TWI561328B - Swirl jet flow auxiliary manufacturing device - Google Patents
Swirl jet flow auxiliary manufacturing deviceInfo
- Publication number
- TWI561328B TWI561328B TW103130451A TW103130451A TWI561328B TW I561328 B TWI561328 B TW I561328B TW 103130451 A TW103130451 A TW 103130451A TW 103130451 A TW103130451 A TW 103130451A TW I561328 B TWI561328 B TW I561328B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing device
- jet flow
- flow auxiliary
- swirl jet
- auxiliary manufacturing
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103130451A TWI561328B (en) | 2014-09-03 | 2014-09-03 | Swirl jet flow auxiliary manufacturing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103130451A TWI561328B (en) | 2014-09-03 | 2014-09-03 | Swirl jet flow auxiliary manufacturing device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201609298A TW201609298A (en) | 2016-03-16 |
TWI561328B true TWI561328B (en) | 2016-12-11 |
Family
ID=56084974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103130451A TWI561328B (en) | 2014-09-03 | 2014-09-03 | Swirl jet flow auxiliary manufacturing device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI561328B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116727899B (en) * | 2023-07-12 | 2024-01-30 | 大辽激光科技(宁波)有限公司 | Device for laser deep small hole machining and laser rotary cutting machining dust removing method |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873413A (en) * | 1986-11-20 | 1989-10-10 | Nec Corporation | Method and apparatus for writing a line on a patterned substrate |
US5229081A (en) * | 1988-02-12 | 1993-07-20 | Regal Joint Co., Ltd. | Apparatus for semiconductor process including photo-excitation process |
TW498008B (en) * | 2000-08-22 | 2002-08-11 | Nippon Electric Co | Laser correction method and apparatus |
US20040226927A1 (en) * | 2003-05-16 | 2004-11-18 | Hiroshi Morikazu | Laser beam processing machine |
WO2005118210A1 (en) * | 2004-05-28 | 2005-12-15 | Cambridge Display Technology Limited | Apparatus and method using a gas vortex for extracting debris during laser ablation |
CN1986138A (en) * | 2005-12-22 | 2007-06-27 | 索尼株式会社 | Laser beam machining apparatus, its machining method, and mechanism and method for collecting debris |
TW200728011A (en) * | 2005-09-07 | 2007-08-01 | Disco Corp | Laser beam processing machine |
TW200734100A (en) * | 2006-03-07 | 2007-09-16 | Sony Corp | Laser processing apparatus, laser processing head and the laser processing method |
TW201021952A (en) * | 2008-12-04 | 2010-06-16 | Ind Tech Res Inst | Laser processing apparatus and method therefor |
-
2014
- 2014-09-03 TW TW103130451A patent/TWI561328B/en active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873413A (en) * | 1986-11-20 | 1989-10-10 | Nec Corporation | Method and apparatus for writing a line on a patterned substrate |
US5229081A (en) * | 1988-02-12 | 1993-07-20 | Regal Joint Co., Ltd. | Apparatus for semiconductor process including photo-excitation process |
TW498008B (en) * | 2000-08-22 | 2002-08-11 | Nippon Electric Co | Laser correction method and apparatus |
US20040226927A1 (en) * | 2003-05-16 | 2004-11-18 | Hiroshi Morikazu | Laser beam processing machine |
WO2005118210A1 (en) * | 2004-05-28 | 2005-12-15 | Cambridge Display Technology Limited | Apparatus and method using a gas vortex for extracting debris during laser ablation |
TW200728011A (en) * | 2005-09-07 | 2007-08-01 | Disco Corp | Laser beam processing machine |
CN1986138A (en) * | 2005-12-22 | 2007-06-27 | 索尼株式会社 | Laser beam machining apparatus, its machining method, and mechanism and method for collecting debris |
TW200734100A (en) * | 2006-03-07 | 2007-09-16 | Sony Corp | Laser processing apparatus, laser processing head and the laser processing method |
TW201021952A (en) * | 2008-12-04 | 2010-06-16 | Ind Tech Res Inst | Laser processing apparatus and method therefor |
Also Published As
Publication number | Publication date |
---|---|
TW201609298A (en) | 2016-03-16 |
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