, the platen is further formed with: a second placement area corresponding to the body of the chip, a plurality of third pins surrounding the second placement area and corresponding to the plurality of pins of the chip, and the second placement area And a plurality of third contacts, and a plurality of third wires, each of the third wires connecting a third pin to a third contact. When the chip is placed on the second placement area, the plurality of pins of the chip are respectively in contact with the plurality of third pins.

According to an embodiment, the apparatus further includes: a fixing member that fixes the main board and the pressing plate and the chip sandwiched therebetween by the fixing member when the chip is placed on the first placement area of the main board and the pressing plate is covered.

According to an embodiment, the second placement area is formed as a recess or opening capable of accommodating the chip.

According to an embodiment, the apparatus further includes a positioning plate formed with an opening capable of accommodating the chip, and at least two third positioning holes corresponding to the at least two first positioning holes of the main board. When the chip is placed on the first placement area of the main board and the positioning plate is covered, the first positioning hole and the third positioning hole are respectively aligned, the chip is accommodated in the opening of the positioning plate, and inserted into the first and third through the positioning pin Position the hole to position the chip in the first placement area.

According to another aspect of the present disclosure, there is provided a method of fabricating a device for chip testing and programming, comprising providing a main board and forming on the main board: a first placement area corresponding to a body of the chip, surrounding the first placement area a plurality of first pins respectively corresponding to the plurality of pins of the chip, a plurality of first contacts outside the first placement area, and a plurality of first wires, each of the first wires will be a first pin Connected to a first contact. When the chip is placed on the first placement area, the plurality of pins of the chip are respectively in contact with the plurality of first pins.

According to an embodiment, the first placement area, the first pin, the first contact, and the first wire are formed on the main board The first surface, the manufacturing method further includes: forming a plurality of second pins on the first surface of the main board, the plurality of second pins respectively corresponding to the plurality of pins of the chip, each of the second pins and a corresponding one of the first pins is adjacent but not in contact, and when the chip is placed on the first placement area, each pin of the chip is in contact with the corresponding first pin and the second pin respectively; and is placed in the first place A plurality of second contacts and a plurality of second wires are formed on the second surface of the main board opposite to the first surface outside the area. Each second wire connects a second contact to a second pin.

According to an embodiment, the manufacturing method further includes: forming at least two first positioning holes on the main board, providing a pressing plate, and forming at least two second positioning holes corresponding to the first positioning holes of the main board on the pressing plate, and providing at least two Locating pins for insertion into the first and second positioning holes. When the chip is placed on the first placement area of the main board and the platen is covered, the chip is positioned in the first placement area by the positioning pins being inserted into the first and second positioning holes on the platen and the main board.

According to an embodiment, the manufacturing method further includes: forming a second placement area corresponding to the body of the chip on the platen, and a plurality of third pins respectively surrounding the second placement area and corresponding to the plurality of pins of the chip, in the second A plurality of third contacts outside the placement area, and a plurality of third wires, each of the third wires connecting a third pin to a third contact. When the chip is placed on the second placement area, the plurality of pins of the chip are respectively in contact with the plurality of third pins.

According to an embodiment, the manufacturing method further includes: providing a fixing member for fixing the main board and the pressing plate and the chip sandwiched therebetween by the fixing member when the chip is placed on the first placement area of the main board and the pressing plate is covered.

According to an embodiment, the manufacturing method further includes: providing a positioning plate, and forming an opening capable of accommodating the chip on the positioning plate, and at least two third positioning holes corresponding to the at least two first positioning holes of the main board. When the chip is placed on the first placement area of the main board and the positioning plate is covered, the first positioning hole and the third positioning hole are respectively aligned, the chip is accommodated in the opening of the positioning plate, and inserted into the first and third through the positioning pin Position the hole to position the chip in the first placement area.

The above apparatus of the present disclosure has at least the following advantages compared to the existing programming base.

Each pin of the existing programming base is a precision gold-plated probe or spring piece. The more pins, the higher the processing cost. The apparatus of the present disclosure can be fabricated using chemical etching techniques for printed circuit board (PCB) processing, once formed, regardless of the number of leads, processing costs can be maintained, and no precision processing equipment and processes are required.

The existing programming base requires a dedicated mold, and it is necessary to customize the precision mold and special materials for each chip, which is costly. The device of the present disclosure uses common PCB processing technology, does not require special molds, and greatly reduces costs.

For the existing programming base, the factory needs special equipment and trained workers to assemble, no matter the initial investment and post-operation, can not avoid the cost of training. The device of the present disclosure does not require complicated assembly equipment and well-trained workers, and can be assembled quickly by ordinary labor, without equipment investment, without training, and greatly reducing the cost.

In the existing programming block, the number of pins is large, and does not correspond to the chip pins, and it is difficult to confirm whether it is in good contact with the placed chip. The device of the present disclosure can easily confirm whether it is in good contact with the placed chip by utilizing the pins and contacts on the main board and/or the platen.

DRAWINGS

Further features and advantages of the present disclosure will become apparent from the following description of the embodiments.

FIG. 1 shows a schematic diagram of an apparatus for chip testing and programming in accordance with an embodiment of the present disclosure;

Figure 2 shows a schematic diagram of chip mounting into a test and programming device;

Figure 3 shows a schematic view of a test and programming device including a platen;

Figure 4 shows a schematic diagram of chip mounting into a test and programming device;

FIG. 5 shows a schematic view of a pressure plate according to another embodiment of the present disclosure; FIG.

6 illustrates a schematic diagram of confirming that a mounted chip is in good contact with a test and programming device, in accordance with an embodiment of the present disclosure;

7 shows a schematic diagram of a motherboard of a test and programming device in accordance with another embodiment of the present disclosure;

Figure 8 is a schematic view showing the back side of the main board shown in Figure 7;

Figure 9 shows a schematic diagram of a test and programming device including a positioning plate;

FIG. 10 illustrates a schematic diagram of confirming that a mounted chip is in good contact with a test and programming device, in accordance with another embodiment of the present disclosure.

detailed description

In the present disclosure, the various embodiments and the accompanying drawings are merely illustrative and should not be construed as limiting in any way. The scope of the disclosure. Those skilled in the art will appreciate that the principles of the present disclosure may be implemented in any suitable configuration or structure. Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings. In the following description, a detailed description of known functions or configurations will be omitted, as they will unnecessarily obscure the gist of the present disclosure. Moreover, the terms used herein are defined in accordance with the functionality of the present disclosure. Therefore, these terms may vary depending on the intention or practice of the user or the user. Therefore, the terms used herein must be understood based on the description herein.

FIG. 1 shows a schematic diagram of a device for chip testing and programming (hereinafter referred to as a test and programming device) in accordance with an embodiment of the present disclosure. As shown in FIG. 1, the test and programming apparatus includes a main board 1 on which a first placement area 10 corresponding to the body of the chip 2 is formed, for example, the shape and size of the area 10 correspond to the shape and size of the chip 2. The chip 2 is a quad flat pack (QFP) chip, which is a 32-pin QFP chip as an example in the present disclosure. The present disclosure is not limited to such a chip, but can be applied to chips of various packages. Formed on the main board 1 with a plurality of first pins 12 surrounding the first placement area 10 and corresponding to the plurality of pins of the chip 2, a plurality of first contacts 16 outside the first placement area 10, and A plurality of first wires 14, each of which connects a first pin 12 to a first contact 16. When the chip 2 is placed on the first placement area 10, the plurality of pins of the chip are respectively in contact with the plurality of first pins 12, as shown in FIG. At this time, the chip 2 can be tested and programmed by being connected to the first contact 16. In addition, the pin and the first contact 16 of the multimeter connection chip can be used to test the continuity, detecting whether the mounted chip is in good contact with the test and programming device. The detection and verification of the test and programming apparatus of the present disclosure is simple and straightforward compared to existing programming bases.

Figure 3 shows a schematic view of a test and programming device comprising a pressure plate 3. As shown in FIG. 3, in addition to the main board 1, the test and programming apparatus further includes a pressure plate 3 and at least two positioning pins 4 for further positioning or fixing the chip 2. In this embodiment, at least two first positioning holes 18 are formed on the main board 1, for example, formed on the main board 1 outside the first placement area 10, and the two positioning holes 18 are located opposite to each other on the diagonal corners of the main board 1. . At least two second positioning holes 38 corresponding to the first positioning holes 18 of the main board 1 are formed on the pressure plate 3. Two positioning pins 4 are inserted into the first and second positioning holes to position the chip 2. Other forms of locating members, such as other shapes, other numbers of locating holes, and locating pins, may also be employed, and the present disclosure is not limited to this embodiment. When the chip 2 is placed on the first placement area 10 of the main board 1 and the pressure plate 3 is covered, the first positioning hole 18 and the second positioning hole 38 are respectively aligned and inserted into the first and second positioning holes through the positioning pin 4. The chip 2 is positioned in the first placement area 10. According to an embodiment, the pressure plate 3 A recess or opening capable of accommodating the chip 2 can be formed, as shown in Fig. 4, the chip 2 is housed in the opening of the platen 2, which helps to further position the chip 2.

FIG. 5 shows a schematic view of a pressure plate in accordance with another embodiment of the present disclosure. Different from the pressure plate 3, a second placement area 30 corresponding to the main body of the chip 2 is formed on the pressure plate 3', and a plurality of third pins 32 respectively surrounding the second placement area 30 and corresponding to the plurality of pins of the chip 2 A plurality of third contacts 36 outside the second placement area 30, and a plurality of third wires 34, each of the third wires 34 connecting a third pin 32 to a third contact 36. When the chip 2 is placed on the second placement area 30, the plurality of pins of the chip 2 are in contact with the plurality of third pins 32, respectively. The second placement area 30 is shown in FIG. 5 as a recess or opening that is shaped and sized to correspond to the chip 2 and that can accommodate the chip 2. When testing or programming, the chip 2 can be first placed in the second placement area 30 of the pressure plate 3', then inserted into the positioning pin 4, and then the main board 1 is covered, so that the positioning pin 4 is inserted into the first and second positioning holes. Thereby the chip 2 is accurately mounted and positioned.

According to an embodiment of the present disclosure, the test and programming apparatus may further include a fixing member that fixes the main board and the pressing plate and the chip sandwiched therebetween by the fixing member when the chip is placed on the first placement area of the main board and the pressing plate is covered. The fixing member can be, for example, a screw that is fixed by screwing into a corresponding screw hole on the main plate and the pressure plate. The fastener may also be, for example, a clip that holds the main plate and the pressure plate. The present disclosure is not limited to these examples, but any suitable fixing means may be utilized.

6 shows a schematic diagram of confirming that the mounted chip 2 is in good contact with the test and programming device, in accordance with an embodiment of the present disclosure. The test and programming device of Figure 6 includes a main board 1 and a pressure plate 3'. When the chip 2 is mounted, the pins of the chip 2 should be in contact with the first pin 12 of the main board 1 and the third pin 32 of the press plate 3', respectively. Thus, the multi-table is connected to the first contact 16 and the third contact 36 to test the continuity, and it is possible to detect whether the mounted chip is in good contact with the test and programming device. The detection and verification of the test and programming apparatus of the present disclosure is simple and straightforward compared to existing programming bases.

FIG. 7 shows a schematic diagram of a motherboard 1' of a test and programming device in accordance with another embodiment of the present disclosure. A first placement area 10' corresponding to the main body of the chip is formed on the main board 1' in FIG. 7, and a plurality of first pins 12' respectively surrounding the first placement area 10' and corresponding to the plurality of pins of the chip, a plurality of first contacts 16' outside the first placement area 10', and a plurality of first wires 14', each of the first wires 14' having a first pin 12' and a first contact 16 'connection. The first placement area 10', the first lead 12', the first contact 16', and the first lead 14' are formed on the first surface of the main board 1', for example, for Place the front side of the chip. A plurality of second pins 74 are further formed on the first surface of the main board 1'. The plurality of second pins 74 also surround the first placement area 10', respectively corresponding to the plurality of pins of the chip, and each of the second leads The foot 74 is adjacent to but not in contact with a corresponding one of the first pins 12', and each pin of the chip and the corresponding first pin 12' and the second lead when the chip is placed on the first placement area 10' The feet 74 are in contact respectively. In addition, a plurality of second contacts 72 and a plurality of second wires 70 are formed on the second surface (eg, the back surface) of the main board 1' opposite to the first surface outside the first placement area 10', as shown in the figure. As shown in FIG. 8, each of the second wires 70 connects a second contact 72 to a second pin 74.

A chip such as a quad flat no-lead package (QFN) can be placed using the main board 1' shown in Figs. 7 and 8, which is a 16-pin QFN chip as an example in the present disclosure. As shown in FIG. 9, the chip 2' can be placed on the first placement area 10' of the main board 1', and the pins of the chip 2' should be in good contact with the first pin 12' and the second pin 74 of the main board 1'. . In order to confirm whether or not the contact is good, by using the multimeter to connect to the first contact 16' and the second contact 72, it is possible to detect whether the mounted chip is in good contact with the test and programming device. The detection and verification of the test and programming apparatus of the present disclosure is simple and straightforward compared to existing programming bases.

In addition, as shown in FIG. 9, the test and programming device may further include a positioning plate 5 formed with an opening capable of accommodating the chip, and at least two third portions corresponding to at least two first positioning holes of the main board Positioning holes. When the chip is placed on the first placement area of the main board and the positioning plate is covered, the first positioning hole and the third positioning hole are respectively aligned, the chip is accommodated in the opening of the positioning plate, and inserted into the first and third through the positioning pin Position the hole to position the chip in the first placement area.

FIG. 10 illustrates a schematic diagram of confirming that a mounted chip is in good contact with a test and programming device, in accordance with another embodiment of the present disclosure. The test and programming device of Fig. 10 includes a main board 1', a positioning plate 5, a pressure plate 3, and a screw 6 as a fixing member. First, the chip 2' is placed on the first placement area 10' of the main board 1', then the positioning board 5 is placed, and the positioning pins are inserted. Then, the pressure plate 3 is covered so that the positioning pins are inserted into the corresponding positioning holes of the main plate 1', the positioning plate 5, and the pressure plate 3. Finally, for further fixing, screw in the screw 6. After the mounting is completed, in order to confirm whether or not the contact is good, the first contact 16' and the second contact 72 are connected by a multimeter to test the on-off, thereby detecting whether the chip 2' is in good contact with the main board 1'. The mounting of the chip and the detection and verification of the test and programming devices of the present disclosure are simple and straightforward compared to existing programming bases.

The existing programming block is constructed with a gold-plated precision flexible probe under each chip pin or The spring piece is attached to the underside of the programming block, and a plurality of probes or spring pieces are precisely fixed to the programming housing, and then the chip is fixed to the probe or the spring piece by a mechanical structure. This structure is not easy to use and it is not easy to detect and confirm whether it is in good contact. In contrast, the test and programming apparatus according to an embodiment of the present disclosure is convenient to use, and can intuitively and easily detect and confirm whether or not it is in good contact.

A method of manufacturing the above-described test and programming apparatus according to an embodiment of the present disclosure is described below. The manufacturing method includes: providing a main board, and forming a first placement area corresponding to the main body of the chip on the main board, and a plurality of first pins respectively surrounding the first placement area and corresponding to the plurality of pins of the chip, at the first a plurality of first contacts outside the placement area, and a plurality of first wires, each of the first wires connecting a first pin to a first contact. When the chip is placed on the first placement area, the plurality of pins of the chip are respectively in contact with the plurality of first pins.

According to an embodiment, the first placement area, the first lead, the first contact, and the first wire are formed on the first surface of the main board, the manufacturing method further comprising: forming a plurality of second leads on the first surface of the main board a plurality of second pins respectively corresponding to the plurality of pins of the chip, each of the second pins being adjacent to but not in contact with the corresponding one of the first pins, and when the chip is placed on the first placement area, the chip Each of the pins is in contact with the corresponding first pin and the second pin, respectively; and a plurality of second contacts and a plurality of second contacts are formed on the second surface of the main plate opposite to the first surface outside the first placement area The second wire. Each second wire connects a second contact to a second pin.

According to another embodiment, the manufacturing method further includes: forming a second placement region corresponding to the body of the chip on the platen, a plurality of third pins surrounding the second placement region and corresponding to the plurality of pins of the chip, respectively a plurality of third contacts outside the second placement area, and a plurality of third wires, each of the third wires connecting a third pin to a third contact. When the chip is placed on the second placement area, the plurality of pins of the chip are respectively in contact with the plurality of third pins.

According to another embodiment, the manufacturing method further includes: providing a fixing member for using the fixing member to sandwich the main plate and the pressing plate and the clamping member when the chip is placed on the first placement area of the main board and the pressing plate is covered The chip is fixed.

According to another embodiment, the manufacturing method further includes: providing a positioning plate, and forming an opening capable of accommodating the chip on the positioning plate, and at least two third positioning holes corresponding to the at least two first positioning holes of the main board. When the chip is placed on the first placement area of the main board and the positioning plate is covered, the first positioning hole and the third positioning hole are respectively aligned, the chip is accommodated in the opening of the positioning plate, and inserted into the first and third through the positioning pin Position the hole to position the chip in the first placement area.

The existing programming base has a gold-plated precision flexible probe or spring piece under each chip pin, which is connected under the programming seat; a plurality of probes or spring pieces are precisely fixed on the programming housing; The chip is fixed to the probe or spring piece by a mechanical structure. Thus, the more pins, the more probes and springs, and the higher the processing cost. The manufacturing method of the existing programming base includes: manufacturing a mold housing mold, producing a programming housing by an injection molding process, producing a probe, fixing the probe to the programming housing, and assembling the housing with special equipment. This structure is more complicated, and the manufacturing method requires special equipment and well-trained workers, which is costly. Compared with the existing programming base, the test and programming device of the present disclosure can adopt a PCB board process to manufacture the main board, the pressure plate and the positioning board at one time, and replace the probe with the contacts on the PCB board, forming one time, no matter how many pins The cost is fixed. In this way, the use of common PCB processing technology, no special molds, no complicated assembly equipment and well-trained workers, no equipment investment, no training, and greatly reduced costs.

The above embodiments are merely examples and do not limit the disclosure. The description of the exemplary embodiments is intended to be illustrative, and not restrictive

Claims

A device for chip testing and programming, comprising:

Motherboard, formed on the motherboard

a first placement area corresponding to the body of the chip,

a plurality of first pins surrounding the first placement area and corresponding to the plurality of pins of the chip,

a plurality of first contacts outside the first placement area, and

a plurality of first wires, each of the first wires connecting a first pin to a first contact

Wherein when the chip is placed on the first placement area, the plurality of pins of the chip are respectively in contact with the plurality of first pins.
The apparatus of claim 1, wherein the first placement area, the plurality of first leads, the first contacts, and the first wires are formed on the first surface of the main board,

Forming a plurality of second pins on the first surface of the motherboard, the plurality of second pins respectively corresponding to the plurality of pins of the chip, each second pin being adjacent to the corresponding one of the first pins but not Contacting, and when the chip is placed on the first placement area, each pin of the chip is in contact with the corresponding first pin and the second pin, respectively

A plurality of second contacts and a plurality of second wires are formed on the second surface of the main board opposite to the first surface outside the first placement area, and each of the second wires has a second contact and a second Pin connection.
The device according to claim 1, wherein at least two first positioning holes are further formed on the main board.

The device also includes:

a pressure plate on which at least two second positioning holes corresponding to the first positioning holes of the main board are formed, and

At least two positioning pins for insertion into the first and second positioning holes,

When the chip is placed on the first placement area of the main board and the pressure plate is covered, the first positioning hole and the second positioning hole are respectively aligned, and inserted into the first and second positioning holes through the positioning pin to position the chip in the first placement region.
The apparatus according to claim 3, wherein the platen is further formed with:

a second placement area corresponding to the body of the chip,

a plurality of third pins surrounding the second placement area and corresponding to the plurality of pins of the chip,

a plurality of third contacts outside the second placement area, and

a plurality of third wires, each of the third wires connecting a third pin to a third contact

Wherein when the chip is placed on the second placement area, the plurality of pins of the chip are respectively in contact with the plurality of third pins.
The apparatus of claim 3 further comprising:

The fixing member fixes the main board and the pressing plate and the chip sandwiched therebetween by the fixing member when the chip is placed on the first placement area of the main board and the pressing plate is covered.
The device of claim 4 wherein the second placement area is formed as a recess or opening capable of receiving a chip.
The apparatus according to claim 1 or 2, further comprising:

Positioning plate, formed on the positioning plate

Capable of accommodating the opening of the chip, and

At least two third positioning holes corresponding to at least two first positioning holes of the main board;

When the chip is placed on the first placement area of the main board and the positioning plate is covered, the first positioning hole and the third positioning hole are respectively aligned, the chip is accommodated in the opening of the positioning plate, and inserted into the first and third through the positioning pin Position the hole to position the chip in the first placement area.
A method of fabricating a device for chip testing and programming, comprising:

Provide a motherboard and form on the motherboard

a first placement area corresponding to the body of the chip,

a plurality of first pins surrounding the first placement area and corresponding to the plurality of pins of the chip,

a plurality of first contacts outside the first placement area, and

a plurality of first wires, each of the first wires connecting a first pin to a first contact

Wherein when the chip is placed on the first placement area, the plurality of pins of the chip are respectively in contact with the plurality of first pins.
The manufacturing method according to claim 8, wherein the first placement region, the plurality of first leads, the first contacts, and the first wires are formed on the first surface of the main board,

The manufacturing method further includes: forming a plurality of second pins on the first surface of the main board, the plurality of second pins respectively corresponding to the plurality of pins of the chip, each of the second pins and the corresponding one of the first Pin proximity But not in contact, and when the chip is placed on the first placement area, each pin of the chip is in contact with the corresponding first pin and the second pin, respectively;

Forming a plurality of second contacts and a plurality of second wires on the second surface of the main board opposite to the first surface outside the first placement area, each of the second wires connecting a second contact and a second lead The feet are connected.
The manufacturing method according to claim 8, further comprising:

Forming at least two first positioning holes on the main board,

Providing a pressure plate, and forming at least two second positioning holes corresponding to the first positioning holes of the main board on the pressure plate, and

Providing at least two positioning pins for insertion into the first and second positioning holes,

Wherein when the chip is placed on the first placement area of the main board and the pressure plate is covered, the chip is positioned in the first placement area by the first and second positioning holes inserted into the pressure plate and the main board by the positioning pins.
The manufacturing method according to claim 10, further comprising:

Formed on the platen

a second placement area corresponding to the body of the chip,

a plurality of third pins surrounding the second placement area and corresponding to the plurality of pins of the chip,

a plurality of third contacts outside the second placement area, and

a plurality of third wires, each of the third wires connecting a third pin to a third contact

Wherein when the chip is placed on the second placement area, the plurality of pins of the chip are respectively in contact with the plurality of third pins.
The manufacturing method according to claim 10, further comprising:

A fixing member is provided for fixing the main board and the pressing plate and the chip sandwiched therebetween by the fixing member when the chip is placed on the first placement area of the main board and the pressing plate is covered.
The manufacturing method according to claim 8 or 9, further comprising:

Providing a positioning plate, and forming an opening capable of accommodating the chip on the positioning plate, and at least two third positioning holes corresponding to the at least two first positioning holes of the main board;

Wherein when the chip is placed on the first placement area of the main board and the positioning plate is covered, the first positioning hole and the third positioning hole are respectively aligned, the chip is accommodated in the opening of the positioning plate, and inserted into the first and the first through the positioning pin Three positioning holes that position the chip in the first placement area.