TW200730453A - Apparatus for cutting substrate - Google Patents

Apparatus for cutting substrate

Info

Publication number
TW200730453A
TW200730453A TW095144548A TW95144548A TW200730453A TW 200730453 A TW200730453 A TW 200730453A TW 095144548 A TW095144548 A TW 095144548A TW 95144548 A TW95144548 A TW 95144548A TW 200730453 A TW200730453 A TW 200730453A
Authority
TW
Taiwan
Prior art keywords
substrate
cutting
infrared light
generating unit
concentrated manner
Prior art date
Application number
TW095144548A
Other languages
Chinese (zh)
Other versions
TWI326275B (en
Inventor
Young-Min Kim
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200730453A publication Critical patent/TW200730453A/en
Application granted granted Critical
Publication of TWI326275B publication Critical patent/TWI326275B/en

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Provided is an apparatus for cutting a substrate by irradiating infrared light on a substrate in a concentrated manner. The apparatus for cutting a substrate includes a heat generating unit for generating radiant heat, and a guide for guiding the radiant heat generated from the heat generating unit within a predetermined range of a substrate on which scribe lines are formed. Therefore, it is possible to readily cut the substrate by irradiating infrared light onto the scribe line formed on the substrate in a concentrated manner.
TW095144548A 2006-04-05 2006-11-30 Apparatus for cutting substrate TWI326275B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060030963A KR100797939B1 (en) 2006-04-05 2006-04-05 Apparatus for Cutting Substrate

Publications (2)

Publication Number Publication Date
TW200730453A true TW200730453A (en) 2007-08-16
TWI326275B TWI326275B (en) 2010-06-21

Family

ID=38059163

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144548A TWI326275B (en) 2006-04-05 2006-11-30 Apparatus for cutting substrate

Country Status (3)

Country Link
KR (1) KR100797939B1 (en)
CN (1) CN1952752B (en)
TW (1) TWI326275B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112388514A (en) * 2019-08-16 2021-02-23 公准精密工业股份有限公司 Water jet scalpel waste water collecting device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102749746B (en) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 Liquid crystal substrate cutting device and liquid crystal substrate cutting method
CN104678897B (en) * 2015-01-27 2017-10-27 合肥京东方光电科技有限公司 Supervising device and method, display base plate cutting and edging device
CN107234353B (en) * 2017-07-18 2019-10-15 广州南洋理工职业学院 Far red light cutter device
CN107831617B (en) * 2017-11-03 2021-04-27 合肥京东方光电科技有限公司 Cutting device and system for display panel

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498895B2 (en) * 1997-09-25 2004-02-23 シャープ株式会社 Substrate cutting method and display panel manufacturing method
KR100539971B1 (en) * 1998-08-26 2006-04-28 삼성전자주식회사 LCD glass cutting device, LCD glass cutting method and manufacturing method of large flat panel display device using the same
KR100768149B1 (en) * 2001-05-14 2007-10-17 삼성전자주식회사 Apparatus for cutting a substrate by using laser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112388514A (en) * 2019-08-16 2021-02-23 公准精密工业股份有限公司 Water jet scalpel waste water collecting device

Also Published As

Publication number Publication date
CN1952752B (en) 2010-05-19
TWI326275B (en) 2010-06-21
CN1952752A (en) 2007-04-25
KR20070099773A (en) 2007-10-10
KR100797939B1 (en) 2008-01-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees