KR101736161B1 - Jig for micro contact array assembly - Google Patents

Jig for micro contact array assembly Download PDF

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Publication number
KR101736161B1
KR101736161B1 KR1020150121250A KR20150121250A KR101736161B1 KR 101736161 B1 KR101736161 B1 KR 101736161B1 KR 1020150121250 A KR1020150121250 A KR 1020150121250A KR 20150121250 A KR20150121250 A KR 20150121250A KR 101736161 B1 KR101736161 B1 KR 101736161B1
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KR
South Korea
Prior art keywords
jig
array assembly
contact
micro contact
insertion groove
Prior art date
Application number
KR1020150121250A
Other languages
Korean (ko)
Other versions
KR20170025200A (en
Inventor
전형근
이희준
Original Assignee
주식회사 이노베이스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 이노베이스 filed Critical 주식회사 이노베이스
Priority to KR1020150121250A priority Critical patent/KR101736161B1/en
Publication of KR20170025200A publication Critical patent/KR20170025200A/en
Application granted granted Critical
Publication of KR101736161B1 publication Critical patent/KR101736161B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

It is an object of the present invention to provide a jig for a micro contact array assembly capable of improving the manufacturing efficiency and defective ratio of a micro contact array assembly by facilitating placement and assembly of micro contact elements in the process of manufacturing the micro contact array assembly. To this end, the present invention provides a jig for a microcontact array assembly, wherein a contact element having a predetermined shape having elasticity is supported in a horizontal and vertical direction, and a fixed portion and an insertion groove are formed so that the contact elements are aligned and arranged at regular intervals Includes a jig. Therefore, the present invention has an advantage of improving the manufacturing efficiency and the defective ratio of the micro contact array assembly by improving the arrangement and assembly of the micro contact element in the process of manufacturing the micro contact array assembly.

Description

[0001] JIG FOR MICRO CONTACT ARRAY ASSEMBLY [0002]

The present invention relates to a jig for a microcontact array assembly, and more particularly, to a jig for microcontact array assembly, which improves the structure and shape of the jig so that the microcontact elements can be easily arranged and assembled in the process of manufacturing the microcontact array assembly, To a jig for a micro contact array assembly capable of improving an assembly efficiency and a defective ratio of an assembly.

In general, a semiconductor device performs various processing functions, and a plurality of input / output terminals are provided to perform such a processing function.

Therefore, semiconductor devices are formed of BGA (Ball Grid Array) package type, QFP (Quad Flat Package), SO (Small Outline) package type and the like. The BGA package type has a plurality of An electrode terminal is formed, and the electrode terminal is formed in a ball shape for electrical or mechanical contact with the printed circuit board.

Semiconductor devices are subject to electrical characterization and burn-in tests prior to shipment to verify the reliability of the products. Testing requires a test socket.

Also, the semiconductor device may be fabricated through a fabrication process for forming a circuit pattern and a contact pad for inspection on a wafer, an assembly process for assembling a circuit pattern and a contact pad formed wafer into respective semiconductor chips, do.

Between the fabrication process and the assembly process, an inspection process is performed to inspect the electrical characteristics of the wafer by applying an electrical signal to the contact pads formed on the wafer.

This inspection process is a process performed to inspect a wafer for defects and to remove a portion of the wafer where defects occur during the assembly process.

In the inspection process, an inspection device called a tester that applies an electrical signal to a wafer and an inspection device called a probe card that performs an interface function between the wafer and the tester are mainly used.

Wherein the probe card includes a printed circuit board for receiving an electrical signal applied from a tester and a plurality of probes in contact with a contact pad formed on the wafer.

Recently, as the demand for highly integrated semiconductor chips increases, the circuit pattern formed on the wafer is highly integrated by the fabrication process, and the pitch, i.e. pitch, between adjacent contact pads is formed to be very narrow .

In order to inspect the contact pads of such fine pitches, a space converter that performs a function of pitch conversion between the probes of the probe card and the printed circuit board is used, and is connected to the probe circuit pattern of the printed circuit board, An interposer for electrically connecting the electrodes to each other is used.

In addition, each of the dies separated from the wafer is formed in a process of being molded, and the package types are formed by BGA (Ball Grid Array), QFP (Quad Flat Package), SO (Small Outline) package 2 or the like Semiconductor devices.

Particularly, in the BGA package type, a plurality of ball type electrode terminals are formed on the lower surface of the package, and the electrical circuit is connected through mechanical contact. The spacing between the balls, that is, the pitches is as fine as several hundreds of micro There is a height deviation and it is separated and packaged into discrete devices for the purpose similar to that of the wafer state and then it is contacted with an accurate contact between a plurality of balls and a substrate on which an electrical circuit is formed at the time of testing for defective semiconductor devices, , The function of the microcontact array is important to the role of performing it repeatedly.

A micro contact array assembly having an elastic structure and improved contact defectiveness to a semiconductor device is disclosed in Korean Patent Registration No. 10-1496081 entitled " Interposer and Method of Manufacturing Micro Contact Array Assembly for Inspection of Semiconductor Device " It is posted.

The micro contact array assembly according to the related art includes an elastic micro contact element and a guide film formed with an insertion groove into which the elastic micro contact element is inserted, aligning the micro contact element with a jig, filling the liquid silicone rubber To form a microcontact array assembly.

However, such a micro contact array assembly has the following problems in the manufacturing process.

First, the insertion groove into which the microcontact device is inserted is manufactured to have a size larger than that of the microcontact device, so that the air existing between the microcontact device and the insertion groove is not removed during the process of filling and filling the insertion groove with the liquid silicone rubber. And is hardened together with the silicone rubber to reduce the yield due to an increase in the defective ratio of the micro contact array assembly.

Second, since the process of inserting and fixing the microcontact device into the insertion groove in the process of manufacturing the microcontact array assembly is complicated, the manufacturing efficiency is low.

Third, there is a problem in that a cleaning process for removing the adhesive after the manufacture of the micro contact array assembly is performed by using a separate adhesive in the process of fixing the micro contact device to the jig.

Korean Registered Patent Publication No. 10-1496081 (entitled " Interposer and Method of Manufacturing Micro Contact Array Assembly for Inspection of Semiconductor Device)

In order to solve such problems, the present invention improves the structure and shape of the jig so that the placement and assembly of the microcontact elements can be easily performed in the process of manufacturing the microcontact array assembly, thereby improving the manufacturing efficiency and the defect rate of the microcontact array assembly The present invention also provides a jig for a microcontact array assembly.

According to an aspect of the present invention, there is provided a jig for a microcontact array assembly, comprising: a jig for holding a resilient contact element having a predetermined shape in a horizontal and vertical direction; And a jig forming an insertion groove.

The jig according to the present invention may further include: a first jig having a first jig fixing part and a first jig insertion groove formed to support the contact device in a horizontal direction; And a second jig having a second jig fixing part and a second jig insertion groove formed to support the contact element in a vertical direction, wherein the first and second jigs are preferably detachable Do.

Further, the first jig according to the present invention may further include a spacer having a predetermined width so that a damper composed of a liquid resin is formed at both ends of the first jig.

The jig according to the present invention may further include a third jig provided on the first and second jigs to form a liquid resin injection space for covering the contact elements.

In addition, the third jig according to the present invention may further include: an inclined portion formed on the upper surface of the liquid resin to form a slope at an angle so as to form an inclined surface in the first jig direction from the second jig; And an opening formed by cutting a part of the first jig so as to expose the first jig fixing part and the first jig insertion groove.

The liquid resin according to the present invention is characterized by being a silicone rubber.

The present invention has the advantage of improving the manufacturing efficiency and the defective ratio of the micro contact array assembly by improving the structure and shape of the jig so that the micro contact device can be arranged and assembled in the course of manufacturing the micro contact array assembly.

1 is an exploded perspective view showing a jig for a microcontact array assembly according to the present invention.
2 is a cross-sectional view illustrating a jig for a microcontact array assembly according to an embodiment of the present invention;
3 is a perspective view illustrating a state of engagement of a jig in a process of assembling a contact element using a jig for a micro contact array assembly according to the present invention.
4 is a perspective view illustrating a state of engagement of the jig in the process of applying the silicone rubber using the jig for the micro contact array assembly according to the present invention.
5 is a front view of a microcontact array assembly fabricated from a jig for a microcontact array assembly in accordance with the present invention.

Hereinafter, a preferred embodiment of a jig for a micro contact array assembly according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view of a jig for a micro contact array assembly according to the present invention, FIG. 2 is a cross-sectional view illustrating a jig for a jig for a micro contact array assembly according to the present invention, FIG. 4 is a perspective view illustrating a state of engagement of a jig in a process of applying a silicone rubber using the jig for a micro contact array assembly according to the present invention. FIG. 4 is a perspective view illustrating a jig in a process of assembling a contact device using the jig for assembly.

1 to 4, a jig 100 for a microcontact array assembly according to the present invention has a structure used in a step of aligning the contact elements 200 in the course of manufacturing the microcontact array assembly 400 A first jig 110 and a second jig 120 for supporting a contact element 200 having a predetermined elasticity in a horizontal and vertical direction, And a third jig 130 disposed thereon.

The first and second jigs 110 and 120 may be formed integrally or separately.

The first jig 110 is a plate-shaped member having a predetermined thickness for supporting the contact element 200 having a certain shape having elasticity in a horizontal direction. The first jig 110 has first jig fixing parts 111 and And first jig insertion grooves 112 are provided parallel to each other along the longitudinal direction.

The first jig fixing part 111 and the first jig insertion groove 112 are formed such that when a part of the contact element 200, that is, the second contact 220 is inserted, the contact element 200 is inserted into the first jig 110 And the contact elements 200 are aligned on the upper surface of the first jig 110 at regular intervals along the horizontal direction.

The first jig 110 is spaced apart from the contact elements 200 provided in the first jig insertion grooves 112 disposed at both ends of the first jig 110 so as to form a damper composed of the liquid resin 300, 113 are formed.

The second jig 120 has a configuration in which a contact element 200 having a predetermined shape having elasticity is supported in a vertical direction and has a cross section of, for example, "⊂" A second jig fixing groove 121 for supporting the second jig fixing groove 121 to be fixed when the first contact 210 is inserted and a second jig fixing groove 122 for fixing the second jig 120 at a predetermined interval along the longitudinal direction of the second jig 120, And are installed parallel to each other.

The second jig fixing part 121 and the second jig insertion groove 122 may be formed such that when the contact element 200 is partially inserted into the first jig fixing part 121 and the contact element 200 is fixed to the second jig 110 And the contact elements 200 are aligned at regular intervals along the side surface of the second jig 120. [

The second jig fixing portion 121 and the second jig insertion groove 122 are positioned at a position orthogonal to the first jig fixing portion 111 and the first jig insertion groove 112 of the first jig 110, The contact element 200 is fixed in the vertical direction and the horizontal direction so that the contact element 200 can be aligned at a predetermined position without using a separate adhesive.

The third jig 130 is disposed so as to cover the upper portions of the first and second jigs 110 and 120 so as to cover the contact elements 200 provided in the first and second jigs 110 and 120, The upper surface of the first and second jigs 110 and 120 is formed to have the shape of a cross section, for example, And an opening 132 is formed at a lower portion of the first jig 110 to cover the first jig 110.

The inclined portion 131 has a configuration in which the third jig 130 forms a certain angle of inclination so as to form an inclined surface having a step d in the direction of the first jig 110 from the second jig 120, A surface having a slope is formed on the upper surface of the liquid resin 300 injected to fix the element 200 so as to prevent contact with the surface of the test apparatus other than the first contact 210. [

The opening 132 is provided at a lower portion which is in close contact with the first jig 110 and a part of the first jig 110 is exposed to expose the first jig fixing portion 111 and the first jig insertion groove 112 As a result, the air that has not been removed can be discharged to the outside in the process of injecting the liquid resin 300 into the first jig fixing unit 111 and the first jig insertion groove 112.

That is, the air that can not be removed in the process of injecting the liquid resin 300 into the first jig fixing unit 111 and the first jig insertion groove 112 can be discharged through the opening 132 in the side without moving upward So that the defect rate can be reduced.

The third jig 130 constitutes a step portion 132a so that the opening 132 can be precisely positioned on the first jig fixing portion 111 and the first jig insertion groove 112.

The stepped portion 132a is engaged with both sides of the spacer 113 of the first jig 110 so that the third jig 130 can be disposed at a predetermined position on the first jig 110. [

The liquid resin 300 is injected through the liquid resin injection space 140 of the jig so that the contact elements 200 are cured so as to be fixed in a state where the contact elements 200 are aligned at regular intervals, and is preferably made of silicone rubber.

Next, a manufacturing process of the micro contact array assembly 400 using the jig according to the present invention will be described.

The first jig 110 and the second jig 120 are placed in close contact with each other so as to be orthogonal to each other and the contact element 200 is inserted into the first jig insertion groove 112 and the second jig insertion groove 122 .

The first contact 210 of the contact element 200 is inserted into the second jig insertion groove 122 and the second contact 220 is inserted into the first jig insertion groove 112, 200) without a separate bonding process or alignment process.

The third jig 130 is disposed on the upper portion of the first and second jigs 110 and 120 and the end jaw portion 132a of the third jig 130 is disposed on the upper side of the first and second jigs 110 and 120. [ The third jig 130 is engaged with the spacer 113 of the first jig 110 so that the third jig 130 can be disposed at the correct position.

When the arrangement of the third jig 130 is completed, the side wall 140 is provided and the liquid resin 300 is injected into the liquid resin injection space 140.

The injected liquid resin 300 may be cured so that the outside of the contact element 200 is covered and the first jig fixing part 111 and the first jig insertion groove The air that has not been removed from the second jig 112 is discharged to the outside through the opening 132 of the third jig 130 without moving upward.

Accordingly, in the course of manufacturing the micro contact array assembly, it is possible to improve the manufacturing process by easily arranging and assembling the contact elements, and to improve the defective rate of the micro contact array assembly due to the air that can not be removed in the curing process of the liquid resin .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that

In the course of the description of the embodiments of the present invention, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, , Which may vary depending on the intentions or customs of the user, the operator, and the interpretation of such terms should be based on the contents throughout this specification.

100: jig
110: first jig
111: first jig fixing section
112: first jig insertion groove
113: spacer
120: second jig
121: second jig fixing unit
122: second jig insertion groove
130: Third jig
131:
132: opening
132a:
140: liquid resin injection space
150: side wall
200: Contact element
210: first contact
220: Second contact
300: liquid resin
400: Micro contact array assembly

Claims (7)

A jig for a micro contact array assembly,
The contact elements 200 are supported in a horizontal and vertical direction with a constant shape having elasticity and are supported by the first and second jigs and supports so as to support the contact elements 200 in the horizontal direction so that the contact elements 200 are aligned and arranged at regular intervals. A first jig 110 having a first portion 111 and a first jig insertion groove 112; And
And a second jig (120) having a second jig fixing part (121) and a second jig insertion groove (122) formed to support the contact element (200) in a vertical direction,
Wherein the first and second jigs (110, 120) are separable.
delete delete The method according to claim 1,
Wherein the first jig (110) further comprises a spacer (113) having a predetermined width so that a damper composed of the liquid resin (300) is formed at both ends thereof.
The method according to claim 1 or 4,
The jig may further include a third jig 130 provided on the first and second jigs 110 and 120 to form an injection space for injecting the liquid resin 300 to cover the contact element 200 And a jig for a micro contact array assembly.
6. The method of claim 5,
The third jig 130 includes an inclined portion 131 having an upper surface of the liquid resin 300 forming a slope at a predetermined angle so as to form an inclined surface in the direction of the first jig 110 from the second jig 120; And
Wherein the first jig fixing part (111) and the first jig insertion groove (112) of the first jig (110) are partially opened to expose the first jig fixing part (111).
6. The method of claim 5,
Wherein the liquid resin (300) is a silicone rubber.
KR1020150121250A 2015-08-27 2015-08-27 Jig for micro contact array assembly KR101736161B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150121250A KR101736161B1 (en) 2015-08-27 2015-08-27 Jig for micro contact array assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150121250A KR101736161B1 (en) 2015-08-27 2015-08-27 Jig for micro contact array assembly

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KR20170025200A KR20170025200A (en) 2017-03-08
KR101736161B1 true KR101736161B1 (en) 2017-05-16

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012058223A (en) * 2010-09-10 2012-03-22 Isao Kimoto Probe assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101496081B1 (en) 2014-01-06 2015-03-02 양희성 Method of manufacturing micro contact array structure for interposer and semiconductor device test

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012058223A (en) * 2010-09-10 2012-03-22 Isao Kimoto Probe assembly

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