TW200746959A - Electronic component with lead using Pb-free solder - Google Patents

Electronic component with lead using Pb-free solder

Info

Publication number
TW200746959A
TW200746959A TW096101105A TW96101105A TW200746959A TW 200746959 A TW200746959 A TW 200746959A TW 096101105 A TW096101105 A TW 096101105A TW 96101105 A TW96101105 A TW 96101105A TW 200746959 A TW200746959 A TW 200746959A
Authority
TW
Taiwan
Prior art keywords
lead
electronic component
free solder
semiconductor chip
leads
Prior art date
Application number
TW096101105A
Other languages
English (en)
Other versions
TWI354519B (zh
Inventor
Tetsuya Nakatsuka
Koji Serizawa
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200746959A publication Critical patent/TW200746959A/zh
Application granted granted Critical
Publication of TWI354519B publication Critical patent/TWI354519B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49537—Plurality of lead frames mounted in one device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D24/00—Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof
    • B01D24/46—Regenerating the filtering material in the filter
    • B01D24/4631—Counter-current flushing, e.g. by air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D24/00—Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof
    • B01D24/48—Filters comprising loose filtering material, i.e. filtering material without any binder between the individual particles or fibres thereof integrally combined with devices for controlling the filtration
    • B01D24/4807—Handling the filter cake for purposes other than regenerating
    • B01D24/4815—Handling the filter cake for purposes other than regenerating for washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10848—Thinned leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW096101105A 2006-03-07 2007-01-11 Electronic component with lead using Pb-free solder TW200746959A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006060432A JP4595835B2 (ja) 2006-03-07 2006-03-07 鉛フリーはんだを用いたリード付き電子部品

Publications (2)

Publication Number Publication Date
TW200746959A true TW200746959A (en) 2007-12-16
TWI354519B TWI354519B (zh) 2011-12-11

Family

ID=38477923

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101105A TW200746959A (en) 2006-03-07 2007-01-11 Electronic component with lead using Pb-free solder

Country Status (5)

Country Link
US (1) US7911062B2 (zh)
JP (1) JP4595835B2 (zh)
KR (1) KR100803454B1 (zh)
CN (1) CN100578772C (zh)
TW (1) TW200746959A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009040051B4 (de) * 2009-09-03 2014-05-08 Siemens Aktiengesellschaft Freikolbenmaschine mit magnetischer Lagerung des Kolbens
JP2015138899A (ja) * 2014-01-23 2015-07-30 株式会社デンソー 半導体装置および電子装置
WO2016178902A1 (en) * 2015-05-01 2016-11-10 Georgia Tech Research Corporation Vertically curved mechanically flexible interconnects, methods of making the same, and methods of use

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JPS63144A (ja) * 1986-06-19 1988-01-05 Matsushita Electric Ind Co Ltd フラツトパツケ−ジｌｓｉ
JP2602076B2 (ja) * 1988-09-08 1997-04-23 三菱電機株式会社 半導体装置用リードフレーム
JPH0755003Y2 (ja) * 1988-10-28 1995-12-18 沖電気工業株式会社 半導体素子用セラミックパッケージ
US5138431A (en) * 1990-01-31 1992-08-11 Vlsi Technology, Inc. Lead and socket structures with reduced self-inductance
US5196725A (en) * 1990-06-11 1993-03-23 Hitachi Cable Limited High pin count and multi-layer wiring lead frame
JP2782934B2 (ja) * 1990-09-05 1998-08-06 セイコーエプソン株式会社 Ｔａｂ内蔵型半導体装置並びにリードフレーム
JP2819825B2 (ja) * 1990-11-21 1998-11-05 セイコーエプソン株式会社 Ｔａｂ内蔵型半導体装置
JPH04363055A (ja) * 1991-05-16 1992-12-15 Mitsubishi Electric Corp 半導体パッケージ
JPH05243462A (ja) * 1992-03-02 1993-09-21 Mitsubishi Electric Corp 半導体パッケージ
JP2708320B2 (ja) 1992-04-17 1998-02-04 三菱電機株式会社 マルチチップ型半導体装置及びその製造方法
JPH06224353A (ja) * 1993-01-21 1994-08-12 Kokusai Electric Co Ltd 電子部品の電極構造
US5637914A (en) * 1994-05-16 1997-06-10 Hitachi, Ltd. Lead frame and semiconductor device encapsulated by resin
EP0764345A1 (en) * 1995-04-05 1997-03-26 National Semiconductor Corporation Multi-layer lead frame
JPH1012790A (ja) * 1996-06-24 1998-01-16 Mitsubishi Electric Corp 半導体集積回路装置
US5736784A (en) * 1996-10-31 1998-04-07 Hewlett-Packard Co. Variable-width lead interconnection structure and method
US5945732A (en) * 1997-03-12 1999-08-31 Staktek Corporation Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
TW456004B (en) * 1998-02-10 2001-09-21 Nissha Printing Substrate sheet for semiconductor module, method and apparatus for manufacturing the same
TW468258B (en) * 1998-10-21 2001-12-11 Hitachi Ltd Semiconductor device and method of manufacturing the same
JP3773679B2 (ja) * 1998-11-20 2006-05-10 富士通株式会社 テープキャリアパッケージ
JP2000188366A (ja) * 1998-12-24 2000-07-04 Hitachi Ltd 半導体装置
KR20010009153A (ko) * 1999-07-07 2001-02-05 김진성 박형 시스템 대응 고방열 히트스프레다 부착 패키지구조 및 그의 제조 방법
JP2002299542A (ja) * 2001-03-29 2002-10-11 Hitachi Cable Ltd 複合リードフレーム及びこれを用いた半導体装置
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JP3895169B2 (ja) 2001-12-21 2007-03-22 株式会社日立製作所 鉛フリーはんだを用いたフローはんだ付け装置
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
JP2004214233A (ja) * 2002-12-26 2004-07-29 Renesas Technology Corp 半導体装置およびその製造方法
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Also Published As

Publication number Publication date
CN101034694A (zh) 2007-09-12
JP4595835B2 (ja) 2010-12-08
JP2007242743A (ja) 2007-09-20
KR20070092101A (ko) 2007-09-12
KR100803454B1 (ko) 2008-02-14
CN100578772C (zh) 2010-01-06
US7911062B2 (en) 2011-03-22
TWI354519B (zh) 2011-12-11
US20070210139A1 (en) 2007-09-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees