TW200819011A - Wiring boards and processes for manufacturing the same - Google Patents

Wiring boards and processes for manufacturing the same Download PDF

Info

Publication number
TW200819011A
TW200819011A TW096128805A TW96128805A TW200819011A TW 200819011 A TW200819011 A TW 200819011A TW 096128805 A TW096128805 A TW 096128805A TW 96128805 A TW96128805 A TW 96128805A TW 200819011 A TW200819011 A TW 200819011A
Authority
TW
Taiwan
Prior art keywords
layer
metal
wiring
wiring pattern
conductive
Prior art date
Application number
TW096128805A
Other languages
English (en)
Chinese (zh)
Inventor
Tatsuo Kataoka
Hirokazu Kawamura
Original Assignee
Mitsui Mining & Amp Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Amp Smelting Co Ltd filed Critical Mitsui Mining & Amp Smelting Co Ltd
Publication of TW200819011A publication Critical patent/TW200819011A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H10W70/6525—Cross-sectional shapes for securing the interconnections to the substrate, e.g. to prevent peeling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
TW096128805A 2006-08-11 2007-08-06 Wiring boards and processes for manufacturing the same TW200819011A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006220685A JP2008047655A (ja) 2006-08-11 2006-08-11 配線基板およびその製造方法

Publications (1)

Publication Number Publication Date
TW200819011A true TW200819011A (en) 2008-04-16

Family

ID=39085958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128805A TW200819011A (en) 2006-08-11 2007-08-06 Wiring boards and processes for manufacturing the same

Country Status (5)

Country Link
US (1) US20090183901A1 (https=)
JP (1) JP2008047655A (https=)
KR (1) KR20080014623A (https=)
CN (1) CN101123852A (https=)
TW (1) TW200819011A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645755B (zh) * 2013-07-24 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090260862A1 (en) * 2008-04-16 2009-10-22 Andrew Yaung Circuit modification device for printed circuit boards
KR101203965B1 (ko) 2009-11-25 2012-11-26 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
JPWO2011090034A1 (ja) * 2010-01-19 2013-05-23 国立大学法人京都大学 導電膜及びその製造方法
US9204551B2 (en) * 2010-11-22 2015-12-01 Lenovo Innovations Limited (Hong Kong) Mounting structure and mounting method
JP2013093405A (ja) * 2011-10-25 2013-05-16 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US20130186764A1 (en) * 2012-01-19 2013-07-25 Kesheng Feng Low Etch Process for Direct Metallization
JP2013153068A (ja) * 2012-01-25 2013-08-08 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
JP5410580B1 (ja) * 2012-08-09 2014-02-05 日本特殊陶業株式会社 配線基板
CN105408525B (zh) * 2013-07-23 2019-03-08 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法
JP6593979B2 (ja) * 2013-07-24 2019-10-23 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法
KR101482429B1 (ko) * 2013-08-12 2015-01-13 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
CN103755989B (zh) * 2014-01-14 2017-01-11 广东生益科技股份有限公司 电路基板及其制备方法
JP6385198B2 (ja) * 2014-08-21 2018-09-05 日東電工株式会社 回路付サスペンション基板の製造方法
KR20160093555A (ko) * 2015-01-29 2016-08-08 제이엑스금속주식회사 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
US10550490B2 (en) 2015-05-22 2020-02-04 Versitech Limited Transparent conductive films with embedded metal grids
JP2017011251A (ja) * 2015-06-24 2017-01-12 京セラ株式会社 配線基板およびその製造方法
CN106356351B (zh) * 2015-07-15 2019-02-01 凤凰先驱股份有限公司 基板结构及其制作方法
EP3322267B1 (en) * 2016-11-10 2025-02-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with adhesion promoting shape of wiring structure
US10512165B2 (en) * 2017-03-23 2019-12-17 Unimicron Technology Corp. Method for manufacturing a circuit board
US20190174632A1 (en) * 2017-12-05 2019-06-06 Canon Components, Inc. Flexible printed circuit and electronic device
KR102216418B1 (ko) * 2018-08-20 2021-02-17 주식회사 엘지화학 투명 발광소자 디스플레이용 매립형 전극 기판 및 이의 제조방법
KR102872350B1 (ko) * 2019-07-15 2025-10-17 엘지이노텍 주식회사 회로기판
CN114080088B (zh) * 2020-08-10 2024-05-31 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法
KR20230026105A (ko) * 2021-08-17 2023-02-24 삼성전기주식회사 인쇄회로기판
JP2023132391A (ja) * 2022-03-11 2023-09-22 イビデン株式会社 プリント配線板
KR102783065B1 (ko) * 2022-05-26 2025-03-20 (주)테라시스 폴리이미드 필름의 제조 방법, 이에 따라 제조된 폴리이미드 필름, 금속박막 적층판의 제조 방법 및 이에 따라 제조된 금속박막 적층판
JP2025141114A (ja) * 2024-03-15 2025-09-29 株式会社サトー 導電パターンを備えた基材、電子デバイス、電磁波シールドフィルムおよび面状発熱体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645755B (zh) * 2013-07-24 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method

Also Published As

Publication number Publication date
KR20080014623A (ko) 2008-02-14
US20090183901A1 (en) 2009-07-23
JP2008047655A (ja) 2008-02-28
CN101123852A (zh) 2008-02-13

Similar Documents

Publication Publication Date Title
TW200819011A (en) Wiring boards and processes for manufacturing the same
TW453146B (en) Multi-layer built-up wiring board
TW404158B (en) Multiple layer printed wiring plate with package conductive hole structure
TWI252723B (en) Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
TWI231317B (en) Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
TW401726B (en) Multiple layer printing circuit board
TW471244B (en) Multilayer printed circuit board and method of manufacturing multilayer printed circuit board
TWI358973B (https=)
TW493366B (en) Production method for multi-layer wiring board
TW200806121A (en) Printed circuit board, its methods for manufacture and use
TW200524498A (en) Printed wiring board, its preparation and circuit device
KR20000057687A (ko) 프린트 배선판 및 그 제조방법
TW201125458A (en) Multilayer printed wiring board and method for manufacturing same
TW200939927A (en) Wiring substrate and its manufacturing process
TW200806105A (en) Copper foil attached to the carrier and printed circuit board using the same
KR101208310B1 (ko) 폴리이미드계 플렉시블 동장 적층판용 동박, 폴리이미드계플렉시블 동장 적층판 및 폴리이미드계 플렉시블 프린트배선판
CN100542382C (zh) 印刷线路板的制造方法
TW201043111A (en) Sulfuric acid type copper plating liquid for semi-additive plating and method for making a printed circuit board
JP4480111B2 (ja) 配線形成方法および配線部材
JP2009272571A (ja) プリント配線基板及びその製造方法
TWI252719B (en) Conductive connecting pin and package board
TWI387017B (zh) Ｃｏｆ用被銅積層板及ｃｏｆ用載置帶
CN101310571A (zh) 印刷线路板及其制造方法和使用方法
JP2919817B2 (ja) プリント配線板の製造方法
TW200809360A (en) Wiring board, production process thereof and connection method using same