TW200734100A - Laser processing apparatus, laser processing head and the laser processing method - Google Patents

Laser processing apparatus, laser processing head and the laser processing method

Info

Publication number
TW200734100A
TW200734100A TW095132181A TW95132181A TW200734100A TW 200734100 A TW200734100 A TW 200734100A TW 095132181 A TW095132181 A TW 095132181A TW 95132181 A TW95132181 A TW 95132181A TW 200734100 A TW200734100 A TW 200734100A
Authority
TW
Taiwan
Prior art keywords
laser processing
laser light
workpiece
laser
vent hole
Prior art date
Application number
TW095132181A
Other languages
English (en)
Other versions
TWI391200B (zh
Inventor
Kosei Aso
Yoshinari Sasaki
Hidehisa Murase
Naoki Yamada
Original Assignee
Sony Corp
Exitech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp, Exitech Ltd filed Critical Sony Corp
Publication of TW200734100A publication Critical patent/TW200734100A/zh
Application granted granted Critical
Publication of TWI391200B publication Critical patent/TWI391200B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
TW095132181A 2006-03-07 2006-08-31 雷射加工裝置 TWI391200B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006061561A JP5165203B2 (ja) 2006-03-07 2006-03-07 レーザ加工装置及びレーザ加工方法

Publications (2)

Publication Number Publication Date
TW200734100A true TW200734100A (en) 2007-09-16
TWI391200B TWI391200B (zh) 2013-04-01

Family

ID=37137135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132181A TWI391200B (zh) 2006-03-07 2006-08-31 雷射加工裝置

Country Status (6)

Country Link
US (1) US8581140B2 (zh)
JP (1) JP5165203B2 (zh)
KR (1) KR101299039B1 (zh)
CN (1) CN101032785A (zh)
GB (1) GB2435844B (zh)
TW (1) TWI391200B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495529B (zh) * 2009-12-11 2015-08-11 Disco Corp Laser processing device
TWI561328B (en) * 2014-09-03 2016-12-11 Univ Nat Yunlin Sci & Tech Swirl jet flow auxiliary manufacturing device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4404085B2 (ja) 2006-11-02 2010-01-27 ソニー株式会社 レーザ加工装置、レーザ加工ヘッド及びレーザ加工方法
JP5164748B2 (ja) * 2008-08-29 2013-03-21 株式会社日立ハイテクノロジーズ レーザ処理装置、太陽電池パネルの製造装置、太陽電池パネルおよびレーザ処理方法
JP5308423B2 (ja) * 2010-10-12 2013-10-09 日本特殊陶業株式会社 グリーンシートの溝加工装置および多数個取り配線基板の製造方法
KR102096048B1 (ko) * 2012-10-10 2020-04-02 삼성디스플레이 주식회사 레이저 가공장치
JP6104025B2 (ja) * 2013-04-11 2017-03-29 株式会社ディスコ レーザー加工装置及びレーザー加工方法
JP7071118B2 (ja) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ
JP6807334B2 (ja) * 2015-05-13 2021-01-06 ルミレッズ ホールディング ベーフェー ダイレベルのリフトオフの最中におけるメカニカルダメージを低減するためのサファイアコレクタ
JP6647829B2 (ja) * 2015-10-20 2020-02-14 株式会社ディスコ レーザ加工装置
KR101900283B1 (ko) * 2016-03-03 2018-11-05 에이피시스템 주식회사 레이저 리프트 오프 장비
KR20190110442A (ko) * 2018-03-20 2019-09-30 오르보테크 엘티디. 광학 처리 시스템 내에서 기판으로부터 파편을 제거하기 위한 시스템
CN108500454A (zh) * 2018-04-27 2018-09-07 深圳市振华兴科技有限公司 吸烟吸尘装置及激光生产设备
JP6725605B2 (ja) 2018-08-24 2020-07-22 ファナック株式会社 レーザ加工システム、及びレーザ加工方法
US11581692B2 (en) 2019-06-18 2023-02-14 KLA Corp. Controlling pressure in a cavity of a light source
CN111215766A (zh) * 2019-12-26 2020-06-02 松山湖材料实验室 SiC晶片制造方法
CN111203640B (zh) * 2020-01-19 2020-11-20 南京航空航天大学 一种双激光束双侧同步焊接装置
US11958246B2 (en) * 2020-03-03 2024-04-16 Sciperio, Inc Laser oven with transparent chamber and external laser source
KR20230153460A (ko) * 2021-03-10 2023-11-06 어플라이드 머티어리얼스 이탈리아 에스.알.엘. 기판의 레이저 기계 가공을 위한 장치 및 방법

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US4027137A (en) * 1975-09-17 1977-05-31 International Business Machines Corporation Laser drilling nozzle
DE9013943U1 (zh) * 1990-10-06 1991-01-03 Trumpf Gmbh & Co, 7257 Ditzingen, De
US6215097B1 (en) 1994-12-22 2001-04-10 General Electric Company On the fly laser shock peening
JPH09192870A (ja) 1996-01-10 1997-07-29 Sumitomo Heavy Ind Ltd レーザ加工ヘッド、レーザ加工装置及びレーザ加工方法
US5674328A (en) 1996-04-26 1997-10-07 General Electric Company Dry tape covered laser shock peening
JPH1099978A (ja) * 1996-09-27 1998-04-21 Hitachi Ltd レーザー加工装置
US6580053B1 (en) 2000-08-31 2003-06-17 Sharp Laboratories Of America, Inc. Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films
JP4465954B2 (ja) 2002-10-31 2010-05-26 ソニー株式会社 透明導電膜を有する表示装置の製造方法
JP2004230458A (ja) 2003-01-31 2004-08-19 Fujitsu Hitachi Plasma Display Ltd レーザー加工装置
JP4205486B2 (ja) * 2003-05-16 2009-01-07 株式会社ディスコ レーザ加工装置
GB0412000D0 (en) 2004-05-28 2004-06-30 Cambridge Display Tech Ltd Apparatus and method for extracting debris during laser ablation
GB2414954B (en) 2004-06-11 2008-02-06 Exitech Ltd Process and apparatus for ablation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495529B (zh) * 2009-12-11 2015-08-11 Disco Corp Laser processing device
TWI561328B (en) * 2014-09-03 2016-12-11 Univ Nat Yunlin Sci & Tech Swirl jet flow auxiliary manufacturing device

Also Published As

Publication number Publication date
GB0617195D0 (en) 2006-10-11
JP2007237215A (ja) 2007-09-20
GB2435844A (en) 2007-09-12
GB2435844B (en) 2008-02-06
KR101299039B1 (ko) 2013-08-27
US8581140B2 (en) 2013-11-12
US20070210045A1 (en) 2007-09-13
TWI391200B (zh) 2013-04-01
KR20070092082A (ko) 2007-09-12
JP5165203B2 (ja) 2013-03-21
CN101032785A (zh) 2007-09-12

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Legal Events

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