TW200825211A - Electroplating apparatus, electroplating method and plating jig - Google Patents
Electroplating apparatus, electroplating method and plating jig Download PDFInfo
- Publication number
- TW200825211A TW200825211A TW096140697A TW96140697A TW200825211A TW 200825211 A TW200825211 A TW 200825211A TW 096140697 A TW096140697 A TW 096140697A TW 96140697 A TW96140697 A TW 96140697A TW 200825211 A TW200825211 A TW 200825211A
- Authority
- TW
- Taiwan
- Prior art keywords
- anode plate
- cathode
- anode
- plating
- electronic component
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 64
- 238000007747 plating Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims description 11
- 238000005868 electrolysis reaction Methods 0.000 claims description 15
- 239000013589 supplement Substances 0.000 claims description 14
- 230000005611 electricity Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 210000004392 genitalia Anatomy 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006309608A JP4820736B2 (ja) | 2006-11-15 | 2006-11-15 | 電解めっき装置及び電解めっき方法並びにめっき治具 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200825211A true TW200825211A (en) | 2008-06-16 |
Family
ID=39506168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096140697A TW200825211A (en) | 2006-11-15 | 2007-10-30 | Electroplating apparatus, electroplating method and plating jig |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4820736B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20080044162A (enrdf_load_stackoverflow) |
| CN (1) | CN101240443B (enrdf_load_stackoverflow) |
| TW (1) | TW200825211A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI385605B (zh) * | 2009-12-30 | 2013-02-11 | Univ Ishou | Applicable to the fuzzy control teaching of the card plating device |
| TWI730206B (zh) * | 2016-12-14 | 2021-06-11 | 日商荏原製作所股份有限公司 | 電解鍍覆裝置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4164435B2 (ja) * | 2003-11-05 | 2008-10-15 | 新光電気工業株式会社 | 電子部品用めっき治具及び電解めっき装置 |
| CN102337577B (zh) * | 2010-07-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 电镀装置 |
| CN102080253B (zh) * | 2010-12-23 | 2012-07-25 | 北大方正集团有限公司 | 电镀夹具及印制线路板电镀系统 |
| CN102776551B (zh) * | 2012-07-04 | 2015-11-25 | 中国电子科技集团公司第四十一研究所 | 一种硬质微带电路电镀夹具 |
| JP6193005B2 (ja) * | 2013-06-14 | 2017-09-06 | Ｋｙｂ株式会社 | 保持装置及びそれを備えた高速めっき装置 |
| CN103436946A (zh) * | 2013-08-01 | 2013-12-11 | 黄海 | 一种自动化电镀系统 |
| CN104711656B (zh) * | 2015-03-23 | 2017-06-06 | 河南理工大学 | 一种用于电镀平面薄片件的挂具 |
| TW201720969A (zh) * | 2015-12-14 | 2017-06-16 | 台灣先進系統股份有限公司 | 可調控式不溶性陽極板及其應用於銅柱電鍍之方法 |
| CN107904632B (zh) * | 2017-04-24 | 2020-05-12 | 张碧海 | 一种电镀设备 |
| CN107287626A (zh) * | 2017-08-11 | 2017-10-24 | 杭州帝洛森科技有限公司 | 一种防短路的阳极板及应用其的电解装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6890413B2 (en) * | 2002-12-11 | 2005-05-10 | International Business Machines Corporation | Method and apparatus for controlling local current to achieve uniform plating thickness |
| JP4164435B2 (ja) * | 2003-11-05 | 2008-10-15 | 新光電気工業株式会社 | 電子部品用めっき治具及び電解めっき装置 |
| JP4164443B2 (ja) * | 2003-11-26 | 2008-10-15 | 新光電気工業株式会社 | 電子部品用めっき治具及び電解めっき装置 |
| JP2006193806A (ja) * | 2005-01-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | めっき電極、めっき治具およびそれを用いた電子部品のめっき方法 |
-
2006
- 2006-11-15 JP JP2006309608A patent/JP4820736B2/ja active Active
-
2007
- 2007-10-30 TW TW096140697A patent/TW200825211A/zh unknown
- 2007-11-06 KR KR1020070112485A patent/KR20080044162A/ko not_active Withdrawn
- 2007-11-15 CN CN2007101872661A patent/CN101240443B/zh active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI385605B (zh) * | 2009-12-30 | 2013-02-11 | Univ Ishou | Applicable to the fuzzy control teaching of the card plating device |
| TWI730206B (zh) * | 2016-12-14 | 2021-06-11 | 日商荏原製作所股份有限公司 | 電解鍍覆裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4820736B2 (ja) | 2011-11-24 |
| CN101240443B (zh) | 2011-02-09 |
| CN101240443A (zh) | 2008-08-13 |
| KR20080044162A (ko) | 2008-05-20 |
| JP2008121097A (ja) | 2008-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200825211A (en) | Electroplating apparatus, electroplating method and plating jig | |
| BR102015032415B1 (pt) | aparelho para formar um filme metálico e método para formar um filme metálico | |
| CN101713094A (zh) | 印刷电路板电镀夹具 | |
| KR920014955A (ko) | 음극이 기체 확산 전극임을 개선점으로 하는, 수성 전해질 용액에 금속을 보충시키기 위한 보충 전해질 셀 | |
| JP2009024242A (ja) | 金属パイプのめっき装置および金属パイプのめっき方法 | |
| JP2013142169A (ja) | 電気めっき用保持具およびこの保持具を用いた電気めっき装置 | |
| US11926912B2 (en) | Electrode assembly for electrochemical processes | |
| US5135633A (en) | Electrode arrangement for electrolytic processes | |
| JP6746185B2 (ja) | 半導体ウェハめっき用治具 | |
| KR20190056460A (ko) | 인쇄회로기판의 도금편차 개선을 위한 지그장치 | |
| CN107761158A (zh) | 一种电镀设备及电镀方法 | |
| KR101153275B1 (ko) | 전자 부품용 도금 지그 및 전해 도금 장치 | |
| JP2002030494A (ja) | 耐腐食性導電部材 | |
| KR101415680B1 (ko) | 전해도금장치용 차폐박스 및 전해도금장치용 전극판 | |
| KR102250050B1 (ko) | 전기도금용 지그 및 이를 이용한 도금물 제조 방법 | |
| US10301735B2 (en) | Method of forming metal coating | |
| JP7316908B2 (ja) | アノード組立体 | |
| CN205603711U (zh) | 适用于滤波器电镀用阳极处理装置 | |
| KR101420865B1 (ko) | 금속 도금장치 | |
| TW544475B (en) | Device and method for continuous electroplating treatment | |
| TW201231735A (en) | Electroplate system and method for using the same | |
| KR101266129B1 (ko) | 기판의 전기도금장치 | |
| JP6183381B2 (ja) | 電気めっき装置 | |
| KR20130013779A (ko) | 반도체 전기 도금용 웨이퍼 홀더 보조 장치 | |
| KR20100044608A (ko) | 전해도금용 양극 및 그를 이용한 전해도금장치 |