TW200722456A - Thermosetting resin composition and photosemiconductor encapsulation material - Google Patents

Thermosetting resin composition and photosemiconductor encapsulation material

Info

Publication number
TW200722456A
TW200722456A TW095138447A TW95138447A TW200722456A TW 200722456 A TW200722456 A TW 200722456A TW 095138447 A TW095138447 A TW 095138447A TW 95138447 A TW95138447 A TW 95138447A TW 200722456 A TW200722456 A TW 200722456A
Authority
TW
Taiwan
Prior art keywords
resin composition
thermosetting resin
independently
encapsulation material
integer
Prior art date
Application number
TW095138447A
Other languages
English (en)
Chinese (zh)
Other versions
TWI373485B (https=
Inventor
Hisanao Yamamoto
Takayuki Matsuda
Hideaki Takahashi
Original Assignee
Asahi Chemical Ind
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind, Asahi Kasei Chemicals Corp filed Critical Asahi Chemical Ind
Publication of TW200722456A publication Critical patent/TW200722456A/zh
Application granted granted Critical
Publication of TWI373485B publication Critical patent/TWI373485B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095138447A 2005-10-18 2006-10-18 Thermosetting resin composition and photosemiconductor encapsulation material TW200722456A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005303292 2005-10-18

Publications (2)

Publication Number Publication Date
TW200722456A true TW200722456A (en) 2007-06-16
TWI373485B TWI373485B (https=) 2012-10-01

Family

ID=37962492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138447A TW200722456A (en) 2005-10-18 2006-10-18 Thermosetting resin composition and photosemiconductor encapsulation material

Country Status (8)

Country Link
US (1) US7932319B2 (https=)
EP (2) EP2508545B1 (https=)
JP (1) JP4322949B2 (https=)
KR (1) KR101011421B1 (https=)
CN (1) CN101291973B (https=)
MY (1) MY145608A (https=)
TW (1) TW200722456A (https=)
WO (1) WO2007046399A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408174B (zh) * 2010-02-09 2013-09-11 Nanya Plastics Corp 應用在光學封裝及塗佈之環氧矽氧烷樹脂組成物
TWI466338B (zh) * 2011-12-16 2014-12-21 Advanced Optoelectronic Tech 發光二極體封裝方法
TWI677536B (zh) * 2017-08-16 2019-11-21 日商旭化成股份有限公司 矽醇組成物、硬化物、接著劑、使矽醇組成物硬化之方法

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WO2008133108A1 (ja) * 2007-04-17 2008-11-06 Asahi Kasei Chemicals Corporation エポキシシリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途
JP2009120437A (ja) 2007-11-14 2009-06-04 Niigata Univ シロキサンをグラフト化したシリカ及び高透明シリコーン組成物並びに該組成物で封止した発光半導体装置
WO2009072632A1 (ja) * 2007-12-07 2009-06-11 Jsr Corporation 硬化性組成物、光学素子コーティング用組成物、およびｌｅｄ封止用材料ならびにその製造方法
JP2009203475A (ja) * 2008-02-28 2009-09-10 Mitsubishi Chemicals Corp 封止樹脂及びその製造方法
JP5139882B2 (ja) * 2008-05-08 2013-02-06 旭化成ケミカルズ株式会社 感光性樹脂組成物及びこれを用いた樹脂層付き基材の製造方法
JP5170765B2 (ja) * 2008-09-22 2013-03-27 日東電工株式会社 熱硬化性組成物及び光半導体装置
KR20110030014A (ko) * 2009-09-17 2011-03-23 주식회사 동진쎄미켐 발광다이오드의 밀봉 방법 및 이에 의해 밀봉된 발광다이오드
JP2011103440A (ja) * 2009-10-14 2011-05-26 Nitto Denko Corp 熱硬化型ダイボンドフィルム
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
TWI502004B (zh) * 2009-11-09 2015-10-01 Dow Corning 群集官能性聚有機矽氧烷之製法及其使用方法
JP2012041381A (ja) * 2010-08-12 2012-03-01 Asahi Kasei Chemicals Corp エポキシ変性シリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途
WO2012075573A1 (en) * 2010-12-09 2012-06-14 Queen's University At Kingston Thermoset lonomer derivatives of halogenated polymers
CN103459469B (zh) * 2011-03-30 2015-09-09 旭化成化学株式会社 有机聚硅氧烷、其制造方法和含有有机聚硅氧烷的固化性树脂组合物
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物
JP6065514B2 (ja) * 2012-10-18 2017-01-25 日本化成株式会社 シリコーン樹脂組成物、シリコーン樹脂成形品、半導体発光素子用封止材及び半導体発光装置
CN104968748B (zh) 2013-02-11 2017-03-29 道康宁公司 烷氧基官能化有机聚硅氧烷树脂和聚合物及其相关形成方法
CN105189685B (zh) 2013-02-11 2017-08-08 道康宁公司 用于形成导热热自由基固化有机硅组合物的方法
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
WO2014124362A1 (en) 2013-02-11 2014-08-14 Dow Corning Corporation Clustered functional polyorganosiloxanes, processes for forming same and methods for their use
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US9567442B2 (en) * 2013-03-29 2017-02-14 Idemitsu Kosan Co., Ltd. Polyorganosiloxane and polycarbonate-polyorganosiloxane copolymer
MY179938A (en) * 2013-05-08 2020-11-19 Asahi Kasei Chemicals Corp Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element
DE102013222003A1 (de) 2013-10-29 2015-04-30 Evonik Industries Ag Mittel für die Versiegelungen von Licht-emittierenden Dioden
WO2015066165A1 (en) * 2013-10-31 2015-05-07 Dow Corning Corporation Cross-linked composition and method of forming the same
JP6439616B2 (ja) * 2015-07-14 2018-12-19 信越化学工業株式会社 光半導体素子封止用熱硬化性エポキシ樹脂組成物及びそれを用いた光半導体装置
EP3196229B1 (en) 2015-11-05 2018-09-26 Dow Silicones Corporation Branched polyorganosiloxanes and related curable compositions, methods, uses and devices
KR102535446B1 (ko) * 2018-06-08 2023-05-22 엘켐 실리콘즈 상하이 컴퍼니 리미티드 경화성 실리콘 조성물
KR102861859B1 (ko) * 2018-12-21 2025-09-22 다우 실리콘즈 코포레이션 다작용성 유기실록산의 제조 방법 및 이를 함유하는 조성물
JP7172805B2 (ja) * 2019-04-02 2022-11-16 信越化学工業株式会社 付加硬化型シリコーン接着剤組成物
JP7390236B2 (ja) * 2020-03-31 2023-12-01 京セラ株式会社 異方導電性樹脂組成物、及びマイクロｌｅｄディスプレイ装置
EP4172243A1 (en) * 2020-06-24 2023-05-03 Dow Silicones Corporation Methods for making polyfunctional organosiloxanes and compositions containing same
EP4172228B1 (en) * 2020-06-24 2024-03-13 Dow Silicones Corporation Composition, silicone polyether surfactant formed therefrom, and related methods and articles

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KR100949448B1 (ko) * 2002-05-01 2010-03-29 다우 코닝 코포레이션 바스 수명이 연장된 조성물
JP4088697B2 (ja) * 2002-11-05 2008-05-21 旭化成株式会社 変性ポリシロキサン及びそれを用いた硬化性樹脂組成物
JP4721625B2 (ja) 2003-01-29 2011-07-13 旭化成ケミカルズ株式会社 発光ダイオード
JP4301905B2 (ja) 2003-09-17 2009-07-22 スタンレー電気株式会社 熱硬化性樹脂組成物、該熱硬化性樹脂組成物で発光素子を封止した発光ダイオードおよび色変換型発光ダイオード
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408174B (zh) * 2010-02-09 2013-09-11 Nanya Plastics Corp 應用在光學封裝及塗佈之環氧矽氧烷樹脂組成物
TWI466338B (zh) * 2011-12-16 2014-12-21 Advanced Optoelectronic Tech 發光二極體封裝方法
TWI677536B (zh) * 2017-08-16 2019-11-21 日商旭化成股份有限公司 矽醇組成物、硬化物、接著劑、使矽醇組成物硬化之方法

Also Published As

Publication number Publication date
JP4322949B2 (ja) 2009-09-02
MY145608A (en) 2012-03-15
EP1947128A4 (en) 2012-01-04
CN101291973A (zh) 2008-10-22
KR20080056305A (ko) 2008-06-20
JPWO2007046399A1 (ja) 2009-04-23
TWI373485B (https=) 2012-10-01
US20090258992A1 (en) 2009-10-15
EP1947128A1 (en) 2008-07-23
EP2508545A1 (en) 2012-10-10
WO2007046399A1 (ja) 2007-04-26
CN101291973B (zh) 2012-10-17
EP2508545B1 (en) 2014-06-18
EP1947128B1 (en) 2013-10-09
US7932319B2 (en) 2011-04-26
KR101011421B1 (ko) 2011-01-28

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