WO2008139968A1 - ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品 - Google Patents

ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品 Download PDF

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Publication number
WO2008139968A1
WO2008139968A1 PCT/JP2008/058406 JP2008058406W WO2008139968A1 WO 2008139968 A1 WO2008139968 A1 WO 2008139968A1 JP 2008058406 W JP2008058406 W JP 2008058406W WO 2008139968 A1 WO2008139968 A1 WO 2008139968A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
polyarylene sulfide
sulfide resin
same
molded article
Prior art date
Application number
PCT/JP2008/058406
Other languages
English (en)
French (fr)
Inventor
Naoto Okubo
Wataru Kosaka
Eiji Tamura
Original Assignee
Idemitsu Kosan Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co., Ltd. filed Critical Idemitsu Kosan Co., Ltd.
Priority to CN2008800158874A priority Critical patent/CN101679745B/zh
Priority to US12/597,996 priority patent/US8487042B2/en
Priority to KR1020097023729A priority patent/KR101489015B1/ko
Publication of WO2008139968A1 publication Critical patent/WO2008139968A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Inorganic Insulating Materials (AREA)
  • Organic Insulating Materials (AREA)

Abstract

　以下の成分（Ａ）～（Ｃ）を含む樹脂組成物。 （Ａ）ポリアリーレンサルファイド樹脂：２０重量％＜成分（Ａ）≦６０重量％ （Ｂ）六方晶窒化硼素：８重量％≦成分（Ｂ）≦５５重量％ （Ｃ）扁平ガラス繊維：１５重量％≦成分（Ｃ）≦５５重量％ （前記各成分の配合量は、成分（Ａ）～（Ｃ）の合計量に対する重量分率である）
PCT/JP2008/058406 2007-05-15 2008-05-02 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品 WO2008139968A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800158874A CN101679745B (zh) 2007-05-15 2008-05-02 聚芳硫醚树脂组合物以及由该组合物构成的成形品
US12/597,996 US8487042B2 (en) 2007-05-15 2008-05-02 Polyarylene sulfide resin composition and a molded article formed therefrom
KR1020097023729A KR101489015B1 (ko) 2007-05-15 2008-05-02 폴리아릴렌설파이드 수지 조성물 및 그로 이루어지는 성형품

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-128979 2007-05-15
JP2007128979A JP5525682B2 (ja) 2007-05-15 2007-05-15 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品

Publications (1)

Publication Number Publication Date
WO2008139968A1 true WO2008139968A1 (ja) 2008-11-20

Family

ID=40002175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058406 WO2008139968A1 (ja) 2007-05-15 2008-05-02 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品

Country Status (6)

Country Link
US (1) US8487042B2 (ja)
JP (1) JP5525682B2 (ja)
KR (1) KR101489015B1 (ja)
CN (1) CN101679745B (ja)
TW (1) TWI494375B (ja)
WO (1) WO2008139968A1 (ja)

Cited By (9)

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US20110259567A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259566A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259564A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259565A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Heat dissipation structure
US20110259568A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259569A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US8547465B2 (en) 2010-01-29 2013-10-01 Nitto Denko Corporation Imaging device module
US8592844B2 (en) 2010-01-29 2013-11-26 Nitto Denko Corporation Light-emitting diode device
US8749978B2 (en) 2010-01-29 2014-06-10 Nitto Denko Corporation Power module

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JP2010043229A (ja) * 2008-08-18 2010-02-25 Idemitsu Kosan Co Ltd 伝熱性樹脂組成物およびその樹脂成形体
JP2010258373A (ja) * 2009-04-28 2010-11-11 Polyplastics Co 電子回路基板の収納容器
CN102286269A (zh) * 2011-08-17 2011-12-21 周贤和 Led灯散热材料、散热器及led灯
JP5834725B2 (ja) * 2011-09-30 2015-12-24 Dic株式会社 高放熱性ポリアリーレンスルフィド樹脂組成物および成形体
TWI380969B (zh) * 2011-10-19 2013-01-01 Sunshine Mineral Company 雲母／氮化硼複合式陶瓷粉體之組成與應用
US8796392B2 (en) 2011-12-16 2014-08-05 Ticona Llc Low temperature injection molding of polyarylene sulfide compositions
WO2013090163A1 (en) * 2011-12-16 2013-06-20 Ticona Llc Boron-containing nucleating agent for polyphenylene sulfide
WO2013090168A1 (en) * 2011-12-16 2013-06-20 Ticona Llc Injection molding of polyarylene sulfide compositions
US9080036B2 (en) 2011-12-16 2015-07-14 Ticona Llc Nucleating system for polyarylene sulfide compositions
JPWO2013191207A1 (ja) * 2012-06-21 2016-05-26 Dic株式会社 高放熱性ポリアリーレンスルフィド樹脂組成物および成形体
CN103509342A (zh) * 2012-06-28 2014-01-15 苏州汉扬精密电子有限公司 玻璃纤维增强聚苯硫醚树脂及其制备方法
CN103627173A (zh) * 2012-08-24 2014-03-12 苏州汉扬精密电子有限公司 玻璃纤维增强聚苯硫醚/芳香族聚酰胺复合材料及其制备方法
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20150274930A1 (en) * 2012-09-19 2015-10-01 Momentive Performance Materials Inc. Masterbatch comprising boron nitride, composite powders thereof, and compositions and articles comprising such materials
US20140080951A1 (en) 2012-09-19 2014-03-20 Chandrashekar Raman Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
KR20140092454A (ko) * 2012-12-28 2014-07-24 코오롱플라스틱 주식회사 폴리페닐렌설파이드 수지 조성물
TWI612097B (zh) * 2013-05-10 2018-01-21 三井化學股份有限公司 反射材用聚酯樹脂組成物及含有其的反射板
JP6186898B2 (ja) * 2013-06-03 2017-08-30 東ソー株式会社 ポリアリーレンスルフィド樹脂組成物
JP6194662B2 (ja) * 2013-07-05 2017-09-13 東ソー株式会社 ポリアリーレンスルフィド樹脂組成物
JP6394700B2 (ja) 2013-08-22 2018-09-26 東レ株式会社 ポリフェニレンサルファイド樹脂組成物、及びその成形品とその成形品の製造方法
JP6206122B2 (ja) * 2013-11-22 2017-10-04 東ソー株式会社 ポリアリーレンスルフィド系組成物
KR20160140850A (ko) * 2014-04-01 2016-12-07 디에스엠 아이피 어셋츠 비.브이. 열전도성 조성물
CN103965632A (zh) * 2014-04-23 2014-08-06 安徽依采妮纤维材料科技有限公司 一种汽车塑料件用膨胀石墨改性聚苯硫醚材料
KR101581942B1 (ko) * 2015-09-17 2015-12-31 주식회사 엔에이치씨 전선피복용 첨가제 및 이의 제조방법
US11383491B2 (en) 2016-03-24 2022-07-12 Ticona Llc Composite structure
US9850365B1 (en) * 2016-06-21 2017-12-26 General Electric Company Electrically insulating composition used in conjunction with dynamoelectric machines
CN108165010A (zh) * 2016-12-07 2018-06-15 上海杰事杰新材料(集团)股份有限公司 一种高导热低介电聚苯硫醚复合材料及其制备方法
US11118053B2 (en) 2018-03-09 2021-09-14 Ticona Llc Polyaryletherketone/polyarylene sulfide composition
CN109233277A (zh) * 2018-08-15 2019-01-18 安徽电缆股份有限公司 一种电动汽车充电系统用高延展性电缆材料及其制备方法
EP3931248A1 (en) * 2019-02-27 2022-01-05 Solvay Specialty Polymers USA, LLC Poly(arylene sulphide) composition having high dielectric performance
US20220010073A1 (en) * 2019-03-27 2022-01-13 Toray Industries, Inc. Polyphenylene sulfide resin composition and molded article
KR20220092704A (ko) * 2020-12-24 2022-07-04 에이치디씨폴리올 주식회사 폴리아릴렌 설파이드 수지 조성물 및 내열충격성 성형체

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110259567A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259566A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259564A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259565A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Heat dissipation structure
US20110259568A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US20110259569A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet
US8547465B2 (en) 2010-01-29 2013-10-01 Nitto Denko Corporation Imaging device module
US8592844B2 (en) 2010-01-29 2013-11-26 Nitto Denko Corporation Light-emitting diode device
US8749978B2 (en) 2010-01-29 2014-06-10 Nitto Denko Corporation Power module

Also Published As

Publication number Publication date
KR101489015B1 (ko) 2015-02-02
TW200911923A (en) 2009-03-16
US8487042B2 (en) 2013-07-16
TWI494375B (zh) 2015-08-01
CN101679745A (zh) 2010-03-24
CN101679745B (zh) 2012-09-05
KR20100016535A (ko) 2010-02-12
JP5525682B2 (ja) 2014-06-18
US20100063192A1 (en) 2010-03-11
JP2008285511A (ja) 2008-11-27

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