KR20080044162A - 전해 도금 장치와 전해 도금 방법 및 도금 지그 - Google Patents

전해 도금 장치와 전해 도금 방법 및 도금 지그 Download PDF

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Publication number
KR20080044162A
KR20080044162A KR1020070112485A KR20070112485A KR20080044162A KR 20080044162 A KR20080044162 A KR 20080044162A KR 1020070112485 A KR1020070112485 A KR 1020070112485A KR 20070112485 A KR20070112485 A KR 20070112485A KR 20080044162 A KR20080044162 A KR 20080044162A
Authority
KR
South Korea
Prior art keywords
positive electrode
electrode plate
plating
electronic component
negative electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020070112485A
Other languages
English (en)
Korean (ko)
Inventor
요코 나카바야시
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20080044162A publication Critical patent/KR20080044162A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22—Apparatus for electrolytic coating of small objects in bulk having open containers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020070112485A 2006-11-15 2007-11-06 전해 도금 장치와 전해 도금 방법 및 도금 지그 Withdrawn KR20080044162A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006309608A JP4820736B2 (ja) 2006-11-15 2006-11-15 電解めっき装置及び電解めっき方法並びにめっき治具
JPJP-P-2006-00309608 2006-11-15

Publications (1)

Publication Number Publication Date
KR20080044162A true KR20080044162A (ko) 2008-05-20

Family

ID=39506168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070112485A Withdrawn KR20080044162A (ko) 2006-11-15 2007-11-06 전해 도금 장치와 전해 도금 방법 및 도금 지그

Country Status (4)

Country Link
JP (1) JP4820736B2 (enrdf_load_stackoverflow)
KR (1) KR20080044162A (enrdf_load_stackoverflow)
CN (1) CN101240443B (enrdf_load_stackoverflow)
TW (1) TW200825211A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101153276B1 (ko) * 2003-11-05 2012-06-07 신꼬오덴기 고교 가부시키가이샤 전자 부품용 도금 지그 및 전해 도금 장치
KR20160001225U (ko) * 2013-08-01 2016-04-14 하이 후앙 자동화 전기도금 시스템

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385605B (zh) * 2009-12-30 2013-02-11 Univ Ishou Applicable to the fuzzy control teaching of the card plating device
CN102337577B (zh) * 2010-07-22 2014-03-12 富葵精密组件(深圳)有限公司 电镀装置
CN102080253B (zh) * 2010-12-23 2012-07-25 北大方正集团有限公司 电镀夹具及印制线路板电镀系统
CN102776551B (zh) * 2012-07-04 2015-11-25 中国电子科技集团公司第四十一研究所 一种硬质微带电路电镀夹具
JP6193005B2 (ja) * 2013-06-14 2017-09-06 Ｋｙｂ株式会社 保持装置及びそれを備えた高速めっき装置
CN104711656B (zh) * 2015-03-23 2017-06-06 河南理工大学 一种用于电镀平面薄片件的挂具
TW201720969A (zh) * 2015-12-14 2017-06-16 台灣先進系統股份有限公司 可調控式不溶性陽極板及其應用於銅柱電鍍之方法
JP6709727B2 (ja) * 2016-12-14 2020-06-17 株式会社荏原製作所 電解めっき装置
CN107904632B (zh) * 2017-04-24 2020-05-12 张碧海 一种电镀设备
CN107287626A (zh) * 2017-08-11 2017-10-24 杭州帝洛森科技有限公司 一种防短路的阳极板及应用其的电解装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6890413B2 (en) * 2002-12-11 2005-05-10 International Business Machines Corporation Method and apparatus for controlling local current to achieve uniform plating thickness
JP4164435B2 (ja) * 2003-11-05 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
JP4164443B2 (ja) * 2003-11-26 2008-10-15 新光電気工業株式会社 電子部品用めっき治具及び電解めっき装置
JP2006193806A (ja) * 2005-01-17 2006-07-27 Matsushita Electric Ind Co Ltd めっき電極、めっき治具およびそれを用いた電子部品のめっき方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101153276B1 (ko) * 2003-11-05 2012-06-07 신꼬오덴기 고교 가부시키가이샤 전자 부품용 도금 지그 및 전해 도금 장치
KR20160001225U (ko) * 2013-08-01 2016-04-14 하이 후앙 자동화 전기도금 시스템

Also Published As

Publication number Publication date
JP4820736B2 (ja) 2011-11-24
CN101240443B (zh) 2011-02-09
CN101240443A (zh) 2008-08-13
TW200825211A (en) 2008-06-16
JP2008121097A (ja) 2008-05-29

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20071106

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid