TW200821247A - Substrate inspecting apparatus - Google Patents

Substrate inspecting apparatus Download PDF

Info

Publication number
TW200821247A
TW200821247A TW096134879A TW96134879A TW200821247A TW 200821247 A TW200821247 A TW 200821247A TW 096134879 A TW096134879 A TW 096134879A TW 96134879 A TW96134879 A TW 96134879A TW 200821247 A TW200821247 A TW 200821247A
Authority
TW
Taiwan
Prior art keywords
inspection
unit
substrate
suspension
transport
Prior art date
Application number
TW096134879A
Other languages
English (en)
Chinese (zh)
Inventor
Shuya Jogasaki
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200821247A publication Critical patent/TW200821247A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/02—Mechanical
    • G01N2201/021—Special mounting in general
TW096134879A 2006-09-22 2007-09-19 Substrate inspecting apparatus TW200821247A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006257781 2006-09-22

Publications (1)

Publication Number Publication Date
TW200821247A true TW200821247A (en) 2008-05-16

Family

ID=39200575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096134879A TW200821247A (en) 2006-09-22 2007-09-19 Substrate inspecting apparatus

Country Status (5)

Country Link
JP (1) JPWO2008035752A1 (ja)
KR (1) KR20090051098A (ja)
CN (1) CN101517400A (ja)
TW (1) TW200821247A (ja)
WO (1) WO2008035752A1 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5125739B2 (ja) * 2008-05-08 2013-01-23 凸版印刷株式会社 Ｘｙステップ露光装置
JP5380225B2 (ja) * 2009-09-24 2014-01-08 株式会社日立ハイテクノロジーズ ガラス基板の検査装置
US8622620B2 (en) * 2010-09-15 2014-01-07 Hamilton Sundstrand Corporation Shaft for air bearing and motor cooling in compressor
JP2012073036A (ja) * 2010-09-27 2012-04-12 Hitachi High-Technologies Corp ガラス基板欠陥検査装置及びガラス基板欠陥検査方法
US8502967B2 (en) * 2011-02-01 2013-08-06 Cooper S. K. Kuo Apparatus for optical inspection
JP2012178502A (ja) * 2011-02-28 2012-09-13 Ulvac Japan Ltd ステージ装置
JP4858657B1 (ja) * 2011-08-11 2012-01-18 富士ゼロックス株式会社 基板検査装置、及び基板検査方法
CN102495071B (zh) * 2011-12-19 2014-04-16 深圳市景旺电子股份有限公司 一种aoi检测系统及其检测方法
JP5870863B2 (ja) * 2012-06-29 2016-03-01 オムロン株式会社 基板検査装置
CN103076343B (zh) * 2012-12-27 2016-09-14 深圳市华星光电技术有限公司 素玻璃激光检查机及素玻璃检查方法
US9140655B2 (en) 2012-12-27 2015-09-22 Shenzhen China Star Optoelectronics Technology Co., Ltd. Mother glass inspection device and mother glass inspection method
CN108663377A (zh) * 2014-07-23 2018-10-16 塞米西斯科株式会社 不良检查系统及其方法
CN105571938A (zh) * 2016-01-14 2016-05-11 西安交通大学 一种水浮式超薄玻璃基板测量平台
TWI602757B (zh) * 2016-04-11 2017-10-21 由田新技股份有限公司 傳送裝置
KR101855322B1 (ko) 2016-09-02 2018-05-09 한국생산기술연구원 제진 성능이 향상된 복합생산장비
WO2020080025A1 (ja) * 2018-10-15 2020-04-23 株式会社 東京ウエルズ 非破壊自動検査システム
CN113008520A (zh) * 2021-03-02 2021-06-22 苏州天准科技股份有限公司 一种集成式功能外箱及采用该功能外箱的检测设备
CN113008537A (zh) * 2021-03-02 2021-06-22 苏州天准科技股份有限公司 一种减震台架及采用该减震台架的检测设备
CN113008794B (zh) * 2021-03-02 2022-05-17 苏州天准科技股份有限公司 一种检测设备及光学检测方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3094669B2 (ja) * 1992-07-10 2000-10-03 株式会社日立製作所 微小部品の自動製造システム
JPH0831550A (ja) * 1994-07-21 1996-02-02 Semu:Kk ハニカム発熱体
JPH09301510A (ja) * 1996-05-16 1997-11-25 Advantest Corp エアパレット
JP2000009661A (ja) * 1998-06-26 2000-01-14 Ntn Corp フラットパネル検査装置
JP2004238133A (ja) * 2003-02-05 2004-08-26 Sharp Corp 薄板把持装置、薄板搬送装置および薄板検査装置
JP4307872B2 (ja) * 2003-03-18 2009-08-05 オリンパス株式会社 基板検査装置
US7077019B2 (en) * 2003-08-08 2006-07-18 Photon Dynamics, Inc. High precision gas bearing split-axis stage for transport and constraint of large flat flexible media during processing
JP4704756B2 (ja) * 2005-01-04 2011-06-22 オリンパス株式会社 基板搬送装置
JP2006242679A (ja) * 2005-03-02 2006-09-14 Olympus Corp 基板検査装置及び基板検査装置の組み立て方法

Also Published As

Publication number Publication date
CN101517400A (zh) 2009-08-26
KR20090051098A (ko) 2009-05-20
WO2008035752A1 (fr) 2008-03-27
JPWO2008035752A1 (ja) 2010-01-28

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