TWM514004U - Integrated circuit inspection device and inspection equipment - Google Patents
Integrated circuit inspection device and inspection equipment Download PDFInfo
- Publication number
- TWM514004U TWM514004U TW104212280U TW104212280U TWM514004U TW M514004 U TWM514004 U TW M514004U TW 104212280 U TW104212280 U TW 104212280U TW 104212280 U TW104212280 U TW 104212280U TW M514004 U TWM514004 U TW M514004U
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- elastic
- moving block
- detecting device
- lower base
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Description
本創作係有關一種檢測裝置,尤指一種用於積體電路的檢測裝置及檢測設備。The present invention relates to a detecting device, and more particularly to a detecting device and a detecting device for an integrated circuit.
隨著科技的發展,許多資訊電子產品是朝向輕薄短小的方向來進行設計,但所具備的功能卻只能增加而不能減少,在如此的情況下,使得其電子電路走向積體化,製作成可執行多種功能的積體電路(Integrated Circuit,IC),由於積體電路內的結構繁複,線寬窄小,製作上具有一定的困難度,且所需的製作成本高,相對的品質及良率的管控也愈加重要。其中各積體電路在出廠前,必須經過測試機台的檢測,而測試機台主要包含有一測試座以及一測試電路板,利用測試座供積體電路放置定位後,積體電路再透過測試座與測試電路板電性連接,而進行檢測。With the development of technology, many information electronic products are designed in a light, short, and short direction, but the functions they have can only be increased but not reduced. Under such circumstances, the electronic circuits are integrated and made into Integrated circuit (IC) that can perform a variety of functions. Due to the complicated structure in the integrated circuit, the line width is narrow, the manufacturing has certain difficulty, and the required manufacturing cost is high, and the relative quality and yield are required. Control is also becoming more important. Before the factory is assembled, it must pass the test of the test machine. The test machine mainly includes a test socket and a test circuit board. After the test socket is used to place the integrated circuit, the integrated circuit passes through the test socket. It is electrically connected to the test board for detection.
習知用於積體電路的檢測裝置,主要包括一底座及與底座樞接的一蓋體,底座上設有一凹槽,並於凹槽內設有一導電結構,而蓋體底面設有一抵壓單元,其中,導電結構設有配合待測積體電路固定的一定位部,並於定位部中設有對應待測積體電路底部錫球位置的複數個透孔,透孔用以套接固定待測積體電路之錫球,將待測積體電路定位於定位部上,定位部下方設有導通待測積體電路與測試電路板的一導電部,待測積體電路藉由抵壓單元的抵壓以與導電部導接,藉由導電部中的導通件與測試電路板導接,而進行量測。The detecting device for the integrated circuit mainly includes a base and a cover pivotally connected to the base. The base is provided with a recess, and a conductive structure is disposed in the recess, and a bottom surface of the cover is provided with a pressing force. a unit, wherein the conductive structure is provided with a positioning portion fixed to the integrated circuit to be tested, and a plurality of through holes corresponding to the position of the bottom solder ball of the integrated circuit to be tested are disposed in the positioning portion, and the through hole is used for socket fixing The solder ball of the integrated circuit to be tested is positioned on the positioning portion of the integrated circuit to be tested, and a conductive portion for conducting the integrated circuit to be tested and the test circuit board is disposed under the positioning portion, and the integrated circuit to be tested is pressed by The pressing of the unit is conducted in contact with the conductive portion, and is measured by guiding the conductive member in the conductive portion to the test circuit board.
然而,習知用於積體電路的檢測裝置,雖然具有檢測的效果,但仍然存在有抵壓單元對積體電路下壓過程中,亦令導電部的探針產生折斷的情況。另定位部一般為了利於積體電路能夠輕易置入,兩者之間的配合皆相當的寬鬆,因而常導致積體電路和探針對位不準確的情況,而亟待加以改善者。However, although the detecting device for the integrated circuit has a detection effect, there is a case where the pressing unit is pressed against the integrated circuit, and the probe of the conductive portion is broken. In addition, the positioning part is generally convenient for the integrated circuit to be easily inserted, and the cooperation between the two is relatively loose, which often leads to inaccurate alignment of the integrated circuit and the probe, and needs to be improved.
本創作之一目的,在於提供一種積體電路的檢測裝置及檢測設備,其係可達成快速定位和精準固持效果。One of the aims of the present invention is to provide a detection device and a detection device for an integrated circuit, which can achieve rapid positioning and accurate retention.
為了達成上述之目的,本創作係提供一種積體電路的檢測裝置,包括一承載座、一夾掣定位機構及一蓋板,該承載座安裝有一探針台;該夾掣定位機構包含一下基座、一彈性體、一上基座及一對彈性夾臂,該下基座對應該探針台配置,該彈性體被彈性夾掣在該探針台和該下基座之間,該上基座疊接在該下基座上,並於該上基座設有一晶片容槽,該對彈性夾臂可移動的配置在該晶片容槽內;該蓋板固定在該承載座,該蓋板在對應該晶片容槽的位置設有一開口,並在該對彈性夾臂和該蓋板之間設有令該對彈性夾臂能夠對所述積體電路夾掣固定的一滑動結構。In order to achieve the above object, the present invention provides a detecting device for an integrated circuit, comprising a carrier, a clamping positioning mechanism and a cover plate, the carrier is mounted with a probe station; the clamping positioning mechanism comprises a lower base a seat, an elastic body, an upper base and a pair of elastic clamping arms, the lower base being disposed corresponding to the probe station, the elastic body being elastically clamped between the probe table and the lower base, the upper portion The base is superposed on the lower base, and the upper base is provided with a wafer receiving slot, and the pair of elastic clamping arms are movably disposed in the wafer receiving groove; the cover is fixed to the carrying base, the cover The plate is provided with an opening at a position corresponding to the groove of the wafer, and a sliding structure is provided between the pair of elastic clamping arms and the cover plate to enable the pair of elastic clamping arms to be fixed to the integrated circuit.
為了達成上述之目的,本創作係提供一種積體電路的檢測設備,包括一承載座、複數夾掣定位機構及一蓋板,該承載座安裝有複數探針台;每一該夾掣定位機構分別對應於每一該探針台裝設,每一該夾掣定位機構包含一下基座、一彈性體、一上基座及一對彈性夾臂,該下基座對應該探針台配置,該彈性體被彈性夾掣在該探針台和該下基座之間,該上基座疊接在該下基座上,並於該上基座設有一晶片容槽,該對彈性夾臂可移動的配置在該晶片容槽內;該蓋板固定在該承載座,該蓋板在對應各該晶片容槽的位置分別設有一開口, 並在各該彈性夾臂和該蓋板之間設有令各該彈性夾臂能夠分別對所述各積體電路夾掣固定的一滑動結構。In order to achieve the above object, the present invention provides an apparatus for detecting an integrated circuit, comprising a carrier, a plurality of clamping positioning mechanisms and a cover plate, the carrier is mounted with a plurality of probe stations; each of the clamping positioning mechanisms Corresponding to each of the probe station assemblies, each of the clip positioning mechanisms includes a lower base, an elastic body, an upper base and a pair of elastic clamp arms, the lower base corresponding to the probe station configuration, The elastic body is elastically clamped between the probe station and the lower base, the upper base is superposed on the lower base, and a wafer receptacle is disposed on the upper base, and the pair of elastic clamp arms Removably disposed in the chip pocket; the cover is fixed to the carrier, and the cover is respectively provided with an opening at a position corresponding to each of the chip pockets. And a sliding structure is disposed between each of the elastic clamping arms and the cover plate so that each of the elastic clamping arms can be respectively fixed to the integrated circuit.
本創作還具有以下功效,利用滑動結構設置在蓋板和彈性夾臂之間,在向下壓掣上基座時可同時驅動各彈性夾臂進行對積體電路的夾掣固定,更增加使用的方便性。藉由T型移動塊的V形槽設置,可有效地對積體電路的對角進行精確的定位。The creation also has the following effects: the sliding structure is arranged between the cover plate and the elastic clamping arm, and when the base is pressed down, the elastic clamping arms can be simultaneously driven to clamp the integrated circuit, and the use is further increased. Convenience. By setting the V-shaped groove of the T-shaped moving block, the diagonal of the integrated circuit can be accurately positioned.
1‧‧‧檢測裝置1‧‧‧Detection device
10‧‧‧承載座10‧‧‧Hosting
11‧‧‧探針台11‧‧‧Probe station
12‧‧‧彈性探針12‧‧‧Elastic probe
13‧‧‧螺孔13‧‧‧ screw holes
20‧‧‧夾掣定位機構20‧‧‧ pinch positioning mechanism
21‧‧‧下基座21‧‧‧Lower base
211‧‧‧矩形板211‧‧‧ Rectangular board
212‧‧‧角柱212‧‧‧ corner column
213‧‧‧穿孔213‧‧‧Perforation
214‧‧‧導引孔214‧‧‧ Guide hole
22‧‧‧彈性體22‧‧‧ Elastomers
23‧‧‧上基座23‧‧‧Upper base
231‧‧‧晶片容槽231‧‧‧ wafer pocket
232‧‧‧導引槽232‧‧‧ guiding slot
233‧‧‧定位柱233‧‧‧Positioning column
24‧‧‧彈性夾臂24‧‧‧Flexible clamp arm
241‧‧‧T型移動塊241‧‧‧T-type moving block
242‧‧‧V形槽242‧‧‧V-groove
243‧‧‧插孔243‧‧‧ jack
244‧‧‧第一斜面244‧‧‧First slope
245‧‧‧彈性頂針245‧‧‧elastic thimble
30‧‧‧蓋板30‧‧‧ Cover
31‧‧‧開口31‧‧‧ openings
32‧‧‧凸柱32‧‧‧Bump
321‧‧‧第二斜面321‧‧‧second slope
33‧‧‧通孔33‧‧‧through hole
A‧‧‧滑動結構A‧‧‧Sliding structure
8‧‧‧積體電路8‧‧‧Integrated circuit
1A‧‧‧檢測設備1A‧‧‧Testing equipment
100‧‧‧承載座100‧‧‧ bearing seat
300‧‧‧蓋板300‧‧‧ cover
圖1係本創作積體電路的檢測裝置分解圖。Fig. 1 is an exploded view of the detecting device of the integrated circuit of the present invention.
圖2係本創作積體電路的檢測裝置另一視角分解圖。Fig. 2 is another exploded perspective view of the detecting device of the integrated circuit of the present invention.
圖3係本創作積體電路的檢測裝置組合外觀圖。Fig. 3 is a view showing the combined appearance of the detecting device of the integrated circuit of the present invention.
圖4係本創作的檢測裝置應用於積體電路的俯視圖。Fig. 4 is a plan view showing the detection device of the present invention applied to an integrated circuit.
圖5係圖4中的5-5剖視圖。Figure 5 is a cross-sectional view taken along line 5-5 of Figure 4.
圖6係圖4中的6-6剖視圖。Figure 6 is a cross-sectional view taken along line 6-6 of Figure 4.
圖7係本創作的夾掣定位機構被壓下後的剖視圖。Fig. 7 is a cross-sectional view showing the clip positioning mechanism of the present invention being depressed.
圖8係本創作的夾掣定位機構被壓下後另一方向的剖視圖。Figure 8 is a cross-sectional view showing the other direction in which the clip positioning mechanism of the present invention is depressed.
圖9係本創作積體電路的檢測設備組合外觀圖。Fig. 9 is a perspective view showing the combination of the detecting devices of the integrated circuit of the present invention.
有關本創作之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.
請參閱圖1至圖3所示,本創作提供一種積體電路的檢測裝置,此積體電路的檢測裝置1主要包括一承載座10、一夾掣定位機構20及一蓋板30。Referring to FIG. 1 to FIG. 3 , the present invention provides an apparatus for detecting an integrated circuit. The detecting device 1 of the integrated circuit mainly includes a carrier 10 , a clamping mechanism 20 and a cover 30 .
承載座10大致為一中空矩形體,在其內部安裝有一探針台11,並於探針台11佈設有複數支彈性探針12,另在承載座10頂面的角端分別設有一螺孔13。The carrier 10 is substantially a hollow rectangular body, and a probe station 11 is mounted therein, and a plurality of elastic probes 12 are disposed on the probe station 11, and a screw hole is respectively disposed at a corner end of the top surface of the carrier 10. 13.
夾掣定位機構20對應承載座10的探針台11安裝,且夾掣定位機構20主要包括一下基座21、一彈性體22、一上基座23及一對彈性夾臂24,其中下基座21包含一矩形板211及從矩形板211的四端角落處分別向上延伸有一角柱212,彈性體22可為一螺旋彈簧,其是套設在前述探針台11的外周圍,且彈性體22的兩端分別彈性抵接在探針台11和矩形板211之間;另在矩形板211的中間區域開設有對應前述彈性探針12套接的複數穿孔213,並於各穿孔213的外圍區域設有複數導引孔214。The clamping positioning mechanism 20 is mounted corresponding to the probe station 11 of the carrier 10, and the clamping positioning mechanism 20 mainly comprises a lower base 21, an elastic body 22, an upper base 23 and a pair of elastic clamping arms 24, wherein the lower base The seat 21 includes a rectangular plate 211 and a corner post 212 extending upward from the four end corners of the rectangular plate 211. The elastic body 22 can be a coil spring which is sleeved on the outer periphery of the probe base 11 and has an elastic body. The two ends of the hole 22 are respectively elastically abutted between the probe table 11 and the rectangular plate 211; and a plurality of through holes 213 corresponding to the elastic probes 12 are sleeved in the middle portion of the rectangular plate 211, and are respectively located at the periphery of each of the through holes 213. The area is provided with a plurality of guiding holes 214.
上基座23對應下基座21的矩形板211疊接,上基座23大致亦呈一矩形塊,在中間區域開設有一晶片容槽231,另於上基座23底面的其中一對角位置開設有連通前述晶片容槽231的一導引槽232,並在導引槽232的兩側分別連接有複數定位柱233,各定位柱233是分別對應於前述的導引孔214穿接。The upper base 23 is overlapped with the rectangular plate 211 of the lower base 21, and the upper base 23 is also substantially a rectangular block. A chip receptacle 231 is defined in the middle portion, and a pair of angular positions on the bottom surface of the upper base 23 A guiding slot 232 is formed, and a plurality of positioning posts 233 are respectively connected to the two sides of the guiding slot 232. The positioning posts 233 are respectively connected to the guiding holes 214.
每一彈性夾臂24主要包含一T型移動塊241及一彈性頂針245,各T型移動塊241分別安裝在前述導引槽232內且可於導引槽222內可操作性移動,在T型移動塊241的底端形成有一V形槽242,頂端則設有一插孔243,彈性頂針242的一端插接前述插孔243,並被彈性夾掣在T型移動塊241和角柱212之間。Each of the elastic clamping arms 24 mainly includes a T-shaped moving block 241 and an elastic thimble 245. Each of the T-shaped moving blocks 241 is respectively mounted in the guiding groove 232 and operably movable in the guiding slot 222. The bottom end of the movable block 241 is formed with a V-shaped groove 242, and the top end is provided with a receiving hole 243. One end of the elastic thimble 242 is inserted into the insertion hole 243, and is elastically clamped between the T-shaped moving block 241 and the corner post 212. .
蓋板30為一矩形板體,對應於前述承載座10連接,在蓋板30的中間區域開設有供前述上基座23暴露出的一矩形開口31。另在T型移動塊241的兩側翼分別形成有一第一斜面244,在蓋板30的開口31對應角端分別延伸有 一對凸柱32,此凸柱32是對應於前述T型移動塊241的兩側翼設置,並在凸柱32對應於前述第一斜面244的位置設有一第二斜面321,其中第二斜面321和第一斜面244的傾斜方向相反,且彼此相互滑接接觸,並構成本創作的一滑動結構A(如圖6所示)。又,在蓋板30的各角端位置分別開設有一通孔33,各通孔33是對應於前述承載座10的螺孔13配置,以供螺絲等螺固元件穿設螺固。The cover plate 30 is a rectangular plate body corresponding to the connection of the aforementioned carrier 10, and a rectangular opening 31 for exposing the upper base 23 is opened in the middle portion of the cover plate 30. In addition, a first inclined surface 244 is formed on each of the two wings of the T-shaped moving block 241, and the opening 31 of the cover 30 extends at a corresponding angular end. a pair of protrusions 32, which are disposed corresponding to the two side wings of the T-shaped moving block 241, and a second inclined surface 321 is disposed at a position corresponding to the first inclined surface 244 of the protrusion 32, wherein the second slope 321 The first bevel 244 is opposite to the oblique direction and is in sliding contact with each other, and constitutes a sliding structure A of the present invention (as shown in FIG. 6). Further, a through hole 33 is defined in each corner end of the cover plate 30, and each of the through holes 33 is disposed corresponding to the screw hole 13 of the carrier 10 for screwing a screw member such as a screw.
請參閱圖4至圖6所示,本創作的檢測裝置1是可以被應用在一積體電路8的檢測,操作時首先將各彈性探針12電性連接於一檢測機(圖未示出),次將積體電路8置入前述上基座23的晶片容槽231內,由於積體電路8的外形大致與晶片容槽231的外形相近,因此積體電路8的角端將對應形成在晶片容槽231的角端位置,此時積體電路8並未與各彈性探針12電性導接。Referring to FIG. 4 to FIG. 6 , the detecting device 1 of the present invention can be applied to the detection of an integrated circuit 8 . In the operation, each elastic probe 12 is first electrically connected to a detecting machine (not shown). The integrated circuit 8 is placed in the wafer pocket 231 of the upper pedestal 23, and since the outer shape of the integrated circuit 8 is substantially similar to the outer shape of the wafer pocket 231, the corner ends of the integrated circuit 8 are formed correspondingly. At the corner end position of the wafer pocket 231, the integrated circuit 8 is not electrically connected to each of the elastic probes 12 at this time.
請續參閱圖7及圖8所示,當對上基座23向下壓掣時,各T型移動塊241受到彈性頂針245推抵,同時第一斜面244沿著第二斜面321滑移,將令各T型移動塊241以其V形槽242對應於積體電路8的一組對角進行夾掣定位;繼之,在上基座23向下沉入的過程中,將令積體電路8與各彈性探針12電性連接,如此據以得知積體電路8的各項性能參數。Referring to FIG. 7 and FIG. 8 , when the upper base 23 is pressed downward, each T-shaped moving block 241 is pushed by the elastic thimble 245 while the first inclined surface 244 slides along the second inclined surface 321 . Each of the T-shaped moving blocks 241 will be positioned with its V-shaped groove 242 corresponding to a set of diagonals of the integrated circuit 8; then, in the process of the upper base 23 sinking downward, the integrated circuit 8 will be The elastic probes 12 are electrically connected to each other, so that various performance parameters of the integrated circuit 8 are known.
請參閱圖9所示,本創作進一步提供一種積體電路的檢測設備,此檢測設備1A主要包括一承載座100、複數夾掣定位機構20及一蓋板300,承載座100安裝有複數探針台11,每一探針台11佈設有複數支彈性探針12(請參閱圖1所示)。每一夾掣定位機構20對應於每一探針台11配設,由於各夾掣定位機構20與前述實施例的夾掣定位機構20相同,因此不再一一重複贅述。蓋板300固定在承載座100上方,蓋板300在對應各晶片容槽231的位置分別設有一開口31(請參閱圖1所示),並在各彈性夾臂24和蓋板300之間設有令各彈性夾 臂24能夠對所述各積體電路8夾掣固定的一滑動結構(請參閱圖8所示),如此可同時對多數積體電路8進行檢測,進而提高檢測效能。Referring to FIG. 9 , the present invention further provides an apparatus for detecting an integrated circuit. The detecting device 1A mainly includes a carrier 100 , a plurality of clamping and positioning mechanisms 20 , and a cover 300 . The carrier 100 is mounted with a plurality of probes. The stage 11, each probe station 11 is provided with a plurality of elastic probes 12 (see Fig. 1). Each of the clamping and positioning mechanisms 20 is disposed corresponding to each of the probe stations 11. Since each of the clamping and positioning mechanisms 20 is the same as the clamping and positioning mechanism 20 of the foregoing embodiment, the description thereof will not be repeated. The cover plate 300 is fixed above the bearing base 100. The cover plate 300 is respectively provided with an opening 31 (refer to FIG. 1) at a position corresponding to each of the chip receiving slots 231, and is disposed between each elastic clamping arm 24 and the cover 300. Have elastic clips The arm 24 can clamp a fixed sliding structure to the integrated circuit 8 (see FIG. 8), so that the majority of the integrated circuit 8 can be detected at the same time, thereby improving the detection performance.
綜上所述,本創作之積體電路的檢測裝置及檢測設備,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。In summary, the detection device and testing equipment of the integrated circuit of the present invention can achieve the intended purpose of use, and solve the lack of conventional knowledge, and because of the novelty and progress, fully comply with the requirements of the new patent application, To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator.
1‧‧‧檢測裝置1‧‧‧Detection device
10‧‧‧承載座10‧‧‧Hosting
20‧‧‧夾掣定位機構20‧‧‧ pinch positioning mechanism
21‧‧‧下基座21‧‧‧Lower base
212‧‧‧角柱212‧‧‧ corner column
213‧‧‧穿孔213‧‧‧Perforation
214‧‧‧導引孔214‧‧‧ Guide hole
22‧‧‧彈性體22‧‧‧ Elastomers
23‧‧‧上基座23‧‧‧Upper base
231‧‧‧晶片容槽231‧‧‧ wafer pocket
232‧‧‧導引槽232‧‧‧ guiding slot
233‧‧‧定位柱233‧‧‧Positioning column
24‧‧‧彈性夾臂24‧‧‧Flexible clamp arm
241‧‧‧T型移動塊241‧‧‧T-type moving block
242‧‧‧V形槽242‧‧‧V-groove
243‧‧‧插孔243‧‧‧ jack
244‧‧‧第一斜面244‧‧‧First slope
245‧‧‧彈性頂針245‧‧‧elastic thimble
30‧‧‧蓋板30‧‧‧ Cover
31‧‧‧開口31‧‧‧ openings
32‧‧‧凸柱32‧‧‧Bump
321‧‧‧第二斜面321‧‧‧second slope
33‧‧‧通孔33‧‧‧through hole
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104212280U TWM514004U (en) | 2015-07-30 | 2015-07-30 | Integrated circuit inspection device and inspection equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104212280U TWM514004U (en) | 2015-07-30 | 2015-07-30 | Integrated circuit inspection device and inspection equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM514004U true TWM514004U (en) | 2015-12-11 |
Family
ID=55408971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104212280U TWM514004U (en) | 2015-07-30 | 2015-07-30 | Integrated circuit inspection device and inspection equipment |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM514004U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI579567B (en) * | 2015-12-31 | 2017-04-21 | 鴻勁科技股份有限公司 | Test stand and its application test equipment |
TWI644110B (en) * | 2016-11-29 | 2018-12-11 | 李諾工業股份有限公司 | Camera module test device |
TWI644103B (en) * | 2017-10-03 | 2018-12-11 | 吳俊杰 | Buffer position limiting device |
TWI745775B (en) * | 2019-11-01 | 2021-11-11 | 美商第一檢測有限公司 | Chip testing device and a chip testing system |
-
2015
- 2015-07-30 TW TW104212280U patent/TWM514004U/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI579567B (en) * | 2015-12-31 | 2017-04-21 | 鴻勁科技股份有限公司 | Test stand and its application test equipment |
TWI644110B (en) * | 2016-11-29 | 2018-12-11 | 李諾工業股份有限公司 | Camera module test device |
TWI644103B (en) * | 2017-10-03 | 2018-12-11 | 吳俊杰 | Buffer position limiting device |
TWI745775B (en) * | 2019-11-01 | 2021-11-11 | 美商第一檢測有限公司 | Chip testing device and a chip testing system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9726720B2 (en) | Integrated circuit test device and integrated circuit test equipment | |
CN103430031B (en) | Apparatus for inspecting semiconductor device | |
TWM514004U (en) | Integrated circuit inspection device and inspection equipment | |
KR20080024227A (en) | Integrated circuit test socket | |
JP2019527841A (en) | Inspection device | |
KR101246105B1 (en) | Test socket for semiconductor package | |
TWI550275B (en) | Floating positioning device for loading tray | |
KR102038968B1 (en) | Insert, base and test socket for use in testing semiconductor device | |
JP5372706B2 (en) | Probe needle guide member, probe card having the same, and semiconductor device testing method using the same | |
KR101299715B1 (en) | Inspection socket using bidirectional buckling pin | |
TWI424173B (en) | Micro compressive stress test stand | |
KR102126753B1 (en) | device for test pin in which three plungers slide independently by a single coil spring, and the slide operation is controlled using the rail | |
KR101212945B1 (en) | Inspection socket having vertical type probe | |
TWM627329U (en) | Inspection structure of electronic device | |
KR101380280B1 (en) | A test device | |
KR100985499B1 (en) | A socket for Kelvin testing | |
TWM350157U (en) | Electrical connector | |
WO2018068627A1 (en) | Apparatus for chip testing and programming, and manufacturing method therefor | |
US10184978B2 (en) | Probe card and method for producing a probe card | |
KR20120060299A (en) | Test socket | |
KR102663052B1 (en) | Test socket | |
JP4276163B2 (en) | IC socket | |
US10101361B2 (en) | Method for testing semiconductor devices | |
JPS63302377A (en) | Apparatus for inspecting circuit board | |
TWI720769B (en) | Test equipment and movably connected mechanism thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |