TW200740872A - Liquid epoxy resin, epoxy resin composition, and cured article - Google Patents

Liquid epoxy resin, epoxy resin composition, and cured article

Info

Publication number
TW200740872A
TW200740872A TW096102122A TW96102122A TW200740872A TW 200740872 A TW200740872 A TW 200740872A TW 096102122 A TW096102122 A TW 096102122A TW 96102122 A TW96102122 A TW 96102122A TW 200740872 A TW200740872 A TW 200740872A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
bisphenol
type
resin composition
cured article
Prior art date
Application number
TW096102122A
Other languages
English (en)
Inventor
Masataka Nakanishi
Katsuhiko Oshimi
Takao Sunaga
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200740872A publication Critical patent/TW200740872A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
TW096102122A 2006-01-19 2007-01-19 Liquid epoxy resin, epoxy resin composition, and cured article TW200740872A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006011396 2006-01-19

Publications (1)

Publication Number Publication Date
TW200740872A true TW200740872A (en) 2007-11-01

Family

ID=38287667

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102122A TW200740872A (en) 2006-01-19 2007-01-19 Liquid epoxy resin, epoxy resin composition, and cured article

Country Status (3)

Country Link
JP (1) JP5368707B2 (zh)
TW (1) TW200740872A (zh)
WO (1) WO2007083715A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8981160B2 (en) 2006-08-17 2015-03-17 Nipponkayaku Kabushikikaisha Modified liquid epoxy resin as well as epoxy resin composition using the same and cured product thereof
JPWO2017057689A1 (ja) * 2015-09-30 2018-09-06 新日鉄住金化学株式会社 硬化性エポキシ樹脂組成物、及びそれを用いた繊維強化複合材料
KR101783746B1 (ko) 2015-12-01 2017-10-11 주식회사 케이씨씨 비스페놀 화합물 유래 고순도 액상 에폭시 수지의 제조 방법
JP6697903B2 (ja) * 2016-02-29 2020-05-27 日鉄ケミカル＆マテリアル株式会社 ビスフェノールｆ型エポキシ樹脂及びその製造方法
JP7075351B2 (ja) * 2016-12-27 2022-05-25 日鉄ケミカル＆マテリアル株式会社 硬化性エポキシ樹脂組成物、それを用いた繊維強化複合材料及び成形体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10259227A (ja) * 1997-03-19 1998-09-29 Dainippon Ink & Chem Inc 新規エポキシ樹脂及びエポキシ樹脂組成物
JP3747221B2 (ja) * 1999-11-18 2006-02-22 ジャパンエポキシレジン株式会社 高分子エポキシ樹脂の製造方法及び塗料組成物
TW200415197A (en) * 2002-10-03 2004-08-16 Nippon Kayaku Kk Epoxy resin composition for optical semiconductor package
WO2006008984A1 (ja) * 2004-07-20 2006-01-26 Nippon Kayaku Kabushiki Kaisha エポキシ樹脂、エポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
JPWO2007083715A1 (ja) 2009-06-11
JP5368707B2 (ja) 2013-12-18
WO2007083715A1 (ja) 2007-07-26

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