KR101538937B1 - Probe pin and probe card having the same - Google Patents

Abstract

A probe pin is disclosed. A probe pin according to an embodiment of the present invention includes a pin body portion and a pin body portion. The probe pin extends to have elasticity and compensates for the generation length of scrub marks generated when the end portion contacts the circuit pattern. And a pin measurement body portion. Further, the present invention provides a probe card having the probe pin.

Description

[0001] PROBE PIN AND PROBE CARD HAVING THE SAME [0002]

The present invention relates to a probe pin, and more particularly, to a probe pin capable of minimizing the length of occurrence of a scrub mark when inspecting electrical characteristics of a circuit pattern formed on a wafer, and a probe card having the probe pin.

In general, a semiconductor device forms a circuit pattern on a semiconductor substrate such as a silicon wafer, and then performs an electrical dicing (EDS) process for examining the electrical characteristics of the circuit pattern.

As a result of the above-mentioned EDSI process, if there is no problem in electrical reliability of a circuit pattern formed on a semiconductor substrate, the semiconductor chip is organized in a chip unit and packaged into a final product.

In addition, in the above-mentioned EDIS performance, a probe card is used which is electrically connected to a circuit pattern formed on a semiconductor substrate, receives an electrical signal, and electrically connects it to an external device such as a tester.

Thus, the electrical inspection using the probe card is accomplished by contacting the contact portion with the circuit pattern of the semiconductor substrate to confirm an electrical signal transmitted from the circuit pattern of the semiconductor substrate.

Conventionally, when the contact end of the probe pin provided on such a probe card is brought into contact with the circuit pattern of the substrate, the contact end of the probe pin is pushed, and scrub marks are inevitably generated in the circuit pattern.

Particularly, when inspecting a circuit pattern with a narrow pitch, the area of the contact position where the contact end of the probe pin is contacted becomes narrow. Therefore, when the scratch mark generation length becomes long as described above, There is a problem that a measurement error is caused to take place and accurate inspection can not be performed.

A prior art document related to the present invention is Korean Patent No. 10-0825294 (filed on Apr. 21, 2008), which discloses a method of manufacturing a probe pin.

It is an object of the present invention to provide a probe pin capable of minimizing the length of occurrence of a scrub mark when inspecting electrical characteristics of a plurality of circuit patterns formed on a semiconductor substrate and a probe card having the probe pin.

It is another object of the present invention to provide a probe pin and a probe card having the same that can prevent a measurement error in electrical characteristic inspection by preventing a scratch mark from being brought into contact with a circuit pattern by minimizing the length of occurrence of a scrub mark.

It is a further object of the present invention to provide a probe card in which a plurality of contact ends formed at the end of a probe pin are formed and that, even if one of the contact ends is out of contact with the circuit pattern, And a probe pin which can prevent a measurement error in inspecting an electrical characteristic and a probe card having the probe pin.

It is still another object of the present invention to provide a method for effectively dispersing a stress generated when a contact end of a probe pin contacts a circuit pattern and dispersing a stress, And a probe card having the probe pin.

In a preferred aspect, a probe pin according to an embodiment of the present invention includes a pin body portion; And a pin measurement body portion extending from the pin body portion so as to have elasticity and compensating for the generation length of the scrub marks generated when the end portion is in contact with the circuit pattern, in different directions.

Wherein the pin body has an elongated body portion extending from one side edge of the pin body portion so as to have elasticity and a contact body portion extending from the other end of the elongated body portion so as to have elasticity and having an end contacted with the circuit pattern, And the contact position of the contact body portion is disposed between both ends of the extension body portion.

The extension body includes a first connection body vertically extending at one corner of the pin body and a first extension body extending parallel to an upper surface of the pin body at an end of the first connection body.

The contact body includes a second connection body vertically extending from the other end of the first extension body and a second connection body extending from the second connection body along one end of the first extension body, And a contact body formed at an upper end of the second elongated body and having a contact end contacting the contact position of the circuit pattern.

The contact body is protruded along the vertical direction from the end of the second extending body. The contact position is disposed at a position between the other end of the elongated body portion and the center. The contact terminals are formed at a plurality of positions along the horizontal direction in the contact body. The plurality of contact positions are disposed at a position between the other end and the center including the other end of the extended body portion.

In the first extension body, an impact absorbing hole is formed along the horizontal direction. The first elongated body divided by the shock absorbing hole is formed so that the widths of the first elongated body gradually become narrower along the center at both ends thereof.

Wherein at least one of the shock absorbing holes is formed to have a long hole shape and both ends thereof have a curvature, the shock absorbing holes are formed in the first elongated body, and one of the shock absorbing holes An auxiliary curvature formed toward the pin body portion is further formed. The first connection body and the second connection body are formed to have a certain curvature inward.

In another aspect, the present invention provides a probe card including the probe pin.

INDUSTRIAL APPLICABILITY The present invention has the effect of minimizing the generation length of scrub marks when examining electrical characteristics of a plurality of semiconductor devices formed on a wafer.

In addition, the present invention minimizes the generation length of the scrub marks so that the contact end of the probe pin does not deviate from the contact position of the circuit pattern, thereby preventing the measurement error at the time of the electrical characteristic inspection.

Further, the present invention is characterized in that a plurality of contact ends formed at the ends of the probe pins are formed, and a part of the contact ends that come out of contact with the circuit pattern comes into contact with the contact positions of the circuit pattern, It is possible to prevent an error in advance.

Further, the present invention has an effect that the stress generated when the contact end of the probe pin contacts the circuit pattern can be efficiently dispersed.

1 is a perspective view showing a preferred embodiment of the probe pin of the present invention.
2 is a front view showing the probe pin of the present invention.
3 is an enlarged view showing a plurality of shock absorption holes formed in the first extension body according to the present invention.
FIG. 4A is a view showing a simulation result of the length of a probe pin scrub mark of the related art. FIG.
FIG. 4B is a diagram showing the result of simulation of the length of the probe pin scrub marks of the present invention. FIG.
5 is a view showing a state where stresses are dispersed in the probe pin of the present invention.
6 is a view showing another example of the probe pin of the present invention.
FIG. 7 is a view showing a state where two contact terminals are formed on the contact body of the probe pin shown in FIG. 6. FIG.

Hereinafter, the configuration and operation of a probe card having probe pins will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a probe pin according to a preferred embodiment of the present invention, FIG. 2 is a front view showing a probe pin according to the present invention, and FIG. 3 is a cross- Fig.

1 and 2, the probe card of the present invention has a probe pin.

The probe pin comprises a pin body portion 1 and a pin measurement body portion 2. The pin body portion 1 and the pin body portion 2 are formed of a metal having a predetermined thickness and are formed of a single body.

The pin body portion (1)

The pin body portion 1 is formed of a metal having a predetermined thickness and is formed to have a plate shape.

The pin body portion 1 is coupled with a substrate (not shown) to support the pin measurement body portion 2. In addition, a connection body portion 110 is formed at one side of the pin body portion 1 to be electrically connected to a substrate (not shown). The pin body portion 1 is provided with a pin body portion 1 for protecting the pin body portion 1 by distributing a stress generated when an external force acts on the pin body portion 1 by contacting the pin body portion 2 with a contact pad The hole 100 may be formed. The shape and position of the hole 100 may vary, such as a quadrangular shape, an elliptical shape, or the like. At least one or more of the holes 100 may be formed, and the technical principle of protecting the pin body 1 by dispersing external force may be understood by those skilled in the art. It is omitted.

Pin measuring body part (2)

Referring to FIGS. 1, 2 and 3, the pin measurement body part 2 is extended from the pin body part 1 to have elasticity, and is formed when the end part is in contact with a circuit pattern (not shown) And serves to compensate the occurrence length of scrub marks along different directions. Here, the circuit pattern may be various test objects and includes a contact pad or the like of the wafer.

That is, the pin measurement body part 2 is composed of an elongated body part 200 and a contact body part 300. The extension body 200 includes a first connection body 210 and a first extension body 220. The first connection body 210 extends a predetermined length along the vertical direction at one corner of the upper surface portion of the pin body 1.

The first extension body 220 is extended from the end of the first connection body 210 by a predetermined length in parallel with the upper surface of the pin body 1. Here, the length of the first elongated body 220 may be substantially the same as the width of the pin body 1.

In addition, a portion of the first connection body 210 and the connection portion of the first extension body 220, particularly, the outer side and the inner side, may have a predetermined curvature. Accordingly, the stress generated in the portion where the first connection body 210 and the first elongated body 220 are connected to each other can be effectively dispersed to prevent local deformation, and the elasticity can be constant.

In addition, at least one shock absorption hole 221 is formed in the first extension body 220. The shock absorbing holes 221 are formed in parallel with each other along the horizontal direction in the first elongated body 220.

In particular, both ends of the shock absorbing hole 221 may be formed with a constant curvature 221a.

One end of the shock absorbing holes 221 located in the vicinity of the first connecting body 210 is connected to one end of the impact absorbing hole 221 located in the vicinity of the pin body 1, An auxiliary curvature 221b which is bent toward the body part 1 may be further formed.

Therefore, the curvature 221a and the auxiliary curvature 221b formed at both ends of the shock absorbing holes 221 are formed in the extended body portion 200 when the contact body portion 300 is in contact with the circuit pattern and an external force is applied, It is possible to prevent local deformation from occurring.

In addition, since the first extended body 220 divided by the shock absorbing holes 221 is formed such that the width thereof gradually narrows toward the center from both ends thereof (that is, It is possible to distribute the stress concentrating at both ends to the center so as to reduce the external force concentrated at both ends and to prevent local deformation more effectively.

Meanwhile, the contact body part 300 is formed at the other end of the elongated body part 200.

The contact body 300 includes a second connection body 310, a second extension body 320, and a contact body 330. The second connection body 310 extends a predetermined length along the vertical direction at the other end of the first extension body 220.

The second elongated body 320 is extended from the end of the second elongated body 310 by a predetermined length in parallel with the upper surface of the elongated body 220.

Here, the length of the second elongated body 320 may be less than half the length of the first elongated body 220. The contact body 330 is formed at the upper end of the second elongated body 320 and is protruded along the vertical direction at the end of the second elongated body 320, And a contact end 331 contacting the circuit pattern is formed at the end.

The contact position P at which the contact end 331 of the contact body 330 contacts the circuit pattern is located at a position between the other end of the extension body 200, .

FIG. 4A is a view showing a result of simulation of the length of a probe pin scrub mark according to the related art, and FIG. 4B is a diagram showing simulation results of the length of a probe pin scrub mark of the present invention.

Next, a comparison of scrub occurrence lengths occurring when inspecting electrical characteristics of a circuit pattern using probe pins having the above-described configuration will be described.

4A and 4B, the contact pressure for bringing the contact end 331 of the contact body 330 of each probe pin 1 into contact with the circuit pattern forms the same condition.

The scrub mark length of the conventional probe pin is measured as 11 as shown in Fig. 4A, and the scrub mark length is measured as 3 in the probe pin of the present invention shown in Fig. 4B.

That is, in the case of the probe pin 1 of the present invention, the contact position P of the contact end 331 is located between the other end and the center of the first extension body 220 due to the second extension body 320 .

In effect, when the contact end 331 of the contact body 330 contacts the circuit pattern, the other end of the first elongated body 220 is deformed by the external force applied to the circuit pattern due to the contact.

At this time, the contact end 331 of the contact body 330 may be formed with a scrub mark length as long as the length A in the first scrub mark generating direction L1.

At the same time, the second extending body 320 is also deformed so that the other end of the second extending body 320 is inclined. Here, the inclination directions of the first and second extension bodies 220 and 320 are opposite to each other. The contact edge 331 of the contact body 330 may have a scrub mark length of the length B in the second scrub mark generating direction L2.

Through this mechanism, the generation length of the scrub marks of the probe pin 1 of the present invention can be determined to be A length-B length.

That is, the pin measurement body part 2 according to the present invention is extended from the pin body part 1 to have elasticity, and compensates for the generation length of the scrub marks when they come in contact with the circuit pattern along different directions.

That is, since the direction in which the first elongated body 220 of the probe pin is tilted by the external force is opposite to the direction in which the elongated second elongated body 320 is pressed by the external force, the lengths of the scrub marks So that the length of the actual scrub marks generated when contacting the circuit pattern is reduced.

This is the same as the principle in which the second elongated body 320 disperses the stress generated in the elongated body portion 200 by an external force.

Thus, when the electrical characteristics of the circuit pattern formed on the semiconductor substrate are inspected, the scrub mark generation length can be minimized.

In addition, by minimizing the generation length of the scrub marks, it is possible to prevent the measurement error in the electrical characteristic inspection by avoiding the contact position P of the circuit pattern.

5 is a view showing a state where stresses are dispersed in the probe pin of the present invention. Referring to FIG. 5, when the contact end 331 of the contact body 330 contacts the circuit pattern, an external force is applied due to the contact.

This external force is transmitted to the pin body portion 1 through the pin measurement body portion 2.

At this time, among the pin measuring body 2, the second elongated body 320 serves to primarily disperse the stress generated by the external force.

The impact absorption holes 221 formed in the first elongated body 220 of the pin measurement body 2 serve to secondarily disperse the stress generated by the external force.

Particularly, since both inner ends of the shock absorbing holes 221 form the curvature 221a, it functions to efficiently disperse the generated stress.

In addition, since the first elongated body 220 divided by the shock absorbing holes 221 is formed so that the widths gradually become narrower toward the center from the both ends, the generated stress is dispersed to the center, It is possible to more effectively prevent the concentration of the stress.

In addition, an auxiliary curvature 221b is further formed at one end of the impact absorbing hole 221 adjacent to the pin body portion 1, and the auxiliary curvature 221b distributes the generated stress more efficiently, Can be prevented from occurring.

6 is a view showing another example of the probe pin of the present invention

Referring to FIG. 6, the contact body portion 300 according to the present invention may have a contact body 340 formed at the upper end of the second extension body 320.

That is, the contact body 300 has the second connection body 310 and the second extension body 320, and the contact body 340 is formed at the upper end of the second extension body 320.

Since the contact body 340 has a structure substantially integrated with the second elongated body 320, the second elongated body 320 in the embodiment of FIG. 3 serves to disperse the stress generated by the external force In the embodiment of FIG. 6, the second connection body 310 is provided. The role of dispersing the stress caused by the external force of the second connection body 310 is the same as the role of dispersing the stress generated by the external force of the second extension body 320 in the embodiment of FIG. 3 A detailed description thereof will be omitted.

FIG. 7 is a view showing a state where a plurality of contact terminals are formed on a contact body of the probe pin shown in FIG.

Referring to FIG. 7, the contact body 300 according to the present invention may have a contact body 340 formed at the upper end of the second extension body 320 and two or more contact ends 341, 342.

That is, the contact stages 341 and 342 are formed in two, and the two contact stages 341 and 342 are formed at intervals at the upper end of the contact body 340.

One of the positions of the two contact stages 341 and 342 may be the other end position of the first extension body 220 and the other may be located between the other end and the center of the first extension body 220.

Thus, even if one of the two contact ends 341 and 342 is out of contact with the circuit pattern, the remaining one is brought into contact with the contact position of the circuit pattern, thereby preventing measurement errors in advance. In addition, by selectively using one of the two contact stages 342 and 342, the generation position and length of the scrub mark can be selectively determined.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1: pin body part 100: hole
110: connecting body part 2: pin measuring body part
200: extension body part 210: first connection body
220: first extension body 221: shock absorption hole
221a: curvature 221b: auxiliary curvature
300: contact body portion 310: second connection body
320: second extension body 330, 340: contact body
331, 341, 342:

Claims (12)

delete delete Pin body portion; And
And a pin measurement body portion extending from the pin body portion so as to have elasticity,
The pin measuring body portion
And a contact body portion extending from the other end of the extended body portion so as to have elasticity and having an end contacting the circuit pattern,
Wherein a contact position of the contact body portion is disposed between both ends of the extending body portion,
The extension body portion
A first connecting body vertically extending from one corner of the pin body,
And a first elongated body extending parallel to an upper surface of the pin body at an end of the first connecting body,
The contact body portion
A second connecting body vertically extending from the other end of the first extension body,
A second elongated body extending horizontally from the second connecting body along one end of the first elongated body in parallel with the first elongated body,
And a contact body formed on an upper end of the second elongated body and having a contact end contacting the contact position of the circuit pattern. 4. The connector according to claim 3,
And protruding from an end of the second elongated body along a vertical direction. The probe pin according to claim 3, wherein a contact position of the contact body part is disposed at a position between the other end of the extension body part and the center. The probe pin according to claim 3, wherein the contact terminal is formed at a plurality of positions along the horizontal direction in the contact body. 7. A method as claimed in claim 6,
And the other end of the elongated body portion is disposed at a position between the other end and the center. [5] The apparatus of claim 3,
And a shock absorbing hole is formed along the horizontal direction. 9. The shock absorber according to claim 8, wherein the first elongated body divided by the shock-
Wherein the width of the probe pin is gradually narrowed along the center at both ends thereof. 9. The method of claim 8,
Wherein the shock absorbing hole is formed to have a long hole shape and both ends have a curvature,
Wherein at least one or more shock absorbing holes are formed in the first elongated body,
Wherein an auxiliary curvature formed toward the pin body portion is further formed at one end of the impact absorbing hole adjacent to the pin body portion of the impact absorbing hole. The method according to claim 6,
Wherein the first connection body and the second connection body are formed to have a predetermined curvature inward. A probe card comprising the probe pin according to any one of claims 3 to 11.

Images