TW200737332A - Sheet cutting apparatus and sheet cutting method - Google Patents

Sheet cutting apparatus and sheet cutting method

Info

Publication number
TW200737332A
TW200737332A TW095147953A TW95147953A TW200737332A TW 200737332 A TW200737332 A TW 200737332A TW 095147953 A TW095147953 A TW 095147953A TW 95147953 A TW95147953 A TW 95147953A TW 200737332 A TW200737332 A TW 200737332A
Authority
TW
Taiwan
Prior art keywords
sheet
sheet cutting
notch
insertion depth
cutting apparatus
Prior art date
Application number
TW095147953A
Other languages
English (en)
Inventor
Hideaki Nonaka
Kenji Kobayashi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200737332A publication Critical patent/TW200737332A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/005—Manipulators for mechanical processing tasks
    • B25J11/0055—Cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3806—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
    • B26F1/3813—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0348—Active means to control depth of score
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps
    • Y10T83/0572—Plural cutting steps effect progressive cut

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095147953A 2006-01-18 2006-12-20 Sheet cutting apparatus and sheet cutting method TW200737332A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006009654A JP4890868B2 (ja) 2006-01-18 2006-01-18 シート切断装置及び切断方法

Publications (1)

Publication Number Publication Date
TW200737332A true TW200737332A (en) 2007-10-01

Family

ID=38287412

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147953A TW200737332A (en) 2006-01-18 2006-12-20 Sheet cutting apparatus and sheet cutting method

Country Status (5)

Country Link
US (1) US20090266217A1 (zh)
JP (1) JP4890868B2 (zh)
DE (1) DE112006003596T5 (zh)
TW (1) TW200737332A (zh)
WO (1) WO2007083455A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109390248A (zh) * 2017-08-09 2019-02-26 志圣科技（广州）有限公司 切膜装置及其切膜方法

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* Cited by examiner, † Cited by third party
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ES2334485B1 (es) * 2007-04-29 2011-01-31 Gpg Tecnicas De Panificacion, S.L. Dispositivo automatico mejorado para cortar masas panificables.
JP5028233B2 (ja) * 2007-11-26 2012-09-19 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
JP4740927B2 (ja) * 2007-11-27 2011-08-03 日東精機株式会社 半導体ウエハの保護テープ切断方法およびその装置
CH700096A2 (de) * 2008-12-10 2010-06-15 Weissenberger Ag Schneidemaschine.
JP5011364B2 (ja) * 2009-10-20 2012-08-29 志聖工業股▲ふん▼有限公司 ウェハーラミネートダイシングソー
JP5554100B2 (ja) * 2010-03-19 2014-07-23 リンテック株式会社 シート切断方法およびシート切断装置
JP5924421B2 (ja) * 2012-12-20 2016-05-25 トヨタ自動車株式会社 切断方法、および切断装置
JP6122311B2 (ja) * 2013-02-28 2017-04-26 日東電工株式会社 粘着テープ切断方法および粘着テープ片切断装置
DE102013009251A1 (de) * 2013-06-03 2014-12-04 Günter Bröker Vorrichtung zur schneidenden Bearbeitung von Material und Schneideinheit mit oszillierendem Schneidmesser und veränderlichem Schnittneigungswinkel
JP6445882B2 (ja) * 2015-01-30 2018-12-26 リンテック株式会社 シート転写装置および転写方法
CN107634020B (zh) * 2017-09-27 2024-04-30 无锡奥特维科技股份有限公司 电池片掰片系统
JP6489626B1 (ja) * 2017-09-28 2019-03-27 Ａｃｓ株式会社 カッティング装置の制御方法
CN112809690B (zh) * 2017-11-30 2022-12-02 马鞍山钢铁股份有限公司 一种型钢锯机夹持臂控制方法
JP6548236B1 (ja) * 2018-01-29 2019-07-24 Ａｃｓ株式会社 カッティング装置の制御方法
EP3670039B1 (en) * 2018-12-17 2021-09-29 CERATIZIT Como S.p.A. Ultrasonic knife and ultrasonic cutting system
CN109659263B (zh) * 2019-01-10 2023-09-05 江苏汇成光电有限公司 一种晶圆贴底膜装置
CN111516022A (zh) * 2020-04-30 2020-08-11 紫光宏茂微电子(上海)有限公司 一种用于晶圆片的胶膜切割装置

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US4624169A (en) * 1985-04-08 1986-11-25 Aerochem, Inc. Apparatus for automated cutting of thin films
JPH061771B2 (ja) * 1985-05-30 1994-01-05 日東電工株式会社 ウエハ保護フイルムの切断方法
JPS62236738A (ja) * 1986-04-07 1987-10-16 日東電工株式会社 薄板保護用フイルムの切抜き方法
JPS63109997A (ja) * 1986-10-28 1988-05-14 エヌオーケー株式会社 ゴム状弾性材の切断方法およびその装置
JPH0469192A (ja) * 1990-07-05 1992-03-04 Furukawa Electric Co Ltd:The 円板体に貼付けられたフィルム等の倣い切断方法
JPH0469194A (ja) * 1990-07-05 1992-03-04 Furukawa Electric Co Ltd:The 円板体に貼付けられたフィルム等の倣い切断装置
AT396085B (de) * 1990-07-13 1993-05-25 Gfm Fertigungstechnik Vorrichtung zum beschneiden raeumlicher formteile aus kunststoff od. dgl.
JPH0732998B2 (ja) * 1991-05-13 1995-04-12 多賀電気株式会社 超音波切断装置
EP0540496B1 (de) * 1991-10-30 1996-02-28 GFM Gesellschaft für Fertigungstechnik und Maschinenbau Aktiengesellschaft Verfahren und Schneidaggregat zum Herstellen räumlicher Formstücke aus einem vorgefertigten Block eines grossporigen Materials
EP0540495A1 (de) * 1991-10-30 1993-05-05 GFM Gesellschaft für Fertigungstechnik und Maschinenbau Aktiengesellschaft Verfahren zum Schneiden von Werkstücken aus faserverstärkten Kunststoffen
EP0838403B1 (de) * 1996-10-17 2000-03-08 DaimlerChrysler AG Verfahren und Vorrichtung zum Durchtrennen von Schutzfolie im Bereich überklebter Fugen und Sicken von Karosserien
JP4311522B2 (ja) 2002-03-07 2009-08-12 日東電工株式会社 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法
JP4067373B2 (ja) * 2002-09-30 2008-03-26 日東電工株式会社 保護テープカット方法およびその装置
JP3545758B2 (ja) * 2003-06-17 2004-07-21 リンテック株式会社 半導体ウェハ保護フィルムの切断方法および装置
JP4136890B2 (ja) * 2003-10-17 2008-08-20 日東電工株式会社 保護テープの切断方法及び切断装置
JP2005198806A (ja) 2004-01-15 2005-07-28 Jnb:Kk ゴルフ・プレイの画像製作方法
JP4640763B2 (ja) * 2004-07-01 2011-03-02 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
JP4450696B2 (ja) * 2004-08-19 2010-04-14 日東電工株式会社 保護テープ貼付け装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109390248A (zh) * 2017-08-09 2019-02-26 志圣科技（广州）有限公司 切膜装置及其切膜方法

Also Published As

Publication number Publication date
US20090266217A1 (en) 2009-10-29
JP2007194321A (ja) 2007-08-02
DE112006003596T5 (de) 2008-11-20
WO2007083455A1 (ja) 2007-07-26
JP4890868B2 (ja) 2012-03-07

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