TWI644103B - Buffer position limiting device - Google Patents

Abstract

A bufferable limiting device adapted to limit the position of a wafer on a test socket, comprising a chip stop unit and a wafer buffer unit. The chip limiting unit includes a limiting portion surrounding a first receiving space to limit a position at which the wafer is placed on the test socket. The buffer unit includes a buffer portion disposed between the test socket and the chip limiting unit, wherein the buffer portion has elasticity, and the buffer portion can buffer the wafer when the wafer is placed in the first receiving space. The impact of the wafer on the limit portion.

Description

Bufferable limit device

The present invention relates to a limiting device, and more particularly to a limiting device that limits the position of a wafer to a test socket and can buffer the placement force of the wafer.

After the Wafer is produced by the semiconductor factory, it is cut into a plurality of chips and packaged. Generally, the package is subjected to a process such as drawing and potting to form a wafer having a plurality of pins (electrodes).

The colloid used in the potting process is in a liquid state, but there is still a chance that the colloid will be detached or broken when the colloid hits the lead. Therefore, electrical testing is performed after the semiconductor packaging process to select a good wafer.

Referring to FIG. 1 , a wafer testing apparatus includes a test socket 11 , a wafer holder 12 detachably disposed on the test socket 11 . The wafer holder 12 is provided with a guiding edge 13 whose inner edge has a shape conforming to the outer edge of the wafer to connect the pins of the wafer with the test electrode of the test socket 11 to test the wafer. Is the electrical property good?

Among them, the wafer is moved by the robot arm, and each time the wafer is taken, the position of the wafer is extremely small, and the position is inconsistent. The guiding edge 13 is in a beveled manner so that when the robot arm places the wafer in the middle of the wafer holder 12, the guiding wafer falls into the correct position. Therefore, the guiding edge 13 on the wafer holder 12 often suffers from the wafer. Impact, it will cause wear, Even collapses, causing the wafer holder 12 and the leading edge 13 to be replaced from time to time.

Since the semiconductor process is based on the quantity, the loss is caused by each stoppage. Therefore, how to improve the service life of the wafer holder 12 and the leading edge 13 and avoid the loss caused by the shutdown is an urgent need of the technicians.

In view of the above, it is an object of the present invention to provide a bufferable limiting device suitable for limiting the position of a wafer on a test socket, comprising a wafer stop unit and a wafer buffer unit.

The chip limiting unit includes a limiting portion surrounding a first receiving space to limit a position at which the wafer is placed on the test socket.

The buffer unit includes a buffer portion disposed between the test socket and the chip limiting unit, and the buffer portion has elasticity. When the wafer is placed in the first receiving space, the buffer portion can buffer the wafer pair. The impact of the limit.

Another technical means of the present invention is the above-mentioned storable limiting device, further comprising an outer frame fixing unit, comprising a fixing portion disposed between the test seat and the buffer portion.

Another technical means of the present invention is that the outer frame fixing unit further includes a second accommodating space defined by the fixing portion, and the limiting portion is disposed in the second accommodating space, and the buffer portion is disposed. Between the limiting portion and the fixing portion.

A further technical means of the present invention is that the above is slow The rushing limit device further includes an isolation unit including an external isolation layer connected to the fixing portion for isolating the buffer portion from the outside.

Another technical means of the present invention is that the isolation unit further includes an internal isolation layer connected to the fixing portion for isolating the buffer portion from the test seat.

Another technical means of the present invention is that the surface of the limiting portion has a buffering lead angle to introduce the wafer into the first receiving space, and direct the impact force of the wafer on the limiting portion to the buffer. unit.

According to still another aspect of the present invention, the above-described stopper portion is constituted by a plurality of stopper members connected to the buffer portion.

According to still another aspect of the present invention, the material of the limiting portion is a rigid material.

Another technical means of the present invention is that the material of the buffer portion is a polymer material.

According to still another aspect of the present invention, the buffer portion is made of an elastic metal.

The beneficial effect of the present invention is that the buffer portion is an elastic material, and the tilting arrangement of the buffer lead angle is arranged. When the wafer is placed in the first receiving space, the buffer portion can buffer the force of the wafer impacting the limiting portion. The limiting portion can reduce the wear or collapse caused by the impact force, and effectively extend the life of the limiting portion, and the elastic force of the buffer portion can rebound the limiting portion back to the original position. The wafer is placed in the correct position and the test stand can be electrically tested on the wafer.

11‧‧‧ test seat

12‧‧‧ Wafer holder

13‧‧‧ Leading edge

A‧‧‧chip

B‧‧‧ test seat

31‧‧‧ Chip Limit Unit

311‧‧‧First accommodation space

312‧‧‧Limited

313‧‧‧buffer lead angle

314‧‧‧掏孔

315‧‧‧Limited components

32‧‧‧ wafer buffer unit

321‧‧‧ buffer

33‧‧‧Frame fixing unit

331‧‧‧ Fixed Department

332‧‧‧Second accommodating space

333‧‧‧ hole

34‧‧‧Isolation unit

341‧‧‧External insulation

342‧‧‧Internal insulation

1 is a schematic view of a device for describing a wafer testing device; FIG. 2 is a schematic view of a device for illustrating a first preferred embodiment of a buffer capable limiting device of the present invention; FIG. 3 is a schematic view of the device A chip limiting unit of a preferred embodiment; FIG. 4 is a schematic view of a wafer buffer unit of the first preferred embodiment; FIG. 5 is a schematic view of the apparatus, illustrating the first preferred embodiment. Figure 6 is a schematic view of a device, illustrating a second preferred embodiment of the bufferable limit device of the present invention; and Figure 7 is a schematic view of a device for illustrating a third of the limitable devices of the present invention. 8 is a schematic view of a device, illustrating a fourth preferred embodiment of the bufferable limit device of the present invention; and FIG. 9 is a schematic view of a device for illustrating a fifth of the limitable devices of the present invention. 10 is a cross-sectional view of a device, illustrating a sixth preferred embodiment of the buffer-capable device of the present invention; FIG. 11 is a cross-sectional view of a device illustrating one of the buffer-capable devices of the present invention. Seven better Example.

Relevant patent applications and technologies related to the present invention The details of the seven preferred embodiments, which are described below in conjunction with the reference drawings, will be apparent. It should be noted that before the detailed description, similar elements are denoted by the same reference numerals.

Referring to Figures 2, 3, 4 and 5, a first preferred embodiment of a buffer-capable limiting device is adapted to limit the position of a wafer A on a test socket B. The first preferred embodiment The example includes a chip stop unit 31, a wafer buffer unit 32, and an outer frame fixing unit 33.

The lower surface of the wafer A has a plurality of pins, and the upper surface of the test block B has a plurality of test electrodes, and the plurality of pins of the chip A and the plurality of test electrodes of the test block B are in contact with each other for transmitting potential, and the test is further tested. Whether the electrical properties of the wafer A are good. Since the technical means of wafer testing have been known to the relevant industry and widely used in the semiconductor packaging and testing industry, it will not be described in detail herein.

The chip limiting unit 31 includes a limiting portion 312 defining a first accommodating space 311. The surface of the limiting portion 312 forms a buffering lead 313. The inner edge of the limiting portion 312 and the wafer A The outer edge shape is matched so that the wafer A can be placed in the accommodating space 311, and the position of the wafer A in the test socket B is restricted, so that the plurality of pins of the wafer A are aligned with the plurality of test sockets B. Test the electrode.

The material of the limiting portion 312 is a rigid material, and the rigid material is a material with high hardness, and is not easily deformed or worn by external force. Preferably, the rigid material is selected from ceramic materials, titanium materials, and diamond materials. , corundum material, tantalum carbide material, tungsten carbide material, titanium carbide material, boron carbide material, boron nitride material, quartz material, boron material, High hardness material such as barium diboride material or titanium diboride material. The loss caused by the wafer A striking the limiting portion 312 can be reduced.

The early limit portion 312 is made of a metal material and is easily worn or collapsed by impact or friction. Therefore, the inventors use a ceramic material having a higher hardness as the material of the stopper portion 312 to improve the friction resistance and extend the The limit portion 312 has a service life. In practical implementation, the limiting portion 312 can use other high-hardness steel materials, such as titanium metal or titanium-plated structures, and should not be limited by the examples of the preferred embodiment.

The buffer unit 32 includes a buffer portion 321 disposed between the test socket B and the wafer limiting unit 31. The buffer portion 321 is made of a flexible polymer material. When the space 311 is accommodated, the buffer portion 321 can buffer the impact of the wafer A on the limiting portion 312, and the wafer A can be moved to the correct position by the elastic force.

The buffer lead angle 313 is a beveled bevel disposed on the inner edge of the upper surface of the limiting portion 312 for guiding the wafer A into the first receiving space, and further buffering the wafer A to the limiting portion 312. The impact. When the wafer A is introduced into the first accommodating space 311, the buffering lead angle 313 can guide the impact force of the wafer A on the limiting portion 312 to the buffer portion 321 and recover by the elastic force of the buffer portion 321 . The position of the limiting portion 312.

The frame fixing unit 33 includes a fixing portion 331 disposed between the testing block B and the buffer portion 321 , and a second receiving space 332 defined by the fixing portion 331 . The fixing portion 331 is made of a metal material, and the fixing portion 331 is provided with a plurality of holes 333, and the snail can be used. The wire fixes the fixing portion 331 to the test seat B.

The limiting portion 312 is disposed in the second accommodating space 332. The buffer portion 321 is disposed between the limiting portion 312 and the fixing portion 331. The buffer portion 321 can buffer the wafer A to the limiting portion 312. The impact portion 331 abuts against the buffer portion 321 to fix the position of the limiting portion 312.

The buffer portion 321 is formed by first fixing the position of the stopper portion 312 and the fixing portion 331 by a mold, and pouring the liquid polymer material between the stopper portion 312 and the fixing portion 331. The second accommodating space 332 forms the buffer portion 321 when the polymer material is solidified, wherein the polymer material is selected from the group consisting of rubber, silicone rubber, AB glue, and the like.

The movement of the wafer A is usually carried out by the robot arm, and the position of the wafer A is not the same when the robot arm grips or sucks the wafer A. Therefore, when the robot arm places the wafer A in the first accommodating space 311, The wafer A has a chance to touch the buffer lead angle 313, and the buffer portion 321 has an elastic property, and the position of the limiting portion 312 will be offset with the position of the wafer A, thereby effectively buffering the wafer. The impact of the limiting portion 312. Then, the elastic force of the buffer portion 321 rebounds the limiting portion 312 and the wafer A located in the limiting portion 312 to the correct position, so that the plurality of pins of the wafer A and the plurality of test electrodes of the test block B are mutually contact.

Each of the corners of the first accommodating space 311 is provided with a boring hole 314 for the operator to pull out the wafer A stuck in the first accommodating space 311. Although the size of each wafer A can be made uniform by the current glue filling technology, the appearance of each wafer A is slightly different. different.

Because the limiting portion 312 uses a hard material, when the outer edge of the wafer is slightly larger than the first accommodating space 311, and the robot hardly places the wafer A into the first accommodating space 311, the wafer A will In the first accommodating space 311, the robot arm cannot take out the wafer A, and the worker can use the plurality of boring holes 314 to pull out the wafer A that has been inserted into the first accommodating space 311.

Referring to FIG. 6 is a second preferred embodiment of a bufferable limiting device according to the present invention. The second preferred embodiment is substantially the same as the first preferred embodiment, and the same is not described in detail herein. The second preferred embodiment is not provided with the outer frame fixing unit, and the buffer portion 321 is directly connected to the test socket B.

Preferably, the buffering portion 321 has been framed by the limiting portion 312 at the time of filling, and a colloid having a fixed size is formed, so that the buffering portion 321 can be received in the test slot of the test seat B. The buffer portion 321 is disposed between the test seat B and the limiting portion 312.

In the actual implementation, the test seat B can be provided with a limiting structure for fixing the position of the buffering portion 321 , or the buffering portion 321 can be locked on the test socket B by using a screw, because the elastic polymer is fixed. The technical means of materials are widely used in commercially available products, and the fixed technology is not the focus of this case, and will not be described in detail here.

The inner edge of the test seat B of the second preferred embodiment directly supports the outer edge of the buffer portion 321 , so that the position of the limiting portion 312 can be fixed, and the buffer portion 321 can be provided with elastic force for buffering. The wafer A impact on the limiting portion 312 can further bounce the limiting portion 312 back to the original position.

FIG. 7 is a third preferred embodiment of a buffer-capable device according to the present invention. The third preferred embodiment is substantially the same as the first preferred embodiment, and the same is not described in detail herein. The difference is that the limiting portion 312 is constituted by a plurality of limiting members 315 connected to the buffer portion 321 .

Generally, the appearance of the wafer A is square, and the limiting member 315 of the third preferred embodiment is provided with four for respectively supporting the four sides of the wafer A. Preferably, the plurality of limiting members 315 are spaced apart from each other, and the spacing space can be used as the pupil of the first preferred embodiment. In practice, the plurality of limiting members 315 can be close to each other, and should not be limited thereto.

Preferably, the plurality of limiting members 315 are respectively connected to the buffering portion 321 , and the buffering portion 321 can respectively provide the elastic force of the plurality of limiting members 315 to buffer the wafer A when the first receiving space 311 is placed. The impact force of the plurality of limiting members 315 can also bounce the wafer A back to the correct position.

The inventor has to be emphasized that the limiting portion 312 of the third preferred embodiment is composed of a plurality of limiting members 315, and each of the limiting members 315 is respectively connected to the buffering portion 321 . Therefore, the buffering portion 321 The elastic force of each of the limiting members 315 is respectively provided, so that the shape of the first accommodating space 311 can be changed and is no longer fixed.

For example, when the outer edge of the wafer A is slightly larger than the first accommodating space 311, the limit formed by the plurality of limiting members 315 is formed. The portion 312 will be outwardly extended by the elastic force of the buffer portion 321 respectively. Not only when the wafer A is placed in the first accommodating space 311, but also the plurality of limiting members 315 are not broken, and the worker can directly take out the wafer A.

FIG. 8 is a fourth preferred embodiment of a buffer-capable limiting device according to the present invention. The fourth preferred embodiment is substantially the same as the first preferred embodiment, and the same is not described in detail herein. The difference is that the buffer portion 321 is composed of a plurality of elastic colloids.

Preferably, the limiting portion 312 and the fixing portion 331 are respectively provided with a plurality of colloidal fixing grooves for fixing the buffer portion 321 formed by the plurality of elastic colloids.

When the buffer portion 321 is changed from a single piece of colloid to a plurality of small pieces of colloid, the elastic force provided will become relatively small, so that a buffering force can be provided, so that the wafer A is placed in the first receiving space. The impact force generated at 311 is absorbed by the buffer portion 321.

FIG. 9 is a fifth preferred embodiment of a buffer-capable limiting device according to the present invention. The fifth preferred embodiment is substantially the same as the third preferred embodiment, and the same is not described in detail herein. The difference is that the buffer portion 321 is made of an elastic metal.

The elastic metal can be made into a variety of structures. The fifth preferred embodiment uses a plurality of springs. Actually, other elastic metal structures such as springs and reeds can be used, and the slider can be used to produce a sliding effect. Due to the buffer structure of the elastic metal, it has been known to the industry and is widely used in commercially available products, and will not be described in detail herein.

Although the buffer portion 321 structure composed of an elastic metal is used More complicated, but the durability of the elastic metal is higher than that of the elastic polymer material, which can increase the number of wafer A tests and effectively improve the service life of the limit device.

The inventors have emphasized that the elastic portion can be adjusted by using the buffer portion 321 made of an elastic metal. Generally, the elastic metal can be adjusted by using a stop screw so that the buffer portion 321 has sufficient elasticity to spring the wafer A to the correct one. The position also has sufficient cushioning force for the robot arm to take out the wafer A placed in the first accommodating space 311. Of course, the actual implementation is not limited thereto.

FIG. 10 is a sixth preferred embodiment of a buffer-capable limiting device according to the present invention. The sixth preferred embodiment is substantially the same as the fifth preferred embodiment, and the same is not described in detail herein. The difference is that the bufferable limiting device further comprises an isolation unit 34.

The isolation unit 34 includes an outer isolation layer 341 connected to the fixing portion 331. The external isolation layer 341 is used to isolate the buffer portion 321 from the outside. Preferably, the external isolation layer 341 is made of an aluminum sheet. Actually, other spacer materials may be used, and should not be limited thereto.

When the buffer portion 321 buffers the impact force of the wafer A on the limiting portion 312 every time, the metal may generate dust by friction, and the outer isolation layer 341 can block dust. In addition, the buffer portion 321 using the elastic metal must also prevent foreign matter from entering the movable space of the metal to avoid interference with the elastic force of the elastic metal, and the outer spacer layer 341 can further prevent the external force from damaging the buffer portion 321 . The isolation unit 34 is not limited to the buffer portion 321 which is provided with an elastic metal, and may be used for a polymer material. Buffer portion 321.

Referring to FIG. 11, a seventh preferred embodiment of a buffer-capable limiting device of the present invention is substantially the same as the sixth preferred embodiment, and the same is not described in detail herein. The difference is that the isolation unit 34 further includes an internal isolation layer 342 connected to the fixing portion 331.

The inner isolation layer 342 is used to isolate the buffer portion 321 from the test socket B. The inner isolation layer 342 is made of an aluminum sheet. Actually, other spacer materials can be used, and should not be limited thereto. The inner isolation layer 342 can isolate the buffer portion 321 from the test socket B to prevent foreign matter from falling into the test socket B, thereby affecting the electrical test of the wafer A.

It can be seen from the above description that the bufferable limit device of the present invention does have the following effects:

1. Extending the life: the limiting portion 312 uses a rigid rigid material, which can reduce the wear caused by the wafer A against the limiting portion 312, and effectively extend the service life of the limiting device.

2. Buffering impact: when the robot arm places the wafer A in the first accommodating space 311, the wafer A has a chance to touch the buffering lead angle 313, and the buffering portion 321 has elastic characteristics. The position of the bit portion 312 can be offset to offset the impact of the wafer A on the stop portion.

Third, the positioning is correct: the elastic buffer portion 321 can limit the offset position The position 312 bounces back to the correct position so that the position of the wafer A accommodated in the first accommodating space 311 is correct, so that the test stand B can electrically test the wafer A.

In summary, the present invention utilizes the buffer portion 321 to have an elastic property, and can buffer the impact force of the limiting portion 312 when the wafer A is placed in the first receiving space 311, and the buffer portion 321 is reused. The elastic force moves the wafer A to the correct position so that the test stand B can perform electrical test on the wafer A, so that the object of the present invention can be achieved.

However, the above is only the seven preferred embodiments of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes made by the scope of the invention and the description of the invention are Modifications are still within the scope of the invention.

Claims (10)

A bufferable limiting device adapted to limit a position of a wafer on a test socket, comprising: a chip limiting unit, comprising a limiting portion surrounding a first receiving space to limit the wafer Positioned in the test socket; and a wafer buffer unit, comprising a buffer portion disposed between the test socket and the chip limiting unit, the buffer portion having elasticity, when the wafer is placed in the first receiving portion In the space, the buffer portion can buffer the impact of the wafer on the limiting portion. The snubber-restricted device of claim 1, further comprising an outer frame fixing unit, comprising a fixing portion disposed between the test seat and the buffer portion. The accommodating position limiting device of claim 2, wherein the outer frame fixing unit further comprises a second accommodating space defined by the fixing portion, the limiting portion is disposed at the second accommodating portion In the space, the buffer portion is disposed between the limiting portion and the fixing portion. The bufferable limiting device according to claim 3, further comprising an isolation unit, comprising an external isolation layer connected to the fixing portion for isolating the buffer portion from the outside. The bufferable limit device of claim 4, wherein the isolation unit further comprises an internal isolation layer connected to the fixing portion for isolating the buffer portion from the test seat. The bufferable limit device according to claim 1, wherein the surface of the limiting portion has a buffer lead angle to introduce the wafer The first accommodating space guides the impact force of the wafer on the limiting portion to the buffer portion. The damperable position limiting device according to claim 1, wherein the limiting portion is formed by a plurality of limiting members connected to the buffer portion. The cushioning device according to claim 1, wherein the material of the limiting portion is a rigid material. The bufferable limit device according to claim 1, wherein the buffer portion is made of a polymer material. The cushioning device according to claim 1, wherein the buffer portion is made of an elastic metal.