TW200728219A - Laser cutting device and cutting method - Google Patents

Laser cutting device and cutting method

Info

Publication number
TW200728219A
TW200728219A TW096102134A TW96102134A TW200728219A TW 200728219 A TW200728219 A TW 200728219A TW 096102134 A TW096102134 A TW 096102134A TW 96102134 A TW96102134 A TW 96102134A TW 200728219 A TW200728219 A TW 200728219A
Authority
TW
Taiwan
Prior art keywords
cutting device
holding mechanism
cutting
laser
laser cutting
Prior art date
Application number
TW096102134A
Other languages
English (en)
Other versions
TWI336317B (zh
Inventor
Susumu Yahagi
Atsushi Ooe
Masakazu Hayashi
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200728219A publication Critical patent/TW200728219A/zh
Application granted granted Critical
Publication of TWI336317B publication Critical patent/TWI336317B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW096102134A 2006-01-20 2007-01-19 Laser cutting device and cutting method TW200728219A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006012349A JP4675786B2 (ja) 2006-01-20 2006-01-20 レーザー割断装置、割断方法

Publications (2)

Publication Number Publication Date
TW200728219A true TW200728219A (en) 2007-08-01
TWI336317B TWI336317B (zh) 2011-01-21

Family

ID=38284368

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102134A TW200728219A (en) 2006-01-20 2007-01-19 Laser cutting device and cutting method

Country Status (5)

Country Link
US (1) US20070169849A1 (zh)
JP (1) JP4675786B2 (zh)
KR (2) KR100892390B1 (zh)
CN (1) CN101003416B (zh)
TW (1) TW200728219A (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP2007246298A (ja) * 2006-03-13 2007-09-27 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
KR100786126B1 (ko) * 2007-08-14 2007-12-18 주식회사 아바코 비접촉 방식에 의한 피절단물의 평탄도를 유지하는스크라이브 헤드 장치 및 그 스크라이브 방법
JP4231538B1 (ja) * 2007-12-12 2009-03-04 株式会社片岡製作所 レーザ加工機
DE102008007632A1 (de) * 2008-02-04 2009-08-06 Limo Patentverwaltung Gmbh & Co. Kg Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks
US8656738B2 (en) * 2008-10-31 2014-02-25 Corning Incorporated Glass sheet separating device
JP2010229005A (ja) 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP5421687B2 (ja) * 2009-08-04 2014-02-19 三星ダイヤモンド工業株式会社 基板の分断方法および分断用テーブル
JP2011131229A (ja) * 2009-12-24 2011-07-07 Hitachi High-Technologies Corp レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法
JP5669001B2 (ja) * 2010-07-22 2015-02-12 日本電気硝子株式会社 ガラスフィルムの割断方法、ガラスロールの製造方法、及びガラスフィルムの割断装置
JP5696393B2 (ja) * 2010-08-02 2015-04-08 日本電気硝子株式会社 ガラスフィルムの割断方法
JP5194076B2 (ja) * 2010-08-27 2013-05-08 三星ダイヤモンド工業株式会社 レーザ割断装置
JP5202595B2 (ja) 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
JP5617556B2 (ja) * 2010-11-22 2014-11-05 日本電気硝子株式会社 帯状ガラスフィルム割断装置及び帯状ガラスフィルム割断方法
US9790121B2 (en) 2011-03-30 2017-10-17 Corning Incorporated Methods of fabricating a glass ribbon
JP5729604B2 (ja) * 2011-07-20 2015-06-03 株式会社レミ ガラス基板の加工装置
WO2013025741A1 (en) * 2011-08-18 2013-02-21 Corning Incorporated Methods of severing a glass ribbon
TWI586612B (zh) * 2011-11-18 2017-06-11 康寧公司 用於修整移動玻璃帶之設備及方法
JP5888176B2 (ja) * 2012-08-09 2016-03-16 日本電気硝子株式会社 強化ガラスの割断方法
JP6255595B2 (ja) * 2012-10-12 2018-01-10 株式会社Ihi 割断装置
DE102012219332B4 (de) * 2012-10-23 2014-11-13 Mdi Schott Advanced Processing Gmbh Vorrichtung und Verfahren zum Lagern und Fixieren einer Glasscheibe
US9216924B2 (en) * 2012-11-09 2015-12-22 Corning Incorporated Methods of processing a glass ribbon
JP6378696B2 (ja) * 2013-01-30 2018-08-22 コーニング インコーポレイテッド フレキシブルガラスの連続レーザ切断装置および方法
WO2016011114A1 (en) * 2014-07-18 2016-01-21 Corning Incorporated Methods and apparatus for controlled laser cutting of flexible glass
CN104646836A (zh) * 2015-02-05 2015-05-27 无为县环江铜业有限公司 一种大型片状废杂铜分解装置
DE102015104815A1 (de) * 2015-03-27 2016-09-29 Schott Ag Verfahren und Vorrichtung zum kontinuierlichen Trennen von Glas
KR102540639B1 (ko) * 2015-05-18 2023-06-07 코닝 인코포레이티드 감소된 기계적 응력을 갖는 가요성 유리 리본의 연속 가공
JP2017088467A (ja) * 2015-11-16 2017-05-25 旭硝子株式会社 ガラス基板に孔を形成する装置および方法
KR20180075707A (ko) * 2015-11-25 2018-07-04 코닝 인코포레이티드 유리 웹의 분리 방법들
CN106799665B (zh) * 2016-11-30 2018-08-28 田欣利 基于裂纹扩展效应的陶瓷切割-推磨复合式平面加工方法
WO2018193583A1 (ja) * 2017-04-20 2018-10-25 堺ディスプレイプロダクト株式会社 スクライブ装置及びスクライブ方法
CN108724488A (zh) * 2018-05-30 2018-11-02 苏州沃特维自动化系统有限公司 自动高速裂片装置
CN111230308B (zh) * 2020-02-14 2021-07-13 西京学院 一种3d打印模型激光抛光系统及其使用方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4351329A (en) * 1980-11-06 1982-09-28 Bear Medical Systems, Inc. High frequency breath pump
JP2700136B2 (ja) * 1994-06-02 1998-01-19 双栄通商株式会社 脆性材料の割断方法
JPH1071483A (ja) * 1996-08-29 1998-03-17 Hitachi Constr Mach Co Ltd 脆性材料の割断方法
JPH10116801A (ja) * 1996-10-09 1998-05-06 Rohm Co Ltd 基板分割方法及びその基板分割を用いた発光素子製造 方法
KR100300416B1 (ko) * 1999-01-18 2001-09-22 김순택 비금속 재료의 절단방법 및 그 장치
JP2004042423A (ja) * 2002-07-11 2004-02-12 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置

Also Published As

Publication number Publication date
KR20080056709A (ko) 2008-06-23
KR20070077115A (ko) 2007-07-25
CN101003416B (zh) 2012-07-11
JP4675786B2 (ja) 2011-04-27
JP2007191363A (ja) 2007-08-02
US20070169849A1 (en) 2007-07-26
KR100892390B1 (ko) 2009-04-10
TWI336317B (zh) 2011-01-21
CN101003416A (zh) 2007-07-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees