TW200811988A - Wafer platform - Google Patents

Wafer platform Download PDF

Info

Publication number
TW200811988A
TW200811988A TW096123297A TW96123297A TW200811988A TW 200811988 A TW200811988 A TW 200811988A TW 096123297 A TW096123297 A TW 096123297A TW 96123297 A TW96123297 A TW 96123297A TW 200811988 A TW200811988 A TW 200811988A
Authority
TW
Taiwan
Prior art keywords
channel
wafer
platform
edges
edge
Prior art date
Application number
TW096123297A
Other languages
English (en)
Chinese (zh)
Inventor
Brian L Gilmore
Larry W Shive
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Publication of TW200811988A publication Critical patent/TW200811988A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
TW096123297A 2006-06-30 2007-06-27 Wafer platform TW200811988A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80637706P 2006-06-30 2006-06-30

Publications (1)

Publication Number Publication Date
TW200811988A true TW200811988A (en) 2008-03-01

Family

ID=38753500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123297A TW200811988A (en) 2006-06-30 2007-06-27 Wafer platform

Country Status (7)

Country Link
US (1) US20080041798A1 (https=)
EP (1) EP2036121A2 (https=)
JP (1) JP2009543352A (https=)
KR (1) KR20090034833A (https=)
CN (1) CN101479840B (https=)
TW (1) TW200811988A (https=)
WO (1) WO2008005716A2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4290187B2 (ja) * 2006-09-27 2009-07-01 コバレントマテリアル株式会社 半導体ウェーハ熱処理用ボートの表面清浄化方法
US20090162183A1 (en) * 2007-12-19 2009-06-25 Peter Davison Full-contact ring for a large wafer
US8042697B2 (en) 2008-06-30 2011-10-25 Memc Electronic Materials, Inc. Low thermal mass semiconductor wafer support
US20100098519A1 (en) * 2008-10-17 2010-04-22 Memc Electronic Materials, Inc. Support for a semiconductor wafer in a high temperature environment
KR20130007594A (ko) * 2010-03-03 2013-01-18 비코 인스트루먼츠 인코포레이티드 경사진 에지를 가진 웨이퍼 캐리어
DE102010026351B4 (de) * 2010-07-07 2012-04-26 Siltronic Ag Verfahren und Vorrichtung zur Untersuchung einer Halbleiterscheibe
DE102011083041B4 (de) * 2010-10-20 2018-06-07 Siltronic Ag Stützring zum Abstützen einer Halbleiterscheibe aus einkristallinem Silizium während einer Wärmebehandlung und Verfahren zur Wärmebehandlung einer solchen Halbleiterscheibe unter Verwendung eines solchen Stützrings
US9099514B2 (en) 2012-03-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer holder with tapered region
CN107507799B (zh) 2013-11-06 2021-01-26 应用材料公司 溶胶凝胶涂布的支撑环
US10072892B2 (en) * 2015-10-26 2018-09-11 Globalwafers Co., Ltd. Semiconductor wafer support ring for heat treatment
JP7030604B2 (ja) * 2018-04-19 2022-03-07 三菱電機株式会社 ウエハボートおよびその製造方法
CN110246784B (zh) * 2019-06-19 2021-05-07 西安奕斯伟硅片技术有限公司 一种支撑结构和具有其的热处理装置
KR102782608B1 (ko) * 2019-10-14 2025-03-14 삼성전자주식회사 반도체 제조 장비
JP7251458B2 (ja) * 2019-12-05 2023-04-04 株式会社Sumco シリコンウェーハの製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260296A (ja) * 1996-03-21 1997-10-03 Sumitomo Sitix Corp ウェーハ支持装置
EP1308989A3 (en) * 1997-11-03 2007-12-26 ASM America, Inc. Improved low mass wafer support system
DE69813014T2 (de) * 1997-11-03 2004-02-12 Asm America Inc., Phoenix Verbesserte kleinmassige waferhaleeinrichtung
US6264467B1 (en) * 1999-04-14 2001-07-24 Applied Materials, Inc. Micro grooved support surface for reducing substrate wear and slip formation
JP3942317B2 (ja) * 1999-08-20 2007-07-11 東芝セラミックス株式会社 半導体ウェーハ熱処理用保持具および熱処理方法
US6474987B1 (en) * 1999-09-03 2002-11-05 Mitsubishi Materials Silicon Corporation Wafer holder
JP4540796B2 (ja) * 2000-04-21 2010-09-08 東京エレクトロン株式会社 石英ウインドウ、リフレクタ及び熱処理装置
US20020130061A1 (en) * 2000-11-02 2002-09-19 Hengst Richard R. Apparatus and method of making a slip free wafer boat
JP2002231791A (ja) * 2001-01-30 2002-08-16 Toshiba Ceramics Co Ltd 半導体熱処理用部材およびその搬送方法
JP3687578B2 (ja) * 2001-07-23 2005-08-24 三菱住友シリコン株式会社 半導体シリコン基板の熱処理治具
JP4029611B2 (ja) * 2001-12-17 2008-01-09 株式会社Ｓｕｍｃｏ ウェーハ支持具
JP2004079676A (ja) * 2002-08-13 2004-03-11 Toshiba Ceramics Co Ltd ウェーハホルダ
JP4350438B2 (ja) * 2003-06-26 2009-10-21 コバレントマテリアル株式会社 半導体熱処理用部材
JP2005026463A (ja) * 2003-07-02 2005-01-27 Sumitomo Mitsubishi Silicon Corp 縦型ボート用ウエーハ支持リング
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
US7163393B2 (en) * 2004-02-02 2007-01-16 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor silicon substrate
KR100840705B1 (ko) * 2004-04-21 2008-06-24 가부시키가이샤 히다치 고쿠사이 덴키 열처리장치
JP4826070B2 (ja) * 2004-06-21 2011-11-30 信越半導体株式会社 半導体ウエーハの熱処理方法
US7033168B1 (en) * 2005-01-24 2006-04-25 Memc Electronic Materials, Inc. Semiconductor wafer boat for a vertical furnace
TWI327761B (en) * 2005-10-07 2010-07-21 Rohm & Haas Elect Mat Method for making semiconductor wafer and wafer holding article
US8003919B2 (en) * 2005-12-06 2011-08-23 Dainippon Screen Mfg. Co., Ltd. Substrate heat treatment apparatus

Also Published As

Publication number Publication date
KR20090034833A (ko) 2009-04-08
CN101479840A (zh) 2009-07-08
WO2008005716A2 (en) 2008-01-10
EP2036121A2 (en) 2009-03-18
CN101479840B (zh) 2010-12-22
WO2008005716A3 (en) 2008-03-13
JP2009543352A (ja) 2009-12-03
US20080041798A1 (en) 2008-02-21

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