TW200723971A - Via hole having fine hole land and method for forming the same - Google Patents

Via hole having fine hole land and method for forming the same

Info

Publication number
TW200723971A
TW200723971A TW095125038A TW95125038A TW200723971A TW 200723971 A TW200723971 A TW 200723971A TW 095125038 A TW095125038 A TW 095125038A TW 95125038 A TW95125038 A TW 95125038A TW 200723971 A TW200723971 A TW 200723971A
Authority
TW
Taiwan
Prior art keywords
forming
via hole
same
hole
land
Prior art date
Application number
TW095125038A
Other languages
English (en)
Other versions
TWI331490B (en
Inventor
Chong-Ho Kim
Jong-Min Choi
Young-Hwan Shin
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW200723971A publication Critical patent/TW200723971A/zh
Application granted granted Critical
Publication of TWI331490B publication Critical patent/TWI331490B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09545—Plated through-holes or blind vias without lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
TW095125038A 2005-12-12 2006-07-10 Via hole having fine hole land and method for forming the same TWI331490B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050121752A KR100722625B1 (ko) 2005-12-12 2005-12-12 미소 홀랜드를 갖는 비아홀 및 그 형성 방법

Publications (2)

Publication Number Publication Date
TW200723971A true TW200723971A (en) 2007-06-16
TWI331490B TWI331490B (en) 2010-10-01

Family

ID=38138472

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125038A TWI331490B (en) 2005-12-12 2006-07-10 Via hole having fine hole land and method for forming the same

Country Status (4)

Country Link
US (2) US7629692B2 (zh)
JP (1) JP4314263B2 (zh)
KR (1) KR100722625B1 (zh)
TW (1) TWI331490B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8440916B2 (en) * 2007-06-28 2013-05-14 Intel Corporation Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
TWI471984B (zh) * 2008-05-23 2015-02-01 Advanced Semiconductor Eng 具有內埋式導電線路之電路板及其製造方法
US8114712B1 (en) * 2010-12-22 2012-02-14 General Electric Company Method for fabricating a semiconductor device package
CN106982522A (zh) * 2017-03-14 2017-07-25 开平依利安达电子第三有限公司 多网络通孔电路板及其制造方法
KR102309827B1 (ko) 2020-05-15 2021-10-12 주식회사 디에이피 다층 인쇄회로기판 제조 방법 및 이에 의해 제조된 다층 인쇄회로기판

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04286389A (ja) 1991-03-15 1992-10-12 Citizen Watch Co Ltd 回路基板の製造方法
JP2636537B2 (ja) * 1991-04-08 1997-07-30 日本電気株式会社 プリント配線板の製造方法
US5495665A (en) 1994-11-04 1996-03-05 International Business Machines Corporation Process for providing a landless via connection
JPH08186373A (ja) * 1994-12-28 1996-07-16 Nec Toyama Ltd プリント配線板の製造方法
JP2000151067A (ja) 1998-11-06 2000-05-30 Mitsui Mining & Smelting Co Ltd 新規なプリント配線板および多層プリント配線板の製造方法
CA2364571A1 (en) * 1999-03-15 2000-09-21 Merck & Co., Inc. Isoforms of mouse serotonin 5-ht2c receptor
JP3048360B1 (ja) 1999-04-06 2000-06-05 日東電工株式会社 両面プリント配線板およびその製造方法
US20020117753A1 (en) 2001-02-23 2002-08-29 Lee Michael G. Three dimensional packaging
US7485812B2 (en) 2002-06-27 2009-02-03 Ppg Industries Ohio, Inc. Single or multi-layer printed circuit board with improved via design
JP2004146668A (ja) 2002-10-25 2004-05-20 Sharp Corp 多層プリント配線板及びその製造方法
JP4113024B2 (ja) 2003-03-31 2008-07-02 三菱製紙株式会社 基板の製造方法
JP2005286296A (ja) 2004-03-03 2005-10-13 Mitsubishi Paper Mills Ltd 回路基板の製造方法
KR100632579B1 (ko) * 2004-04-07 2006-10-09 삼성전기주식회사 인쇄회로기판의 비아홀 형성방법
KR100632577B1 (ko) * 2004-05-03 2006-10-09 삼성전기주식회사 인쇄회로기판의 전해 금도금 방법

Also Published As

Publication number Publication date
US7629692B2 (en) 2009-12-08
JP2007165863A (ja) 2007-06-28
JP4314263B2 (ja) 2009-08-12
US20070132087A1 (en) 2007-06-14
US20080209722A1 (en) 2008-09-04
TWI331490B (en) 2010-10-01
KR100722625B1 (ko) 2007-05-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees