TW200821754A - Negative blue-violet laser photosensitive composition, image forming material, image former and method of image formation - Google Patents
Negative blue-violet laser photosensitive composition, image forming material, image former and method of image formation Download PDFInfo
- Publication number
- TW200821754A TW200821754A TW096146583A TW96146583A TW200821754A TW 200821754 A TW200821754 A TW 200821754A TW 096146583 A TW096146583 A TW 096146583A TW 96146583 A TW96146583 A TW 96146583A TW 200821754 A TW200821754 A TW 200821754A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- ring
- photosensitive composition
- compound
- meth
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003332626 | 2003-09-25 | ||
| JP2003344636 | 2003-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200821754A true TW200821754A (en) | 2008-05-16 |
Family
ID=34395582
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096146583A TW200821754A (en) | 2003-09-25 | 2004-09-23 | Negative blue-violet laser photosensitive composition, image forming material, image former and method of image formation |
| TW093128914A TW200521624A (en) | 2003-09-25 | 2004-09-23 | Negative blue-violet laser photosensitive composition, image forming material, image former and method of image formation |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093128914A TW200521624A (en) | 2003-09-25 | 2004-09-23 | Negative blue-violet laser photosensitive composition, image forming material, image former and method of image formation |
Country Status (3)
| Country | Link |
|---|---|
| KR (2) | KR100970357B1 (https=) |
| TW (2) | TW200821754A (https=) |
| WO (1) | WO2005031463A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112835268A (zh) * | 2020-12-30 | 2021-05-25 | 烟台魔技纳米科技有限公司 | 一种生物基水溶性负性光刻胶及其在飞秒激光直写加工方法中的应用 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1950750B (zh) * | 2004-05-12 | 2012-10-24 | 旭化成电子材料株式会社 | 图案形成材料、图案形成设备和图案形成方法 |
| JP2006308983A (ja) * | 2005-04-28 | 2006-11-09 | Fuji Photo Film Co Ltd | パターン形成方法 |
| JP5013831B2 (ja) * | 2006-06-23 | 2012-08-29 | 富士フイルム株式会社 | カラーフィルタ用硬化性組成物、カラーフィルタ、及びその製造方法 |
| TWI437280B (zh) * | 2006-06-23 | 2014-05-11 | Fujifilm Corp | 化合物、感光性組成物、硬化性組成物、彩色濾光片用硬化性組成物、彩色濾光片及其製法 |
| CN103792788A (zh) * | 2008-04-28 | 2014-05-14 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图形的形成方法及印刷电路板的制造方法 |
| CN102395924B (zh) * | 2009-04-30 | 2013-11-06 | 日立化成株式会社 | 感光性树脂组合物、使用其的感光性元件、抗蚀图形的形成方法和印刷线路板的制造方法 |
| TWI491982B (zh) * | 2009-10-28 | 2015-07-11 | Sumitomo Chemical Co | Coloring the photosensitive resin composition |
| CN105001081B (zh) * | 2015-06-24 | 2017-03-01 | 常州强力电子新材料股份有限公司 | 一种蒽系增感剂及其在uv‑led光固化体系中的应用 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0990619A (ja) * | 1995-09-20 | 1997-04-04 | Brother Ind Ltd | 光硬化型組成物及び感光性カプセル |
| JP4685259B2 (ja) * | 2000-04-19 | 2011-05-18 | コダック株式会社 | 感光性平版印刷版及び印刷版の製版方法 |
| JP3832248B2 (ja) * | 2001-01-26 | 2006-10-11 | 三菱化学株式会社 | 光重合性組成物及びカラーフィルター |
| JP2002287380A (ja) * | 2001-03-26 | 2002-10-03 | Mitsubishi Chemicals Corp | 画像形成方法 |
| JP4221467B2 (ja) * | 2001-04-20 | 2009-02-12 | デュポン エムアールシー ドライフィルム株式会社 | レジスト用光重合性樹脂組成物 |
| JP2003140358A (ja) * | 2001-11-01 | 2003-05-14 | Fuji Photo Film Co Ltd | 感光性平版印刷版の製版方法 |
| JP2003221517A (ja) * | 2002-01-30 | 2003-08-08 | Fuji Photo Film Co Ltd | 増感色素の製造方法及びそれを用いた感光性組成物 |
| KR20050047088A (ko) * | 2002-08-07 | 2005-05-19 | 미쓰비시 가가꾸 가부시키가이샤 | 청자색 레이저 감광성 레지스트재층을 갖는 화상 형성재및 그 레지스트 화상 형성 방법 |
-
2004
- 2004-09-22 KR KR1020057009394A patent/KR100970357B1/ko not_active Expired - Lifetime
- 2004-09-22 WO PCT/JP2004/014299 patent/WO2005031463A1/ja not_active Ceased
- 2004-09-22 KR KR1020077028436A patent/KR100998459B1/ko not_active Expired - Lifetime
- 2004-09-23 TW TW096146583A patent/TW200821754A/zh unknown
- 2004-09-23 TW TW093128914A patent/TW200521624A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112835268A (zh) * | 2020-12-30 | 2021-05-25 | 烟台魔技纳米科技有限公司 | 一种生物基水溶性负性光刻胶及其在飞秒激光直写加工方法中的应用 |
| CN112835268B (zh) * | 2020-12-30 | 2022-12-30 | 烟台魔技纳米科技有限公司 | 一种生物基水溶性负性光刻胶及其在飞秒激光直写加工方法中的应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200521624A (en) | 2005-07-01 |
| WO2005031463A1 (ja) | 2005-04-07 |
| KR20060065576A (ko) | 2006-06-14 |
| KR100970357B1 (ko) | 2010-07-16 |
| KR20070119098A (ko) | 2007-12-18 |
| KR100998459B1 (ko) | 2010-12-06 |
| TWI354864B (https=) | 2011-12-21 |
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