TWM469491U - Inspection device with dual-axis positioning mechanism - Google Patents

Description

Detection device with biaxial positioning mechanism

The present invention relates to a detecting device having a biaxial positioning mechanism, and more particularly to a detecting device suitable for detecting a wafer that has not been packaged by a probe card.

Conventional semiconductor testing devices have fewer positioning mechanisms specifically for the positioning of the wafer to be tested, especially in the horizontal direction, and at most only the wafer crimping mechanism for ensuring good contact between the wafer and the test seat in the vertical axis. Only. In general, the weight of the grain after cutting is quite light, and it is easy to cause an offset when it is subjected to vacuum pick and place. However, once the grain is horizontally offset, the die will not be accurately placed in the predetermined position, which will greatly reduce the yield of the test, and more seriously may cause damage to the die or the detecting device.

In particular, as the semiconductor process continues to evolve, it is accompanied by the fact that the volume and weight of the wafer are becoming lighter and thinner, so that in addition to the higher requirements for the transfer device, the post-transfer positioning Accuracy requirements are also rising. However, the most common wafer transfer mechanism at present is vacuum suction, which has the advantages of simple mechanism, low cost, and less damage to the wafer, but the accuracy of the placement position after transfer is difficult to be completely accurate. The main reason is because the crystals that have not been packaged are quite light, any contact, even friction, Static electricity is likely to cause displacement of the wafer, and the vacuum suction head, although the vacuum attraction is cut off after the placement of the crystal grains, may cause grain deflection during the detachment of the vacuum suction head from the crystal grains. However, once the grain is offset, it will result in the probe not being able to contact the correct contact exactly, which will affect the yield of the test or cause the damage of the die, and the damage of the detection device.

It can be seen that a positioning mechanism that can assist the horizontal positioning of the wafer in the carrier is an urgent requirement in the industry.

The main purpose of the present invention is to provide a detection device having a biaxial positioning mechanism capable of positioning and fixing a wafer to a wafer carrier by means of a horizontal horizontal axis positioning push rod and a horizontal vertical axis positioning push rod. In order to improve the yield and accuracy of the testing equipment.

In order to achieve the above object, a detection device having a biaxial positioning mechanism mainly comprises: a probe card, a wafer carrier, a lifting platform, a horizontal horizontal axis positioning push rod, and a horizontal vertical axis positioning push Rod. Wherein, the wafer carrier is disposed under the probe card, and a wafer bearing groove is dug on the upper surface of the wafer carrier; the lifting platform is disposed under the probe card, and the wafer carrier is assembled on the lifting platform; the horizontal horizontal axis The positioning push rod is disposed on one side of the wafer carrier and corresponds to a horizontal horizontal axis of the center position of the wafer bearing groove; and the horizontal vertical axis positioning push rod is disposed on one side of the wafer carrier and corresponds to the wafer bearing The horizontal longitudinal axis of the center of the groove. Wherein, when a wafer is placed in the wafer carrying groove, the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod respectively protrude and push the wafer to position the wafer carrying groove.

Preferably, the wafer carrier of the present invention may include one load. a table, a horizontal axis guide groove, and a longitudinal axis guide groove, and the horizontal axis guide groove and the vertical axis guide groove are connected to the mounting table, and are respectively located in the horizontal axis and the longitudinal axis of the mounting table; After the wafer carrying groove, the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod respectively pass through the horizontal axis guide groove and the vertical axis guide groove to push the wafer to be positioned on the mounting table. Accordingly, the design of the horizontal axis, the vertical axis guide groove and the mounting table enables the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod to be fully pushed against the side end surface of the wafer, thereby effectively avoiding the cause Improper application or improper placement can result in a more severe wafer offset.

Furthermore, there is a suction in the wafer carrier of the creation. The lead channel is connected to an external vacuum source, and the mounting table is provided with at least one attracting hole which is connected to the attracting channel. In short, the creation stage of the creation can be designed with a suction hole, and the vacuum suction force is used to adsorb the wafer, which facilitates the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod positioning chip during the positioning process, and It is also possible to avoid the wafer being shifted again during the lifting movement process or during the test.

In addition, the creation may further include a first pneumatic cylinder, and a The second pneumatic cylinder, and the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod are respectively arranged on the driving heads of one of the first pneumatic cylinder and the second pneumatic cylinder. According to this, the creation can use the pneumatic cylinder to drive the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod. In addition, a spring may be disposed in the driving head of the present invention, and one end of the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod may be respectively pushed against the spring and assembled on the driving head. According to this, the creation can be used to position the horizontal axis by the spring, and the level The vertical axis positioning push rod is provided with a buffering function, which can effectively prevent the damage from being damaged by the rigid collision.

Moreover, the creation may further include a first displacement adjusting device, And a second displacement adjusting device, wherein the first displacement adjusting device can include a first guiding block, a first guiding seat, and a first screw, and the first pneumatic cylinder can be assembled on the first guiding block, the first The guiding block can be coupled to the first guiding seat, and the first screw can be screwed to the first guiding block and the first guiding seat, and the first screw will drive the first guiding block to slide relative to the first guiding seat; The second movement adjustment device includes a second guide block, a second guide seat, and a second screw, and the second pneumatic cylinder is assembled to the second guide block, and the second guide block is coupled to the second guide. And the second screw is screwed to the second guide block and the second guide. When the second screw rotates, the second guide block is driven to slide relative to the second guide. In addition, the first guide and the second guide of the present invention may respectively include two guiding rods, and the first guiding block and the second guiding block are respectively coupled to the first guiding seat and the second guiding seat by the guiding rods. Accordingly, the creation can adjust the position of the first and second pneumatic cylinders through the displacement adjusting device according to different test specifications, different test equipments, different objects to be tested, or other actual needs, to adjust the horizontal horizontal axis positioning correspondingly. The rod and the horizontal longitudinal axis position the push rod.

Moreover, the lifting platform of the creation can be opened with two recesses, and the first A displacement adjusting device and a second displacement adjusting device can be correspondingly disposed in the two recesses, thereby making the whole mechanism more compact, thereby reducing the occupied volume, and thus shortening the horizontal horizontal axis positioning push rod and the horizontal longitudinal axis positioning Push the feed stroke to speed up the positioning. In addition, the probe card of the present invention may include a plurality of probes and may have a through slot, each probe One end can be fixed to the probe card, and the other end can protrude from the through slot; and the creation can include a camera disposed above the probe card and corresponding to the through slot for monitoring the wafer inspection. Happening.

[this creation]

2‧‧‧ probe card

21‧‧‧ probe

22‧‧‧through slot

3‧‧‧ wafer carrier

30‧‧‧ upper surface

31‧‧‧ wafer carrier

311‧‧‧mounting table

312‧‧‧ Horizontal axis guide groove

313‧‧‧ vertical axis guide groove

314‧‧‧Attraction hole

32‧‧‧Attraction channel

4‧‧‧ Lifting table

41‧‧‧ recess

50‧‧‧First air cylinder

51‧‧‧Horizontal horizontal axis positioning push rod

52, 62‧‧‧ drive head

53‧‧‧First displacement adjustment device

531‧‧‧First guide block

532‧‧‧First guide

533‧‧‧First screw

534, 634 ‧ ‧ guides

60‧‧‧Second air cylinder

61‧‧‧Horizontal vertical axis positioning push rod

63‧‧‧Second shift adjustment device

631‧‧‧Second guide block

632‧‧‧Second guide

633‧‧‧Second screw

7‧‧‧ camera

C‧‧‧ wafer

S‧‧ ‧ spring

Vs‧‧‧ external vacuum source

1 is a perspective view of a preferred embodiment of the present invention.

2 is a perspective view of a preferred embodiment of the wafer carrier of the present invention.

3 is an exploded view of a preferred embodiment of the first displacement adjusting device of the present invention.

Before the present invention has been described in detail in the present embodiment, it is to be noted that in the following description, similar elements will be denoted by the same reference numerals.

Please refer to FIG. 1 , FIG. 2 , and FIG. 3 . FIG. 1 is a perspective view of a preferred embodiment of the present invention. FIG. 2 is a perspective view of a preferred embodiment of the wafer carrier of the present invention, and FIG. 3 is the first embodiment of the present invention. An exploded view of a preferred embodiment of a displacement adjustment device. As shown in the figure, the detecting device of the embodiment mainly comprises a probe card 2, a wafer carrier 3, a lifting platform 4, a horizontal horizontal axis positioning push rod 51, a horizontal vertical axis positioning push rod 61, and a The first pneumatic cylinder 50, a second pneumatic cylinder 60, a first displacement adjusting device 53, a second shift adjusting device 63, and a camera 7.

First, the probe card 2 includes a plurality of probes 21 and defines a through slot 22, and one end of each probe 21 is fixed to the probe card 3, and the other end protrudes through the through slot 22. Among them, the plurality of probes 21 are used to contact the wafer C for the purpose of detection. In addition, above the probe card 2 and corresponding to the through slot 22 A camera 7 is provided for monitoring the progress of the wafer C detection.

In addition, the wafer carrier 3 is disposed under the probe card 2, and A wafer carrying groove 31 is dug on the upper surface 30 of the wafer carrier 3. The wafer carrying groove 31 includes a mounting table 311, a horizontal axis guiding groove 312, and a vertical axis guiding groove 313. The horizontal axis guiding groove 312 and the vertical axis guiding groove 313 are connected to the mounting table 311, and are respectively located. The horizontal axis and the longitudinal axis of the mounting table 311 form an L-shaped groove, as shown in FIG.

Furthermore, a suction channel 32 is defined in the wafer carrier 3 . The system is connected to an external vacuum source Vs, and the mounting table 311 is provided with a plurality of suction holes 314 which are connected to the suction passage 32. In other words, in this embodiment, the wafer C can be adsorbed by the vacuum suction of the suction hole 314 on the mounting table 311, which can assist in positioning the wafer C during the positioning process, and can avoid avoiding the wafer C again during the lifting movement process or the testing process. Offset.

As shown in FIG. 1 , the lifting platform 4 is disposed under the probe card 2, The wafer carrier 3 is assembled on the lifting platform 4. However, the lifting platform 4 can be raised to bring the wafer C on the wafer carrier 3 close to the probe card 2 and contact the plurality of probes 21 for the purpose of testing; and after the detection is completed, the wafer C is loaded for testing. And loading the wafer C to be tested. Two recesses 41 are formed on two sides of the lifting platform 4 .

In addition, as shown in the figure, the horizontal horizontal axis positioning push rod 51 is set Placed on one side of the wafer carrier 3 and corresponding to the horizontal horizontal axis of the center position of the wafer bearing groove 31; the horizontal vertical axis positioning pusher 61 is disposed on one side of the wafer carrier 3 and corresponds to the wafer bearing groove The horizontal position of the center of the 31 is on the horizontal axis. Further, in the present embodiment, the horizontal horizontal axis is determined The position pusher 51 and the horizontal vertical axis positioning pusher 61 are respectively disposed on the drive heads 52 and 62 of the first pneumatic cylinder 50 and the second pneumatic cylinder 60. Further, a spring S is disposed in the driving heads 52, 62, and one end of the horizontal horizontal axis positioning push rod 51 and the horizontal vertical axis positioning push rod 61 are respectively pushed against the spring S and assembled on the driving heads 52, 62. Accordingly, in the present embodiment, the horizontal horizontal axis positioning push rod 51 and the horizontal vertical axis positioning push rod 61 can be buffered by the spring S, thereby effectively preventing the damage from being damaged by the rigid collision.

In addition, as shown in FIG. 1 and FIG. 3, the first pneumatic cylinder 50 is The second pneumatic cylinders 60 are respectively disposed on the first displacement adjusting device 53 and the second displacement adjusting device 63. The first displacement adjusting device 53 includes a first guiding block 531, a first guiding base 532, and a first screw 533, and the first guiding base 532 includes two guiding rods 534. Furthermore, the first pneumatic cylinder 50 is assembled to the first guiding block 531, and the first guiding block 5311 is coupled to the first guiding base 532 by the guiding rod 534, and the first screw 533 is screwed to the first guiding block 531. And the first guide 532. When the first screw 533 is rotated, the first guide block 531 will be driven to slide relative to the first guide 532.

Similarly, the second shift adjusting device 63 includes a second guiding block 631, a second guide 632, and a second screw 633, and the second guide 632 includes a second guide 634. The second pneumatic cylinder 60 is assembled to the second guiding block 631, and the second guiding block 631 is coupled to the second guiding seat 632 by the two guiding rods 634, and the second screw 633 is screwed to the second guiding guide 633. Block 631 and second guide 632. When the second screw 633 is rotated, the second guide block 631 is driven to slide relative to the second guide 632.

Accordingly, the embodiment can be provided by the first displacement adjusting device 53. And the second shift adjusting device 63 adjusts the first pneumatic cylinder 50 and the second air pressure The position of the cylinder 60 is adjusted correspondingly to the horizontal horizontal axis positioning push rod 51 and the horizontal vertical axis positioning push rod 61. In addition, in the present embodiment, the first displacement adjusting device 53 and the second displacement adjusting device 63 are correspondingly disposed in the two recesses 41 on both sides of the lifting platform 4, thereby making the whole mechanism more compact and reducing the occupied volume. Therefore, the feed stroke of the horizontal horizontal axis positioning push rod 51 and the horizontal vertical axis positioning push rod 61 can be shortened to speed up the positioning speed.

The operation mode of the detecting device of this embodiment is as follows, when After a wafer C is placed on the wafer carrying groove 31, the horizontal horizontal axis positioning push rod 51 and the horizontal vertical axis positioning push rod 61 respectively pass through the horizontal axis guide groove 312 and the vertical axis guide groove 313 to push the wafer C to be positioned. It is placed on the mounting table 311. In this embodiment, the horizontal horizontal axis positioning push rod 51 and the horizontal vertical axis positioning push rod 61 are secondarily pushed, that is, the horizontal horizontal axis positioning push rod 51, and the horizontal level. After the vertical axis positioning pusher 61 is extended to push against the wafer C once, it is retracted and extended again to push against the wafer C to ensure that the wafer C is indeed positioned in the wafer carrying groove 31. When the wafer C is positioned, the lift table 4 is then raised to cause the wafer C to contact the probe 21 of the probe card 2 for testing. After the test is completed, the lifting platform 4 is then lowered to measure the loading of the wafer C and the wafer to be tested.

The above-described embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

2‧‧‧ probe card

21‧‧‧ probe

22‧‧‧through slot

3‧‧‧ wafer carrier

30‧‧‧ upper surface

31‧‧‧ wafer carrier

4‧‧‧ Lifting table

41‧‧‧ recess

50‧‧‧First air cylinder

51‧‧‧Horizontal horizontal axis positioning push rod

52, 62‧‧‧ drive head

53‧‧‧First displacement adjustment device

531‧‧‧First guide block

532‧‧‧First guide

533‧‧‧First screw

534, 634 ‧ ‧ guides

60‧‧‧Second air cylinder

61‧‧‧Horizontal vertical axis positioning push rod

63‧‧‧Second shift adjustment device

631‧‧‧Second guide block

632‧‧‧Second guide

633‧‧‧Second screw

7‧‧‧ camera

C‧‧‧ wafer

Claims (10)

A detecting device having a biaxial positioning mechanism, comprising: a probe card; a wafer carrier disposed under the probe card, a wafer bearing groove is dug on the upper surface of the wafer carrier; and a lifting platform The wafer carrier is disposed under the probe card, and the wafer carrier is disposed on the lifting platform; a horizontal horizontal axis positioning pusher is disposed on one side of the wafer carrier and corresponds to the wafer carrier a horizontal axis on the horizontal axis; and a horizontal longitudinal axis positioning pusher disposed on one side of the wafer carrier and corresponding to a horizontal longitudinal axis of the center of the wafer carrier; wherein, when a wafer After being placed in the wafer carrying groove, the horizontal horizontal axis positioning push rod and the horizontal vertical axis positioning push rod respectively protrude and push against the wafer to be positioned in the wafer carrying groove. The detecting device with a biaxial positioning mechanism according to the first aspect of the invention, wherein the wafer carrying groove comprises a mounting table, a horizontal axis guiding groove, and a longitudinal axis guiding groove, and the horizontal axis guiding groove, and The longitudinal axis guiding channel is connected to the mounting table, and is respectively located in a horizontal transverse axis and a horizontal longitudinal axis of the mounting table; when the wafer is placed in the wafer carrying groove, the horizontal horizontal axis positioning push rod, and the A horizontal longitudinal axis positioning pusher passes through the horizontal axis guide groove and the vertical axis guide groove to push the wafer to be positioned on the mounting table. Inspection with a biaxial positioning mechanism as described in item 2 of the patent application scope The measuring device, wherein the wafer carrier has a suction channel connected to an external vacuum source; the mounting table is provided with at least one suction hole connected to the suction channel. The detecting device with a biaxial positioning mechanism according to claim 1, further comprising a first pneumatic cylinder and a second pneumatic cylinder, the horizontal horizontal axis positioning push rod, and the horizontal vertical axis positioning push The rods are respectively disposed on the driving heads of the first pneumatic cylinder and the second pneumatic cylinder. The detecting device with a biaxial positioning mechanism according to claim 4, wherein a spring is disposed in the driving head, and the horizontal horizontal axis positioning push rod and one end of the horizontal vertical axis positioning push rod are respectively pushed. The spring is received and assembled on the driving head. The detecting device with a biaxial positioning mechanism according to claim 4, further comprising a first displacement adjusting device and a second shift adjusting device, wherein the first displacement adjusting device comprises a first guiding block, a first guide, and a first screw, the first pneumatic cylinder is disposed on the first guide block, the first guide block is coupled to the first guide, and the first screw is screwed to the first guide The first guiding block and the first guiding seat, the first screw rotating to drive the first guiding block to slide relative to the first guiding block; the second movement adjusting device comprises a second guiding block, a first a second guide, and a second screw, the second pneumatic cylinder is disposed on the second guide block, the second guide block is coupled to the second guide, and the second screw is screwed to the second The guiding block and the second guiding seat, when the second screw rotates, will drive the second guiding block to slide relative to the second guiding seat. The detecting device with a biaxial positioning mechanism according to claim 6, wherein the first guide and the second guide respectively comprise The two guiding rods, the first guiding block and the second guiding block are respectively coupled to the first guiding seat and the second guiding seat by the guiding rod. The detecting device with a biaxial positioning mechanism according to the sixth aspect of the invention, wherein the lifting platform has two recesses, and the first displacement adjusting device and the second displacement adjusting device are correspondingly disposed in the two recesses. . The detection device with a biaxial positioning mechanism according to the first aspect of the invention, wherein the probe card comprises a plurality of probes, and a through slot is defined, and one end of each probe is fixed to the probe card. The other end protrudes from the through slot. The detecting device with a biaxial positioning mechanism according to claim 9, further comprising a camera disposed above the probe card and corresponding to the through slot.